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Modified block copolymer hydride with alkoxysilyl group and application thereof

A technology of block copolymers and hydrides, applied in photovoltaic power generation, electrical components, circuits, etc., can solve problems such as impact

Inactive Publication Date: 2018-01-05
ZEON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, even when the specific modified block copolymer hydrogenated product disclosed in Patent Document 4 is used as an encapsulating material, electronic components arranged at a position close to the edge of the bonded glass will suffer from high-temperature and high-humidity conditions. Also sometimes affected by moisture over time

Method used

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  • Modified block copolymer hydride with alkoxysilyl group and application thereof
  • Modified block copolymer hydride with alkoxysilyl group and application thereof
  • Modified block copolymer hydride with alkoxysilyl group and application thereof

Examples

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Embodiment

[0112] Hereinafter, although an Example and a comparative example demonstrate this invention in detail, this invention is not limited only to a following example. In addition, unless otherwise specified, "part" and "%" are based on mass.

[0113] Evaluations in the present examples and comparative examples were performed by the following methods.

[0114] (1) Weight average molecular weight (Mw) and molecular weight distribution (Mw / Mn)

[0115]The molecular weights of the block copolymer (C) and the hydrogenated block copolymer (D) were measured at 38° C. as standard polystyrene-equivalent values ​​of GPC using THF as an eluent. As a measuring device, HLC8020GPC (manufactured by TOSOH Corporation) was used.

[0116] (2) Hydrogenation rate

[0117] determination 1 The H-NMR spectrum was used to calculate the hydrogenation rate of the main chain, side chain and aromatic ring of the hydrogenated block copolymer (D).

[0118] (3) Evaluation of heat resistance

[0119] Using...

manufacture example 1

[0133] Manufacture of a sheet (G1) formed of an encapsulating material (F1) mainly composed of a modified block copolymer hydrogenated product (E1)

[0134] (Manufacture of hydrogenated block copolymer (D1))

[0135] Into a tank (tank) fully nitrogen-substituted inside, put 50 parts of styrene as an aromatic vinyl compound for introducing the structural unit (a) into the block copolymer (C1), and 50 parts of 4-methylstyrene as an aromatic vinyl compound for introducing the structural unit (ar) was uniformly mixed, and passed through a dehydration tower to prepare a dehydrated aromatic vinyl compound mixture (m1).

[0136] In a reactor with a stirring device and fully carried out nitrogen replacement inside, put 400 parts of dehydrated cyclohexane, 10 parts of a mixture (m1) of aromatic vinyl compounds and 0.475 parts of dibutyl ether, while While stirring at 60°C, 0.88 parts of n-butyllithium (15% cyclohexane solution) was added to initiate polymerization. Next, while stirri...

manufacture example 2

[0153] Manufacture of a sheet (G2) formed of an encapsulating material (F2) mainly composed of a modified block copolymer hydrogenated product (E2)

[0154] (Manufacture of hydrogenated block copolymer (D2))

[0155] The mixture of the aromatic vinyl compound was changed to a mixture (m2) of 74 parts of styrene, 16 parts of 4-methylstyrene, and 10 parts of 3-methylstyrene. The same procedure as in Production Example 1 was performed except that Polymerization, hydrogenation, concentration and drying, extrusion, cooling, and granulation were carried out to produce 95 parts of granules composed of a hydrogenated block copolymer (D2).

[0156] In the block copolymer (C2), which is the precursor of the hydrogenated block copolymer (D2), wA:wB=50:50, and the structural unit (ar) accounts for all the aromatic components in the polymer block (A). The mass ratio [w(ar) / w(a)] of the total amount of structural units (a) of the vinyl compound was 26%.

[0157] The obtained hydrogenated ...

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Abstract

The invention relates to a modified block copolymer hydride (E), which is formed through alkoxysilyl group modification conducted on a block copolymer hydride (D) formed by a hydrogenated block copolymer (C). The hydrogenated block copolymer (C) has more than two copolymer blocks (A) taking an aromatic vinyl compound structure unit as a main component and more than one copolymer block (B) taking achain conjugated diene compound structure unit as a main component. The mass fraction of the block (A) and the mass fraction of the block (B) in the copolymer (C) is set to be wA and wB respectively,wA:wB being 25:75-65:35. More than 20 by mass of the total weight of aromatic vinyl compound structure units contained in the entire block (A) includes one to two alkyl groups with 1-4 carbon numbersin an aromatic nucleus, the alkyl groups being taken as substituent groups. The block copolymer hydride (D) is formed through hydrogenation of more than 90% of the total weight of carbon-carbon unsaturate bonds of a main chain and a side chain and carbon-carbon unsaturate bonds of the aromatic nucleus.

Description

technical field [0001] The present invention relates to a novel modified hydrogenated block copolymer having an alkoxysilyl group, and an encapsulating material for electronic components and the like having improved water barrier properties using the modified hydrogenated block copolymer as a main component. Background technique [0002] Hydrogenated modified block copolymers having alkoxysilyl groups are known to be used in solar cell encapsulation materials, laminated glass interlayer films, and organic electroluminescent devices because of their excellent adhesion to glass surfaces and metal surfaces. Adhesives and packaging materials that require transparency, such as packaging materials, etc. (for example, refer to Patent Documents 1 to 4). [0003] Patent Document 4 discloses that when two glass plates are bonded together using a hydrogenated specific modified block copolymer having an alkoxysilyl group as an adhesive, the Epoxy resin-based adhesives and EVA-based adh...

Claims

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Application Information

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IPC IPC(8): C08F297/04C08F287/00C08F8/42C08F8/04C08L53/02H01L23/29H01L31/048
CPCY02E10/50
Inventor 栗原龙太小原祯二
Owner ZEON CORP
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