Formula and production process of epoxy resin adhesive as well as application of epoxy resin adhesive in copper-clad plate for light-emitting diode (LED)
A technology of epoxy resin glue and epoxy resin, applied in the direction of epoxy resin glue, adhesive, layered products, etc., can solve the problem of insulation performance affecting the quality of LED display, poor insulation performance of copper clad laminate, damage to LED display, etc. problem, to achieve the effect of less impurities, good fluidity, and reduced energy waste
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Embodiment 1
[0042]A formula for epoxy resin glue, comprising the following parts by weight: epoxy resin: 268 parts; curing agent dicyandiamide: 2.4 parts; solvent dimethylformamide: 32 parts; magnesium hydroxide: 50 parts; Micropowder: 105 parts; coupling agent: 0.9 part; curing agent accelerator 2-methylimidazole: 0.13 part; coupling agent includes silane coupling agent. In addition, UV powder is also included, and the amount of UV powder added is 0.1%-0.2% of the total weight of the epoxy resin glue.
[0043] A production process for producing epoxy resin glue, comprising the following steps:
[0044] (I) Dissolving UV powder: Add UV powder and solvent into the dissolving tank, accelerate stirring until the speed gradually increases to 300 rpm, and stir for 1 hour until the UV powder is completely dissolved;
[0045] (II) Dissolving the curing agent: Add the curing agent into the dissolution tank, add the solvent, accelerate the stirring until the speed gradually increases to 300 rpm, ...
Embodiment 2
[0061] A formula for epoxy resin glue, comprising the following parts by weight: epoxy resin: 268 parts; curing agent dicyandiamide: 2.4 parts; solvent methyl isobutyl ketone: 32 parts; magnesium hydroxide: 50 parts; Micropowder: 105 parts; coupling agent: 0.9 part; curing agent accelerator 2-methylimidazole: 0.13 part; coupling agent includes silane coupling agent. In addition, UV powder is also included, and the amount of UV powder added is 0.1%-0.2% of the total weight of the epoxy resin glue.
Embodiment 3
[0063] A formula for epoxy resin glue, comprising the following parts by weight: epoxy resin: 268 parts; curing agent dicyandiamide: 2.4 parts; solvent DMI: 32 parts; magnesium hydroxide: 50 parts; silicon micropowder: 105 parts ; Coupling agent: 0.9 parts; Curing agent accelerator 2-methylimidazole: 0.13 parts; Coupling agent includes silane coupling agent. In addition, UV powder is also included, and the amount of UV powder added is 0.1%-0.2% of the total weight of the epoxy resin glue.
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