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Mercapto phosphonitrile compound, curing agent, and mercapto phosphonitrile epoxy resin

A technology of epoxy resin and mercaptophosphazene, applied in the field of flame retardant substances, can solve the problems of high cost, unfavorable popularization and the like, and achieve the effect of excellent flame retardancy

Inactive Publication Date: 2018-01-12
GUANGDONG GUANGSHAN NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These copper-clad laminates made of DOPO epoxy resin have good flame retardant properties, but there are many defects in adhesion, heat resistance, processability, etc., and are not suitable for the manufacture of high-layer, high-strength, etc. required by modern communications. Products with reliability, high adhesion and good processability
At the same time, due to the high cost, it is not conducive to popularization in the field of civilian products such as mobile phones and other low-cost consumer electronics

Method used

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  • Mercapto phosphonitrile compound, curing agent, and mercapto phosphonitrile epoxy resin
  • Mercapto phosphonitrile compound, curing agent, and mercapto phosphonitrile epoxy resin
  • Mercapto phosphonitrile compound, curing agent, and mercapto phosphonitrile epoxy resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0092] The structural formula of phosphazene compound is as follows:

[0093] Wherein, M is cyclotriphosphazene, and the cyclotriphosphazene is substituted by 1 phenylthio group, 3 bisphenol A groups and 2 mercaptoethylthio groups on average;

[0094] Put 1 mol of hexachlorocyclotriphosphorous cyanide, 250 ml of acetone, 1 mol of benzenethiol, 2 mol of ethanedithiol and 3 mol of bisphenol A into a three-port 2000ml glass reactor with a stirring device, and heat up to 60 while stirring and blowing nitrogen ℃, 620 g of 20% sodium hydroxide solution was added dropwise over 60 minutes, the temperature was kept at 60 ℃, and the reaction was stirred for 15 hours. After the reaction, the water in the system is removed by physical means, the insoluble matter in the system is removed by filtration, and the solvent in the system is distilled off to obtain a flame retardant compound. Name this target product A.

[0095] Performance Characterization:

[0096] 1 H NMR (CDCl 3 ,500MH...

Embodiment 2

[0100] The structural formula of phosphazene compound is as follows:

[0101] Among them, M is a cyclotriphosphazene, and the cyclotriphosphazene is substituted by two mercaptophenylthio groups, three bisphenol A groups and one 2,2-dimethylpropylthio group on average;

[0102] Put 1mol of hexachlorocyclotriphosphorcyanide, 250ml of acetone, 2mol of mercaptophenylmercaptan, 1mol of 2,2-dimethylpropanethiol and 3mol of bisphenol S into a three-port 2000ml glass reactor with stirring device, while stirring, While blowing nitrogen, raise the temperature to 60°C, add 400g of 20% sodium hydroxide solution dropwise over 60 minutes, keep the temperature at 60°C, and stir for 15 hours. After the reaction, the water in the system is removed by physical means, the insoluble matter in the system is removed by filtration, and the solvent in the system is distilled off to obtain a flame retardant compound. Name the target product B.

[0103] Performance Characterization:

[0104] 1 H ...

Embodiment 3

[0108] The structural formula of phosphazene compound is as follows:

[0109] Among them, M is cyclotetraphosphazene, and the cyclotetraphosphazene is covered with an average of 3 4 methyl-substituted bisphenol A groups and 1 2,2-dimethylpropylthio group;

[0110] Put 1mol of hexachlorocyclotriphosphine, 250ml of acetone, 1mol of 2,2-dimethylpropanethiol, 3mol and 4mol of methyl-substituted bisphenol S, while stirring, while blowing nitrogen, while raising the temperature to 60°C, 620g of 20% sodium hydroxide solution was added dropwise over 60min, and the temperature was kept at 60°C, and the reaction was stirred for 15 hours. After the reaction, the water in the system is removed by physical means, the insoluble matter in the system is removed by filtration, and the solvent in the system is distilled off to obtain a flame retardant compound. Name the target product C.

[0111] Performance Characterization:

[0112] 1 H NMR (CDCl 3 ,500MHz): 6.7~6.85, 7.05~7.13 (hyd...

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Abstract

The invention discloses a mercapto phosphonitrile compound, a curing agent, and a mercapto phosphonitrile epoxy resin. The sulfur containing reactive phosphonitrile compound has a molecular structurerepresented by the formula I. The flame retardant compound has a good flame retardant performance and is economic and environmentally friendly. The cured compound has excellent heatproof property, waterproof property, caking property, mechanical properties, and electrical performance. Moreover, the phosphonitrile compound can be applied to a composite metal substrate and a circuit board to improvethe flame retardant performance of the composite metal substrate and the circuit board. At the same time, the phosphonitrile compound is economic and environmentally friendly.

Description

technical field [0001] The invention relates to the technical field of flame retardant substances, in particular to mercaptophosphazene compounds, curing agents and mercaptophosphazene epoxy resins. Background technique [0002] Electronic products such as mobile phones, computers, cameras, and video game consoles, household and office electrical products such as air conditioners, refrigerators, TV images, audio products, and various products used in other fields, all need to have different degrees of flame retardancy for safety. [0003] The traditional technology generally adopts adding inorganic flame retardant substances such as aluminum hydroxide hydrate, magnesium hydroxide hydrate and other metal hydroxides containing crystal water to the material system, and adding brominated bisphenol A, brominated bisphenol A, brominated The method of organic flame retardant substances with relatively high halogen content such as bisphenol A epoxy resin can make the product meet th...

Claims

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Application Information

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IPC IPC(8): C08G59/66C08G59/40C08L63/00C07F9/6593C07F9/6581C07F9/535
Inventor 潘庆崇
Owner GUANGDONG GUANGSHAN NEW MATERIALS CO LTD
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