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UV conductive silver paste formula and preparation method thereof

A technology of conductive silver paste and formula, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., and can solve the problems of conductive paste falling off, conductive circuit scrapping, and uneven volatilization of organic carrier solvents, etc. problems, to achieve the effect of strong adhesion, good environmental protection, and superior electrical conductivity

Inactive Publication Date: 2017-11-28
长沙小新新能源科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a UV conductive silver paste formula and its preparation method to solve the technical problem that the organic carrier solvent is not uniformly volatilized, and eventually the conductive paste falls off from the carrier, and the conductive circuit is scrapped.

Method used

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  • UV conductive silver paste formula and preparation method thereof

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Effect test

Embodiment 1

[0022] A UV conductive silver paste formula, comprising the following raw materials in parts by weight: 5 parts of diethylene glycol ether acetate, 8 parts of dimethyl nylon acid, 3 parts of white paste, 1.2 parts of polyethylene glycol, 5.5 parts of citric acid, 1.1 parts of ethyl cellulose, 8.8 parts of vinyl neodecanoate, 9 parts of epoxy resin, 10 parts of polyester acrylate, 3 parts of modified polysiloxane, 2 parts of polyethylene oxide, 0.5 parts of photoinitiator, modified 30 parts of silver powder;

[0023] For the modified silver powder, take 1.2 parts of KH-560 in parts by weight, add water 1.2 times its weight and stir evenly, then add concentrated hydrochloric acid to adjust the pH value to 4, then add 30 parts of nano-silver powder and mix evenly, mix The solution was ultrasonically dispersed in a constant temperature water bath at 40°C for 15 minutes while being mechanically stirred, then 1 part of titanium dioxide was added, stirred for 15 minutes, filtered, an...

Embodiment 2

[0030] A UV conductive silver paste formula, comprising the following raw materials in parts by weight: 7 parts of diethylene glycol ethyl ether acetate, 10 parts of dimethyl nylon acid, 5 parts of white paste, 2.2 parts of polyethylene glycol, 6.5 parts of citric acid , 2.3 parts of ethyl cellulose, 10.5 parts of vinyl neodecanoate, 11 parts of epoxy resin, 15 parts of polyester acrylate, 5 parts of modified polysiloxane, 3 parts of polyethylene oxide, 1.5 parts of photoinitiator, 40 parts of modified silver powder;

[0031] The modified silver powder, according to parts by weight, takes 2.4 parts of KH-560, adds 1.2 times its weight of water and stirs evenly, then adds concentrated hydrochloric acid to adjust the pH value to 5, then adds 40 parts of nano-silver powder and mixes evenly, mixes The solution was ultrasonically dispersed in a constant temperature water bath at 45°C for 15-20min while being mechanically stirred, then 1.5 parts of titanium dioxide was added, stirre...

Embodiment 3

[0038] A UV conductive silver paste formula, comprising the following raw materials in parts by weight: 6 parts of diethylene glycol ethyl ether acetate, 9 parts of dimethyl nylon acid, 4 parts of white paste, 1.7 parts of polyethylene glycol, 6 parts of citric acid , 1.8 parts of ethyl cellulose, 9.5 parts of vinyl neodecanoate, 10 parts of epoxy resin, 13 parts of polyester acrylate, 4 parts of modified polysiloxane, 2.5 parts of polyethylene oxide, 1 part of photoinitiator, 35 parts of modified silver powder;

[0039] Described modified silver powder, take 1.8 parts of KH-560 in parts by weight, add water 1.2 times its weight and stir evenly, then add concentrated hydrochloric acid to adjust the pH value to 4.5, then add 35 parts of nano-silver powder and mix evenly, mix The solution was ultrasonically dispersed in a constant temperature water bath at 42°C for 18 minutes while being mechanically stirred, then 1.3 parts of titanium dioxide was added, stirred for 15 minutes, ...

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Abstract

The invention provides a UV conductive silver paste formula and a preparation method thereof, which relate to the technical field of electronic chemical coatings. The UV conductive silver paste of the invention is prepared with organic carrier solvent, modified silver powder and modified glass powder as main materials and other additives as auxiliary materials. The UV conductive silver paste has the characteristics of strong adhesion of carrier, superior conductivity, good flexibility, good environmental protection property and excellent rheological property, and can be widely applied to chips, touch screens, tablet computers, digital cameras and other printed circuits.

Description

technical field [0001] The invention relates to the technical field of electronic chemical coatings, in particular to a UV conductive silver paste formula and a preparation method thereof. Background technique [0002] With the rapid development of electronic information technology, electronic equipment is constantly moving towards the direction of miniaturization, intelligence, environmental protection and low cost, prompting people to continuously research, develop and apply more advanced and cheap electronic circuit boards, electronic components and other manufacturing technology. Fully printed electronic technology is a new type of electronic product manufacturing technology. It uses the advantages of printing to organically integrate electronic equipment from component manufacturing, circuit production to component packaging, so as to manufacture high-quality products more efficiently and environmentally friendly. High-performance, low-cost electronic products have ver...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 不公告发明人
Owner 长沙小新新能源科技有限公司
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