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Ink-printed thermoelectric device and manufacturing method thereof

A technology of a thermoelectric device and a manufacturing method, which is applied to the manufacture/processing of thermoelectric devices, the material of the junction lead wire of the thermoelectric device, and the thermoelectric device only using the Peltier or Seebeck effect, etc., can solve the problems of expensive microwave sintering furnaces, etc. The effect of preparation cost, simplified preparation process, and excellent performance

Active Publication Date: 2020-02-21
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In particular, there are also reports of using dibutyl phthalate and polyvinyl butyral resin as adhesives at 200°C to 250°C, but terpineol is also required as a solvent, and expensive microwaves with power control are required. Sintering furnace

Method used

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  • Ink-printed thermoelectric device and manufacturing method thereof
  • Ink-printed thermoelectric device and manufacturing method thereof
  • Ink-printed thermoelectric device and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Step 1: Use Bi 2 Te 2.7 Se 0.3 As an N-type material, Bi 0.5 Sb 1.5 Te 3 As a P-type material, put it into a planetary ball mill for grinding powder, and pass through a 325-mesh sieve to obtain semiconductor powder.

[0046] Step 2: As a thermoelectric functional material and a commercial epoxy resin as a polymer matrix, the ratio of the epoxy resin curing agent is 0.85 based on the epoxy equivalent of the resin and the hydroxyl equivalent of the hardener, and polypropylene glycol with an average molecular weight of 380 The mass ratio of shrinkage, methyl hexahydrophthalic anhydride, 1-cyanoethyl-2-ethyl-4-methylimidazole and butyl glycidyl ether is 4.5:1.8:0.08:1, and the obtained epoxy The viscosity of the mixture is 10mPa·s.

[0047] Step 3: The volume ratio of the powder to the total system is 46.5%, and the particles are dispersed using a planetary mixer and an ultrasonic bath, with a revolution speed of 2000r min -1 , rotation speed 500r min -1 , stand sti...

Embodiment 2

[0051] Step 1: Use Bi 2 Te 3 As an N-type material, Sb 2 Te 3 As a P-type material, put it into a planetary ball mill for grinding powder, and pass through a 325-mesh sieve to obtain semiconductor powder.

[0052] Step 2: As a thermoelectric functional material and a commercial epoxy resin as a polymer matrix, the ratio of the epoxy resin curing agent is 0.85 based on the epoxy equivalent of the resin and the hydroxyl equivalent of the hardener, and polypropylene glycol with an average molecular weight of 640 The mass ratio of shrinkage, methyl hexahydrophthalic anhydride, 1-cyanoethyl-2-ethyl-4-methylimidazole and butyl glycidyl ether is 4.5:1.8:0.08:0.5, and the obtained epoxy The viscosity of the mixture is 10mPa·s.

[0053] Step 3: The volume ratio of the powder to the total system is 48%, and the particles are dispersed by a planetary mixer and an ultrasonic bath, and the speed of one revolution is 2000r min -1 , rotation speed 500r min -1 , stand still for 1min, an...

Embodiment 3

[0057] Step 1: Use a mixed element of Bi, Te, and Se as an N-type material, the mixed mass fraction is Bi (53.2%), Te (43.8%), and Se (3%), and a mixed element of Bi, Sb, and Te is used as a P Type material, the mixed mass fraction is Bi (15.6%), Sb (27.3%), Te (57.1%), put it into planetary ball mill for grinding powder, pass through 325 mesh sieve to get semiconductor powder.

[0058] Step 2: As a thermoelectric functional material and a commercial epoxy resin as a polymer matrix, the ratio of the epoxy resin curing agent is 0.85 based on the epoxy equivalent of the resin and the hydroxyl equivalent of the hardener, and polypropylene glycol with an average molecular weight of 380 The mass ratio of shrinkage, methyl hexahydrophthalic anhydride, 1-cyanoethyl-2-ethyl-4-methylimidazole and butyl glycidyl ether is 4.5:1.8:0.08:0.8, and the obtained epoxy The viscosity of the mixture is 15mPa·s.

[0059] Step 3: The volume ratio of the powder to the total system is 45%, and the p...

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Abstract

The invention discloses an ink-printed thermoelectric device and a manufacturing method thereof, which are low in cost, simple in method and convenient for large-scale production. The ink-printed thermoelectric device includes P and N-type film thermoelectric legs printed with ink and printed base material, wherein the ink contains epoxy resin mixture matrix and thermoelectric semiconductor material powder. The method of the present invention mainly includes configuring an epoxy resin mixture matrix, mixing thermoelectric semiconductor powder to make thermoelectric semiconductor ink, then printing the ink onto the base material, and finally drying and curing to obtain a thermoelectric device. The device can be used in power supplies for ultra-low power requirements, thermal pipe monitoring sensor power supplies, long-life miniature radioisotope thermoelectric generators, wireless sensor network power supplies, and thermoelectric coolers.

Description

Technical field: [0001] The invention relates to an ink-printed thermoelectric device and a manufacturing method thereof, which belongs to the synthesis scheme of composite ink composed of thermoelectric semiconductor and resin. Background technique: [0002] Industrial waste heat and hollow pipes or thermal columns with hot fluids release large amounts of heat into the environment. A large portion of this heat is lost and wasted to the environment. This heat or thermal fluid is transported in thermal columns and pipes and is used for many industrial exhausts or residential heating. This cylindrical heat source has different thicknesses and scenes, such as motor vehicle exhaust pipes, HVAC pipes, and isotope heat sources, but the surface temperature is very different from the room temperature. Using the temperature difference between its surface and room temperature, thermoelectric devices can use this temperature difference to generate electricity, and can play a role in ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L35/14H01L35/24H01L35/28H01L35/34H10N10/851H10N10/01H10N10/10H10N10/856
CPCH10N10/851H10N10/856H10N10/10H10N10/01
Inventor 汤晓斌袁子程刘云鹏刘凯李俊琴
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS