Formula and production process of epoxy resin adhesive as well as application of epoxy resin adhesive in copper-clad plate for light-emitting diode (LED)

A technology of epoxy resin glue and epoxy resin, applied in the direction of epoxy resin glue, adhesive, layered products, etc., can solve the problem of insulation performance affecting the quality of LED display, poor insulation performance of copper clad laminate, damage to LED display, etc. problem, to achieve the effect of less impurities, good fluidity, and reduced energy waste

Inactive Publication Date: 2018-03-20
浙江元集新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] This double-sided aluminum-based copper-clad laminate sets the vias for the electrical connection of the upper and lower layers of the circuit on the circumferential side of the copper-clad laminate and exposes them to facilitate the preparation of via holes. However, when this double-sided aluminum-based copper-clad laminate is used for For LED display screens, because LED displays are mostly use

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042]A formula for epoxy resin glue, comprising the following parts by weight: epoxy resin: 268 parts; curing agent dicyandiamide: 2.4 parts; solvent dimethylformamide: 32 parts; magnesium hydroxide: 50 parts; Micropowder: 105 parts; coupling agent: 0.9 part; curing agent accelerator 2-methylimidazole: 0.13 part; coupling agent includes silane coupling agent. In addition, UV powder is also included, and the amount of UV powder added is 0.1%-0.2% of the total weight of the epoxy resin glue.

[0043] A production process for producing epoxy resin glue, comprising the following steps:

[0044] (I) Dissolving UV powder: Add UV powder and solvent into the dissolving tank, accelerate stirring until the speed gradually increases to 300 rpm, and stir for 1 hour until the UV powder is completely dissolved;

[0045] (II) Dissolving the curing agent: Add the curing agent into the dissolution tank, add the solvent, accelerate the stirring until the speed gradually increases to 300 rpm, ...

Embodiment 2

[0061] A formula for epoxy resin glue, comprising the following parts by weight: epoxy resin: 268 parts; curing agent dicyandiamide: 2.4 parts; solvent methyl isobutyl ketone: 32 parts; magnesium hydroxide: 50 parts; Micropowder: 105 parts; coupling agent: 0.9 part; curing agent accelerator 2-methylimidazole: 0.13 part; coupling agent includes silane coupling agent. In addition, UV powder is also included, and the amount of UV powder added is 0.1%-0.2% of the total weight of the epoxy resin glue.

Embodiment 3

[0063] A formula for epoxy resin glue, comprising the following parts by weight: epoxy resin: 268 parts; curing agent dicyandiamide: 2.4 parts; solvent DMI: 32 parts; magnesium hydroxide: 50 parts; silicon micropowder: 105 parts ; Coupling agent: 0.9 parts; Curing agent accelerator 2-methylimidazole: 0.13 parts; Coupling agent includes silane coupling agent. In addition, UV powder is also included, and the amount of UV powder added is 0.1%-0.2% of the total weight of the epoxy resin glue.

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Abstract

The invention discloses a formula and a production process of epoxy resin adhesive as well as application of the epoxy resin adhesive in a copper-clad plate for a light-emitting diode (LED), aiming atsolving the problems that the insulation performance of the copper-clad plate affects the quality of an LED screen, so thatand the LED screen is easily damaged if the insulation performance of the copper-clad plate is poor. The epoxy resin adhesive is characterized by being prepared from the following materials in parts by weight: 260-275 parts of epoxy resin, 2-3 parts of a curing agent, 25-35 parts of a solvent, 45-55 parts of magnesium hydroxide, 100-115 parts of silica powder, 0.1-1.5 parts of a coupling agent and 0.05-0.20 part of a curing agent accelerator, wherein the coupling agent isprepared from a silane coupling agent,sothat and;after the epoxy resin adhesive is used, the aim of enabling the insulation performance of the copper-clad plate to be better is achieved.

Description

technical field [0001] The invention relates to the technical field of polymer composite materials, more specifically, it relates to the formulation, production process and application of epoxy resin glue on copper-clad laminates for LEDs. Background technique [0002] Copper-clad laminate is a product made of wood pulp paper or glass fiber cloth as a reinforcing material, dipped in resin glue, covered with copper foil on one or both sides, and hot-pressed. The LED display is a flat panel display, which is composed of multiple small LED module panels, and is used to display various information such as text, images, videos, and video signals. [0003] At present, the Chinese patent with the publication number CN105128454A discloses a double-sided aluminum-based copper-clad laminate for LED lamps and its preparation method. layer, the first copper foil layer arranged on the first insulating layer and away from the aluminum base layer, the second copper foil layer arranged on ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/02C09J11/04C09J11/00C08G59/50C08G59/68B32B37/12
CPCB32B37/12B32B2037/1269C08G59/504C08G59/686C08K3/36C08K9/06C08K2003/2224C09J11/00C09J11/04C09J163/00
Inventor 丁红晖
Owner 浙江元集新材料有限公司
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