High-binding-force graphite film metal composite material and preparation method thereof

A metal composite material, graphite film technology, applied in metal layer products, chemical instruments and methods, electronic equipment and other directions, can solve the problem that the operation process is not easy to control, the composite layer material preparation method is complicated, and the graphite film and the metal layer are insufficient. and other problems, to achieve the effects of excellent electromagnetic shielding performance, favorable adhesion, low surface flatness and compactness

Active Publication Date: 2018-03-16
CHONGQING YUNTIANHUA HIGH END NEW MATERIALS DEV CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problems to be solved are: the preparation method of the existing composite layer material is complex, the operation process is not easy to control, and the bonding force between the obtained graphite film and the metal layer is insufficient

Method used

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  • High-binding-force graphite film metal composite material and preparation method thereof
  • High-binding-force graphite film metal composite material and preparation method thereof
  • High-binding-force graphite film metal composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation Embodiment 1

[0039] The temperature of the polyimide film is gradually raised to 1100°C-1400°C at -0.1MPa to obtain a carbonized film; then in an inert gas environment, the temperature of the carbonized film is gradually raised to 2600°C-3000°C to obtain a graphite film, and the prepared graphite The thickness of the film is 70 μm; the copper powder is evenly sprayed on the graphite film, the particle size of the copper powder is 10-30nm; and placed in a high-temperature furnace, at -0.2Pa, the temperature is raised to 1100 °C at 10 °C / min and kept 5min, then gradually cooled to room temperature at a rate of 0.6°C / min; take it out and carry out calendering treatment to obtain a graphite film with a copper metal transition layer, the thickness of the metal transition layer is 20nm; the surface of the metal transition layer is subjected to pickling and activation treatment, Then it is immersed in the electroless copper plating solution, and it is immersed for 30min at room temperature; after ...

preparation Embodiment 2

[0041] The temperature of the polyimide film is gradually raised to 1100°C-1400°C at -0.1MPa to obtain a carbonized film; then in an inert gas environment, the temperature of the carbonized film is gradually raised to 2600°C-3000°C to obtain a graphite film, and the prepared graphite The thickness of the film is 20μm; after mixing the copper powder and silver powder with a mass ratio of 4:1, evenly spray on the graphite film, the average particle size of the copper powder and silver powder is 50nm; and put it in a high temperature furnace, at -0.3Pa temperature at 8.5°C / min to 1050°C, hold for 5min, and then gradually cool to room temperature at a rate of 0.8°C / min; take it out and perform calendering treatment to obtain a graphite film with a copper-silver transition layer, the thickness of the metal transition layer is 50nm; after pickling and activating the surface of the metal transition layer, electroplating a silver metal layer on the surface; and coating the metal antiox...

preparation Embodiment 3

[0043]The temperature of the polyimide film is gradually raised to 1100°C-1400°C at -0.1MPa to obtain a carbonized film; then in an inert gas environment, the temperature of the carbonized film is gradually raised to 2600°C-3000°C to obtain a graphite film, and the prepared graphite The thickness of the film is 30 μm; after mixing the copper powder and silver powder at a mass ratio of 1:1, evenly spray on the graphite film, the average particle size of the copper powder and silver powder is 70nm; , heat up to 1000°C at 5°C / min, keep for 20min, and then gradually cool to room temperature at a rate of 0.7°C / min; take it out and carry out calendering treatment to obtain a graphite film with a copper-silver transition layer, the thickness of the metal transition layer is 30nm; after the surface of the metal transition layer is pickled and activated, a silver metal layer is plated on the surface by vacuum plating; and a metal antioxidant is coated on the surface of the metal layer. ...

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Abstract

The invention relates to the technical field of graphite film metal composite material and discloses a high-binding-force graphite film metal composite material and a preparation method thereof. The high-binding-force graphite film metal composite material comprises a graphite layer, a metal transition layer and a surface metal layer. The graphite layer is a graphite film obtained only after carbonization and graphitization treatment. The preparation method comprises the following steps: preparing the graphite layer, preparing the metal transition layer through a melting method, carrying out calendaring and pickling, preparing the surface metal layer and carrying out anti-oxidation treatment in sequence. The high-binding-force graphite film metal composite material is convenient to prepare, is high in binding force between the graphite layer and the metal layer, and has excellent conductive performance and heat radiation performance.

Description

technical field [0001] The invention relates to the technical field of graphite film metal composite materials, in particular to a graphite film metal composite material with high binding force and a preparation method thereof. Background technique [0002] With the expansion and popularization of the application range of electronic and electrical equipment, the requirements for the performance and structure of electronic and electrical equipment are becoming more and more stringent, such as higher processing speed, smaller size, lighter weight, and higher power And better heat dissipation performance, etc., especially with the continuous expansion of the scale of new energy vehicles in recent years, the demand for fast charging and discharging equipment for automobiles has continued to increase, and higher requirements have been placed on the thermal conductivity and heat dissipation performance of materials. [0003] Traditional radiators have obvious limitations, especial...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K9/00B32B9/00B32B9/04B32B7/08B32B15/20B32B15/00B32B33/00B32B37/06B32B37/10B32B38/16
CPCB32B7/08B32B9/007B32B9/041B32B15/00B32B15/20B32B33/00B32B37/06B32B37/10B32B38/164B32B2255/06B32B2255/205B32B2307/212B32B2307/302B32B2307/714B32B2311/08B32B2311/12B32B2313/04B32B2457/00H05K7/2039H05K9/0088
Inventor 刘佩珍戴曛晔李鑫杜富贵李阳吕新坤
Owner CHONGQING YUNTIANHUA HIGH END NEW MATERIALS DEV CO LTD
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