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A silicon-based mems wafer multi-focus laser cutting system and cutting method

A laser cutting, multi-focus technology, used in laser welding equipment, welding/welding/cutting items, manufacturing tools, etc., can solve the problems of blade cutting and chipping, insufficient focal depth, and tipping, which is conducive to cutting, forming, design Unique, easy-to-use effects

Active Publication Date: 2019-10-25
成都莱普科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Blade cutting mainly has the following problems: 1. Blade cutting needs flushing, which is easy to cause damage to the moving structure; 2. The width of the scribing groove for blade cutting is wide, resulting in a limit to the effective utilization efficiency of the wafer; 3. Dust, particles, etc. will cause pollution; 4. The blade cutting has defects such as chipping and draping
Most of the existing laser stealth cutting equipment cuts based on one focal point. Since the focal depth is not enough, it is necessary to move the focal point at the same position to achieve a sufficient depth of the modified layer, which leads to problems such as low cutting efficiency and low cutting uniformity.

Method used

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  • A silicon-based mems wafer multi-focus laser cutting system and cutting method
  • A silicon-based mems wafer multi-focus laser cutting system and cutting method
  • A silicon-based mems wafer multi-focus laser cutting system and cutting method

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Example 1: as figure 1 , figure 2 , Figure 5 shown,

[0041] A silicon-based MEMS wafer multi-focus laser cutting system, comprising a laser 11, an optical system 12 and a sample displacement system 13;

[0042] The laser 11 is used to emit laser light to form a light source required by the laser annealing device;

[0043] Preferably, the laser 11 includes a solid-state laser, a fiber laser or a disk laser, the wavelength of the laser 11 is greater than 1300 nm, the pulse width is less than 100 nanoseconds, the power range is watt level, and the laser beam spatial mode is TEM00 mode.

[0044] like Figure 5 As shown, when the wavelength of the laser 11 is 1300nm-1500nm, the transmittance of this wavelength band is close to 60% in a 400-micron thick silicon material, which can greatly improve the cutting efficiency and facilitate the realization of the purpose of the system.

[0045] The optical system 12 is used to shape the laser light emitted by the laser 11 in...

Embodiment 2

[0058] Example 2: as Figures 1 to 4 shown,

[0059] A laser cutting method for a silicon-based MEMS wafer, comprising the following steps in sequence:

[0060] Step 1. Determine the cutting parameters: according to the parameters of the laser 11 and the parameters of the silicon-based MEMS wafer to be cut, determine the number of focal points, the spacing and the focal point diameter required for the separation of the single-cut wafer;

[0061] Step 2, configure the optical system 12: select the corresponding matching optical system 12 according to the parameters determined in step 1;

[0062] Step 3, clamping the silicon-based MEMS wafer to be cut: attach the silicon-based MEMS wafer to be cut on the surface of the organic blue film, and then place it on the surface of the clamping table 131;

[0063] Step 4, laser cutting: control the laser 11 to emit laser light to form the light source required for the laser cutting; the control displacement platform 132 drives the sili...

Embodiment 3

[0068] Example 3: as image 3 , Image 6 shown,

[0069] like image 3 As shown in the figure, the function of the optical system 12 is to form a multi-focus spot inside the wafer through the multi-focus element and the focusing system; at this time, there is no need to move the Z-axis of the sample displacement system, and the multi-focus spot is formed inside the wafer at one time to meet the depth requirements. Modified layer, the cutting efficiency is higher at this time.

[0070] like Image 6 As shown, the schematic diagram of the design principle of the multi-focus element of the present invention:

[0071] In the figure, the z-axis direction is the propagation direction of the laser optical axis, u, v are the planes perpendicular to the z-axis, X 1 , Y 1 , X 2 , Y 2 , X N , Y N respectively represent the planes where each focal position is perpendicular to the z-axis.

[0072] For an ordinary lens, it can be regarded as a simple phase modulation, and the pha...

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Abstract

The invention discloses a multi-focus laser cutting system for a silicon-base MEMS wafer and a cutting method, belonging to the fields of integrated circuits and micro-electro mechanical system Internet of Things sensors. The multi-focus laser cutting system comprises a laser device, an optical system and a sample displacement system, wherein the laser device is used for emitting laser so as to form a light source required by a laser annealing device; the optical system is used for shaping the laser emitted by the laser device into multi-focus light spots and focusing the multi-focus light spots into the silicon-base MEMS wafer; and the sample displacement system is used for placing the cut silicon-base MEMS wafer and adjusting the position of the silicon-base MEMS wafer. Compared with theprior art, the cutting method adopting the system has the advantages that the operation is flexible and convenient, and the technique is advanced; and the method has the characteristic that the silicon-base MEMS wafer can be cut and formed through once-through operation, the method is relatively convenient, and the efficiency is greatly increased.

Description

technical field [0001] The invention belongs to the field of integrated circuits and micro-electromechanical system Internet of Things sensors, and in particular relates to a silicon-based MEMS wafer laser cutting method. Background technique [0002] Micro-electromechanical systems (Micro-ElectroMechanical Systems, MEMS) include several parts such as micro-moving structures, micro-sensors, micro-actuators and supporting processing circuits. Its preparation technology is based on microelectronics technology, but because it involves micro mobile structures, it includes "micro cantilever beam", "micro suspended film", "micro cavity" and so on. Compared with the preparation of silicon-based integrated circuits, its preparation technology is more difficult, and has higher requirements on the reliability, stability and repeatability of the preparation process. [0003] In recent years, with the popularity of consumer electronics, especially smart phones, the demand for silicon-b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67B23K26/38B23K26/70B23K101/36
Inventor 黄永忠何刘王晓峰潘岭峰闻永祥王珏
Owner 成都莱普科技股份有限公司