Slot-nanometer flower composite capillary core structure and fabrication method thereof

Abstract

The invention discloses a slot-nanometer flower composite capillary core structure and a fabrication method thereof. In a composite-structure capillary core, a slot structure is arranged on a copper-based surface, and a micro nanometer flower-shaped copper oxide layer is grown on a surface of a slot. The preparation of the composite-structure capillary core comprises the steps of performing linearcutting on a copper surface, and fabricating the slot structure on the copper surface; placing the copper surface after linear cutting in acetone and dilute sulphuric acid for ultrasonic washing to remove impurity and an oxide on the copper surface; placing the copper surface in an oxidization agent, and performing reaction at 50-80 DEG C for 30-90 minutes; and fully cleaning the copper surface with deionized water, and performing reaction at 150-200 DEG C for 18-36 hours to generate uniform and micro nanometer flower-shaped copper oxide. With the slot-nanometer flower composite-structure capillary core fabricated by the method, the backflowing capillary force of a working medium can be effectively improved, the wetting area is expanded, relatively many nucleate boiling activate holes areprovided, and nucleate boiling heat exchange is improved; and when the slot-nanometer flower composite-structure capillary core is applied to a flat heat pipe, the flowing and heat exchange characteristic of the working medium can be substantially improved, and the performance of the flat heat pipe is improved.

Description

technical field [0001] The invention relates to a flat heat pipe composite capillary core microstructure suitable for thermal control of electronic equipment, in particular to a channel-nano flower composite capillary core structure capable of improving the heat exchange performance of a flat heat pipe, belonging to the technical field of heat transfer. Background technique [0002] The heat dissipation of electronic devices with high heat flux has become a prominent problem that limits their reliability and energy conversion efficiency. Therefore, it is urgent to find a new generation of high-efficiency phase-change heat technology. Thanks to the high heat transfer capacity, flat heat pipes are considered to be an important means to solve the thermal management of electronic equipment with high heat flux density. Studies have shown that the heat transfer of flat heat pipes can be effectively enhanced by means of working fluid modification, capillary core improvement, and ex...

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Problems solved by technology

[0003] The main forms of the capillary core structure of traditional flat heat pipes are channels, wire mesh and sintered powder. The above structures are all single structures, and their characteristic sizes range from tens of microns to hundreds of microns. Under the heat flux, the evaporation area is prone to drying up, which limits the heat transfer performance and leads to the early arrival of the heat transfer limit of the flat heat pipe

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