Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of high temperature resistant encapsulation adhesive for flip-chip COB and preparation method thereof

A technology of high temperature resistance and encapsulation adhesive, applied in adhesives, polymer adhesive additives, semiconductor devices, etc. Strong anti-yellowing and good compatibility

Active Publication Date: 2020-03-24
广州天宸高新材料有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the encapsulating silicone composition has good light transmittance and thermal shock resistance, the polymer composed of hydrogen-containing silicone oil, vinyl silicone oil and vinyl MQ resin is easy to crack at a high temperature of 250 ° C, and the stability is not stable. Good, it is difficult to meet the packaging requirements of flip-chip COB
[0004] The main problems of existing flip-chip COB packaging adhesives include: (1) poor high temperature resistance: when the temperature exceeds 250°C, the packaging adhesive is easy to harden and crack; (2) poor reliability: the packaging adhesive is easy to yellow at high temperatures , thus affecting the light efficiency and color temperature of the LED

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of high temperature resistant encapsulation adhesive for flip-chip COB and preparation method thereof
  • A kind of high temperature resistant encapsulation adhesive for flip-chip COB and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Example 1 Preparation of Lanthanum Metal Complex

[0034] The preparation method of the lanthanum metal complex comprises: adding 0.2212g lanthanum acetate and 30ml methanol in a three-neck flask (water bath) equipped with a constant pressure dropping funnel, stirring rapidly for 0.5h, slowly adding 0.3216g dicarboxysilane oil dropwise, Stir at 25 °C for 10 h. Rotary steam at 65°C under normal pressure to remove methanol until there is no boiling matter, add 30ml of ether and stir thoroughly, then filter with suction, and spin at 35°C until there is no boiling matter, and the lanthanum metal complex is obtained. The structural formula is:

[0035] Where M is a lanthanide transition metal, R is -(CmH 2 m)-, m is an integer of 3-10; n is an integer of 5-30.

Embodiment 2

[0036] Example 2 High temperature resistant encapsulant for flip-chip COB

[0037] High-temperature-resistant encapsulant for flip-chip COB, including components A and B of equal mass; component A includes the following raw materials in parts by mass: 100 parts of vinyl silicone oil, 0.15 parts of platinum catalyst, 4 parts of tackifier, 1 part of thermal agent; component B includes the following raw materials in parts by mass: 60 parts of vinyl MQ silicone resin, 45 parts of crosslinking agent, and 0.05 parts of inhibitor. The vinyl content in vinyl silicone oil is 0.4%, the viscosity is 10000mPa·s, the M / Q of vinyl MQ silicone resin is 0.8, the vinyl content is 2.4%, and the platinum series catalyst is chloroplatinic acid-tetramethyldiethylene base disiloxane complex, the content of platinum is 4000ppm, the tackifier is γ-methacryloxypropyltrimethoxysilane, and the heat resistant agent is the lanthanum metal complex prepared in Example 1, The crosslinking agent is terminal ...

Embodiment 3

[0042] Example 3 High temperature resistant encapsulant for flip-chip COB

[0043] High-temperature-resistant encapsulant for flip-chip COB, including components A and B of equal mass; component A includes the following raw materials in parts by mass: 95 parts of vinyl silicone oil, 0.12 parts of platinum catalyst, 3 parts of tackifier, 0.8 parts of thermal agent; component B includes the following raw materials in parts by mass: 55 parts of vinyl MQ silicone resin, 44 parts of crosslinking agent, and 0.4 parts of inhibitor. The vinyl content in vinyl silicone oil is 0.3%, the viscosity is 20000mPa·s, the M / Q of vinyl MQ silicone resin is 0.8, the vinyl content is 2.4%, the platinum series catalyst is the alcohol solution of chloroplatinic acid, platinum The content is 5000ppm, the tackifier is vinyltrimethoxysilane, the heat-resistant agent is the lanthanum metal complex prepared in Example 1, the crosslinking agent is hydrogen-containing silicone oil at the terminal, and the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
viscosityaaaaaaaaaa
viscosityaaaaaaaaaa
viscosityaaaaaaaaaa
Login to View More

Abstract

The invention provides a high-temperature resistant sealant for inverted COBs (chip on board) and belongs to the technical field of LED package sealants. The high-temperature resistant sealant comprises a component A and a component B which are equal in mass, wherein the component A comprises, by weight, 90-110 parts of vinyl silicone oil, 0.1-0.5 part of platinum group catalysts, 1-5 parts of a thickening agent and 0.1-2 parts of a heat resistant agent; the component B comprises, by weight, 50-80 parts of MQ-type vinyl silicone resin, 30-60 parts of a crosslinking agent and 0.01-0.05 part ofan inhibitor. The high-temperature resistant sealant is good in performance and cannot crack even under the high temperature of 280DEG C for a long term, and meanwhile, good light transmittance is sustained.

Description

technical field [0001] The invention belongs to the technical field of LED encapsulation glue, and in particular relates to a high-temperature-resistant encapsulation glue for flip-chip COB and a preparation method thereof. Background technique [0002] With the increasing maturity of Chip On Board (COB) light source technology, the market puts forward higher requirements for COB light source. Flip-chip COB has become a new direction for COB light sources because it can withstand higher driving current without gold wires, has higher optical density, and can simplify the process and structure. Due to the increase of optical density, higher requirements are put forward for the performance of cracking resistance and yellowing resistance of flip-chip COB encapsulant under high temperature. The heat-resistant temperature of ordinary silicone encapsulants in the air is generally around 230°C. When the temperature exceeds 250°C, it will quickly become brittle and shatter. [0003...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/08H01L33/56
CPCC08L2201/08C08L2203/206C08L2205/025C08L2205/035C09J11/08C09J183/04H01L33/56C08L83/04C08L83/06
Inventor 邱浩孟戴思维梁光岳王坤
Owner 广州天宸高新材料有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com