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Preparation process of polycrystalline silicon slices

A preparation process and technology for polycrystalline silicon wafers, which are used in manufacturing tools, work accessories, stone processing equipment, etc., can solve problems such as complex production processes, polycrystalline silicon purity does not meet requirements, and long production cycles, reducing production processes and environmental risks. Small, the effect of increasing productivity

Inactive Publication Date: 2018-02-27
四川永祥硅材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main problems in the current production process of polysilicon wafers are that the production process is relatively complicated, the production cycle is long, and the purity of polysilicon cannot meet the requirements

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A polycrystalline silicon chip preparation process, comprising the following steps:

[0031] (1) Ingot casting: put polysilicon raw materials into G7 gas-cooled, water-cooled semi-dissolving high-efficiency ingot casting furnace, so that polysilicon raw materials can grow into polysilicon ingots;

[0032] (2) Square cutting: use diamond wire squarer to cut polycrystalline small square rods into small square rods, the cutting speed is 1.1~1.5mm / min, the size of small square rods is 156.75×156.75mm, and each cut is 49 small square rods. Square stick;

[0033] (3) Processing of small square rods: The small square rods cut into squares are rolled to make the diameter of the four corners reach 220±0.5mm. The diameter of the grinding wheel is processed in sequence.

[0034] (4) Viscose: Make 3 small square sticks of different lengths into a group, so that the total length of each group is the same, put each group of small square sticks together and mark them, and mark the s...

Embodiment 2

[0042] A polycrystalline silicon chip preparation process, comprising the following steps:

[0043] (1) Ingot casting: put polysilicon raw materials into G7 gas-cooled, water-cooled semi-dissolving high-efficiency ingot casting furnace, so that polysilicon raw materials can grow into polysilicon ingots;

[0044] (2) Square cutting: Cut the polysilicon ingot into small square bars with a diamond wire squarer, the cutting speed is 1.1-1.5mm / min, the size of the small square bars is 156.75×156.75mm, and 49 small square bars are cut each time;

[0045] (3) Processing of small square rods: The small square rods cut into squares are rolled to make the diameter of the four corners reach 220±0.5mm. The diameter of the grinding wheel is processed in sequence.

[0046] (4) Viscose: Make 3 small square sticks of different lengths into a group, so that the total length of each group is the same, put each group of small square sticks together and mark them, and mark the specified sandblas...

Embodiment 3

[0054] A polycrystalline silicon chip preparation process, comprising the following steps:

[0055] (1) Ingot casting: put polysilicon raw materials into G7 gas-cooled, water-cooled semi-dissolving high-efficiency ingot casting furnace, so that polysilicon raw materials can grow into polysilicon ingots;

[0056] (2) Square cutting: Cut the polysilicon ingot into small square bars with a diamond wire squarer, the cutting speed is 1.1-1.5mm / min, the size of the small square bars is 156.75×156.75mm, and 49 small square bars are cut each time;

[0057] (3) Processing of small square rods: The small square rods cut into squares are rolled to make the diameter of the four corners reach 220±0.5mm. The diameter of the grinding wheel is processed in sequence.

[0058] (4) Viscose: Make 3 small square sticks of different lengths into a group, so that the total length of each group is the same, put each group of small square sticks together and mark them, and mark the specified sandblas...

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PUM

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Abstract

The invention discloses a preparation process of polycrystalline silicon slices. The preparation process comprises the following steps of 1, ingot casting, wherein a polycrystalline silicon raw material is put into an ingot casting furnace, so that the polycrystalline silicon raw material grows into a polycrystalline silicon ingot; 2, square cutting, wherein polycrystalline small square rods are cut into small square rods through a diamond wire square forming machine; 3, silicon block machining, wherein chamfering and surface grinding are conducted on the small square rods obtained after cutting; 4, gluing, wherein firstly, a resin plate is glued to a crystal carrier, and then, the small square rods are glued to the resin plate; 5, slicing, wherein the small square rods obtained after gluing are sliced through a diamond wire slicing machine; 6, glue removal; 7, silicon slice machining, wherein polishing is conducted on silicon slices obtained after glue removal, and then, corrosion isconducted on the surfaces of the silicon slices; 8, insertion slice cleaning, wherein the machined silicon slices are put into a slice basket, and then, cleaning is conducted; and 9, heat treatment, wherein heat treatment is conducted on the silicon slices which are cleaned thoroughly so that influence of heat donors in crystals on the electrical resistivity can be eliminated. By means of the preparation process, quality of the silicon slices can be guaranteed, and production efficiency can be improved.

Description

technical field [0001] The invention relates to the technical field of polycrystalline silicon wafer production technology, in particular to a polycrystalline silicon wafer preparation process. Background technique [0002] Polycrystalline silicon is the main raw material for the manufacture of semiconductor devices and solar cells, and can also be used to prepare monocrystalline silicon. Its deep-processed products are widely used in the semiconductor industry as basic materials for devices such as artificial intelligence, automatic control, information processing, and photoelectric conversion. At the same time, due to the energy crisis and the call for a low-carbon economy, the world is actively developing and utilizing renewable energy. Solar energy has attracted the most attention among renewable energy sources due to its cleanness, safety, and abundant resources. One way to harness solar energy is by converting it into electricity through the photovoltaic effect. Sili...

Claims

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Application Information

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IPC IPC(8): B28D5/00B28D5/04B28D7/00B08B3/12B24B9/06
CPCB28D5/00B08B3/12B24B9/065B28D5/0058B28D5/045
Inventor 李斌付家云赵军胡小海李书森胡瑾曾霞
Owner 四川永祥硅材料有限公司