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Preparation method of conductive adhesive with high thermal conductivity and used for high-power LED package

A technology of LED packaging and high thermal conductivity, applied in the direction of conductive adhesives, adhesives, adhesive additives, etc., can solve the problems of poor electrical conductivity, low thermal conductivity of adhesives, high bonding strength, etc., and achieve good compatibility , low cost, excellent electrical conductivity

Inactive Publication Date: 2017-12-26
YANTAI SEAYU NEW MATERIALS CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a method for preparing a high thermal conductivity conductive adhesive for high-power LED packaging. , resistant to 100°C high temperature, can greatly prolong the service life of high-power LED devices

Method used

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  • Preparation method of conductive adhesive with high thermal conductivity and used for high-power LED package

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Add 5 parts of 3,4-epoxy cyclohexyl carboxylate, 30 parts of bisphenol A epoxy resin, and 4 parts of core-shell toughening agent Kane Ace@MX-125 into the double planetary dynamic mixing kettle in turn, and start the revolution Stirring and high-speed dispersion, at a temperature of 25°C, stir for 1 hour, add 5 parts of self-made functionalized graphene material, stir for 1 hour, add 45.5 parts of conductive silver powder, stir for 30 minutes, add 10 parts of Adico latent curing agent EH-4360S , stirred for 1 hour, added 0.5 parts of fumed silica, stirred for 1 hour, turned on the vacuum pump to vacuum for 1 hour, and the vacuum pressure was 0.0988MPa, and the high thermal conductivity conductive adhesive for high-power LED packaging was obtained. The revolution stirring speed is 20r / min, high-speed dispersion speed is 800r / min.

[0041] The self-made functionalized graphene material is carried out according to the following steps:

[0042] 1) Preparation of flake graphen...

Embodiment 2

[0051] Add 5 parts of 3,4-epoxy cyclohexyl carboxylate, 30 parts of bisphenol A epoxy resin, and 4 parts of core-shell toughening agent Kane Ace@MX-125 into the double planetary dynamic mixing kettle in turn, and start the revolution Stirring and high-speed dispersion, at a temperature of 25°C, stir for 1 hour, add 6 parts of self-made functionalized graphene material, stir for 1 hour, add 44.5 parts of conductive silver powder, stir for 30 minutes, add 10 parts of Adico latent curing agent EH-4360S , stirred for 1 hour, added 0.5 parts of fumed silica, stirred for 1 hour, turned on the vacuum pump to evacuate for 1 hour, and the vacuum pressure was 0.0988 MPa to obtain a high thermal conductivity conductive adhesive for high-power LED packaging; the revolution stirring speed is 20r / min, high-speed dispersion speed is 800r / min.

[0052] The self-made functionalized graphene material is carried out according to the following steps:

[0053] 1) Preparation of flake graphene sol...

Embodiment 3

[0062] Add 5 parts of 3,4-epoxycyclohexyl carboxylate, 30 parts of bisphenol A epoxy resin, and 4 parts of core-shell toughening agent Kane Ace@MX-125 into the double planetary dynamic mixing kettle in sequence, and start Revolutionary stirring and high-speed dispersion, at a temperature of 25°C, stir for 1 hour, add 7 parts of self-made functionalized graphene material, stir for 1 hour, add 43.5 parts of conductive silver powder, stir for 30 minutes, add Adico latent curing agent EH-4360S 10 part, stirred for 1 hour, added 0.5 part of fumed silicon dioxide, stirred for 1 hour, turned on the vacuum pump to evacuate for 1 hour, and the vacuum pressure was 0.0988MPa, and the high thermal conductivity conductive adhesive used for high-power LED packaging was obtained; the revolution stirring speed The speed is 20r / min, and the high-speed dispersion speed is 800r / min.

[0063] The self-made functionalized graphene material is carried out according to the following steps:

[0064]...

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Abstract

The invention relates to a preparation method of conductive adhesive with high thermal conductivity and used for high-power LED package. The preparation method comprises the following steps: sequentially adding epoxy resin and a toughening agent into a double-planet power mixing kettle, starting revolution stirring and high-speed dispersion, at a certain temperature, stirring for 1h, adding a self-made functionalized graphene material and conductive silver powder, stirring for 1h, adding a latent curing agent, stirring for 1h, adding fumed silica, stirring for 1h, and maintaining for 1h at a certain pressure, thus obtaining the one-component conductive adhesive with high thermal conductivity. The conductive adhesive adopts a simple synthesis process, is low in cost and also has the characteristics of high strength, high temperature resistance, low shrinkage and excellent thermal conductivity and heat conductivity.

Description

technical field [0001] The invention relates to a preparation method of a high thermal conductivity conductive adhesive used for high-power LED packaging. Background technique [0002] In recent years, with the rise of the LED industry, LED semiconductor components have received more and more attention from people, and the requirements for energy saving, environmental protection and lifespan of LEDs have become higher and higher. At present, the life of LED devices on the market can only reach 20,000 to 30,000 hours, but if there is good heat conduction and convection cooling, the life of LED devices can theoretically reach 100,000 hours, so the low thermal conductivity and poor conductivity of the glue are serious. hampered the development of the industry. In order to improve the thermal and electrical conductivity of the adhesive system, expensive raw materials are often selected, resulting in an increase in production costs. [0003] In the high-power LED industry, the ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J9/02C09J11/04C09J11/08
CPCC08K2003/0806C08L2201/08C08L2203/206C09J9/02C09J11/04C09J11/08C09J163/00C08L63/00C08K9/04C08K3/04C08K3/08C08K3/36
Inventor 李娜李峰贺国新张利文
Owner YANTAI SEAYU NEW MATERIALS CORP LTD
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