Preparation method of organosilicone adhesive

A technology of organic silica gel and adhesive, applied in the direction of adhesives, adhesive additives, epoxy resin glue, etc., can solve the problems of harsh production conditions, complicated production process, low production efficiency, etc., achieve high production efficiency, short preparation time, The effect of saving production time

Inactive Publication Date: 2018-02-09
FUDAN UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In these production processes, there are generally some technical defects, such as: harsh production conditions, complicated production process, long production time, low production efficiency, etc.

Method used

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  • Preparation method of organosilicone adhesive
  • Preparation method of organosilicone adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Preparation component A: weighed in parts by weight: 15 parts of epoxy resin compound o-cresol formaldehyde type polyepoxy resin, 10 parts of terminal vinylmethylphenyl polysiloxane of 900 cps, polyallyl compound 3 parts of ethylene glycol diallyl ether; add the weighed epoxy resin compound, 900cps terminal vinyl methyl phenyl polysiloxane and polyallyl compound into the first material cylinder of the mixer in sequence , start the mixer and stir for 30 minutes; the mixture obtained through stirring is filtered out from the first material tank through a 300-mesh filter screen at normal pressure, and enters the second material tank; the mixture filtered out at normal pressure is filled to obtain the composition Part A.

[0019] Preparation of component B: 25 parts by weight of 900 cps-terminated vinylmethylphenyl polysiloxane, 5 parts of liquid nitrile rubber as a toughening agent, 20 parts of terminal-group hydrogen-containing polysiloxane, containing platinum Catalyst:...

Embodiment 2

[0022] Preparation of component A: take by weight 16 parts of epoxy resin compound bisphenol A type epoxy resin, 20 parts of terminal vinylmethylphenyl polysiloxane of 1000cps, polyallyl compound butanediol 4 parts of diallyl ether; Add the epoxy resin compound, 1000cps terminal vinylmethylphenyl polysiloxane and polyallyl compound into the first material tank of the mixer in sequence, start the mixer Stir for 20 minutes; filter the stirred mixture from the first material tank through a 400-mesh filter at normal pressure, and enter the second material tank; fill the mixture filtered out at normal pressure to obtain component A.

[0023] Preparation of component B: 20 ​​parts by weight of 1000 cps-terminated vinylmethylphenyl polysiloxane, 5 parts of toughening agent carboxyl liquid nitrile rubber, 23 parts of terminal-group hydrogen-containing polysiloxane, containing Platinum catalyst chloroplatinic acid tetramethyltetravinylcyclotetrasiloxane complex 0.015 parts; weighed 100...

Embodiment 3

[0026] Preparation of component A: Weigh 14 parts of epoxy resin compound polybutadiene resin, 15 parts of terminal vinylmethylphenyl polysiloxane of 800 cps, polyallyl compound hexadiol diene in parts by weight 2 parts of propyl ether; Add the weighed epoxy resin compound, 800cps terminal vinylmethylphenyl polysiloxane and polyallyl compound into the first material tank of the mixer in turn, start the mixer to stir 20 minutes; the mixture obtained by stirring is filtered out from the first material tank through a 400-mesh filter screen under normal pressure, and then enters the second material tank; the mixture filtered out under normal pressure is filled to obtain component A.

[0027] Preparation of component B: Weigh 25 parts by weight of 800 cps-terminated vinylmethylphenyl polysiloxane, 4 parts of toughening agent liquid silicone rubber, 25 parts of terminal-group hydrogen-containing polysiloxane and platinum-containing catalyst 0.016 part of chloroplatinic acid tetramet...

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Abstract

The invention discloses a preparation method of an organosilicone adhesive. The preparation method comprises following steps: preparation of component A, preparation of component B, mixing of the component A with the component B, and solidification. In the steps of preparation of the component A and the component B, raw materials are introduced into a first material tank for mixing and stirring, preparation is carried out in an open system directly, and protection by certain inert gas or stirring under vacuum conditions is not needed; an obtained mixture is subjected to normal pressure filtering using a 300- to 400-mesh filter screen in the first material tank, and then is introduced into a second material tank, no high pressure extrusion is needed. Compared with conventional organosilicone adhesive preparation technology, the preparation method possesses following advantages: production conditions are simplified, production time is shortened, the organosilicone adhesive prepared via the preparation method is high in refractive index and light transmittance rate.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a method for preparing an organic silicone adhesive. Background technique [0002] So far, most of the traditional production processes of adhesives are completed in several stages such as high-speed dispersion, high-pressure extrusion, vacuum defoaming and extrusion filling in a vacuum mixer. In these production processes, there are generally some technical defects, such as: harsh production conditions, complicated production process, long production time, low production efficiency and so on. [0003] Along with the wide application of silicone adhesive in various industrial technology fields, its preparation process has also been paid attention to and researched. How to develop a kind of convenient, efficient, suitable for the silicone adhesive preparation technology of large-scale factory production is the problem demanding prompt solution. Contents of the inventi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J163/00C09J183/05C09J11/08
CPCC09J183/04C08L2201/10C08L2205/025C08L2205/035C09J11/08C08L83/04C08L63/00C08L9/02
Inventor 郭浩丁爱顺靳瑞文张彦斌顾广新严永良
Owner FUDAN UNIV
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