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Method for preparing anti-oxidation conductive glue

A conductive adhesive and anti-oxidation technology, which is applied in the direction of epoxy resin adhesive, conductive adhesive, adhesive, etc., can solve the problems of high density of silver powder, electromigration, easy oxidation of copper powder at high temperature, etc., and achieve the improvement of oxidation resistance , not easily oxidized, high electrical conductivity and chemical stability

Inactive Publication Date: 2018-03-06
CHANGZHOU LANXU CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem mainly solved by the present invention is to provide a preparation method of an anti-oxidation conductive adhesive for the defects that the copper powder of the conductive particles in the conductive adhesive is easily oxidized at high temperature, and the density of the silver powder is large, which leads to easy precipitation and electromigration.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0025]In parts by weight, add 10 parts of copper sulfate pentahydrate, 20 parts of diethylene tetraacetic acid and 6 parts of potassium hydroxide into a beaker with 80 parts of deionized water, and stir for 30 minutes to obtain a complex copper sulfate solution. Add 4 parts of polyvinylpyrrolidone powder to the combined copper sulfate solution, heat up to 40°C, stir until the polyvinylpyrrolidone powder is completely dissolved and the copper sulfate solution is clear; add 4g of potassium borohydride and 8g of potassium hydroxide to 200mL of deionized water, stir Mix for 20 minutes to obtain a reducing solution. Use a dropping funnel to add the reducing solution to 800 mL of the above-mentioned copper sulfate solution at a rate of 10 mL / min to obtain a reaction solution; place the reaction solution in an ultrasonic reactor, and control the ultrasonic reaction of the ultrasonic reactor. The frequency is 25kHz, ultrasonic reaction is 3h, and the reaction product is obtained. The r...

example 2

[0027] In parts by weight, add 11 parts of copper sulfate pentahydrate, 23 parts of diethylene tetraacetic acid and 8 parts of potassium hydroxide into a beaker with 85 parts of deionized water, and stir for 32 minutes to obtain a complex copper sulfate solution. Add 4 parts of polyvinylpyrrolidone powder to the combined copper sulfate solution, heat up to 45°C, stir until the polyvinylpyrrolidone powder is completely dissolved and the copper sulfate solution is clear; add 4.5g of potassium borohydride and 9g of potassium hydroxide to 215mL of deionized water, Stir and mix for 23min to obtain a reduction solution, use a dropping funnel with a dropping rate of 13mL / min, add the reduction solution to 850mL of the above-mentioned copper sulfate solution to obtain a reaction solution; place the reaction solution in an ultrasonic reactor, and control the temperature of the ultrasonic reactor. The ultrasonic frequency is 28kHz, the ultrasonic reaction is 3.5h, and the reaction produc...

example 3

[0029] In parts by weight, 12 parts of copper sulfate pentahydrate, 25 parts of diethylene tetraacetic acid and 10 parts of potassium hydroxide were added into a beaker containing 90 parts of deionized water, and stirred for 35 minutes to obtain a complex copper sulfate solution. Add 5 parts of polyvinylpyrrolidone powder to the combined copper sulfate solution, heat up to 50°C, stir until the polyvinylpyrrolidone powder is completely dissolved and the copper sulfate solution is clear; add 5g of potassium borohydride and 10g of potassium hydroxide to 230mL of deionized water, stir Mix for 25 minutes to obtain a reducing solution. Use a dropping funnel to add the reducing solution to 900 mL of the above-mentioned copper sulfate solution at a rate of 15 mL / min to obtain a reaction solution; place the reaction solution in an ultrasonic reactor, and control the ultrasonic reaction of the ultrasonic reactor. The frequency is 30kHz, ultrasonic reaction is 4h, and the reaction product...

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Abstract

The invention relates to the technical field of electronic product preparation and particularly relates to a method for preparing anti-oxidation conductive glue. The method comprises preparing a copper sulfate solution and a reducing solution, blending the two solutions to obtain a reaction solution, treating the reaction solution to obtain ultrafine copper powder, dispersing the ultrafine copperpowder in deionized water, blending the ultrafine copper powder and a silver ammonia solution for a reaction, treating the reaction product to obtain silver-coated copper powder, adding the silver-coated copper powder and polyurethane granules into diluted hot-melt epoxy resin, and adding diethylenetriamine and tributyl phosphate into the diluted hot-melt epoxy resin to obtain the anti-oxidation conductive glue. Silver on the copper powder surfaces has high electrical conductivity and chemical stability. The potential difference between copper ions and silver can prevent silver from falling off because of electrochemical corrosion and improve oxidation resistance of the conductive glue. Through use of polyurethane in the epoxy resin, the brittleness of the conductive glue is well improved,silver-coated copper powder precipitation under gravity is prevented and the electro-migration caused by precipitation of conductive particles in the conductive glue is prevented. The method has a wide application prospect.

Description

technical field [0001] The invention relates to the technical field of electronic product preparation, in particular to a method for preparing an anti-oxidation conductive adhesive. Background technique [0002] Conductive adhesive is an adhesive with certain conductivity after curing or drying. It usually uses matrix resin and conductive particles as the main components. Through the bonding effect of matrix resin, the conductive particles are combined to form a conductive path. Conductive connection of adhered materials. Since the matrix resin of the conductive adhesive is an adhesive, a suitable curing temperature can be selected for bonding. At the same time, due to the miniaturization and miniaturization of electronic components and the rapid development of high density and high integration of printed circuit boards, The conductive adhesive can be made into a paste to achieve high line resolution. At present, conductive adhesives have been widely used in the packaging ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J175/04C09J11/06C09J11/04C09J9/02
CPCC08K2003/0806C08K2003/085C08L2201/08C09J9/02C09J11/04C09J11/06C09J163/00C08L75/04C08K9/10C08K3/08C08K5/521C08K5/17
Inventor 阳绪容何少雄张建初
Owner CHANGZHOU LANXU CHEM CO LTD
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