Novel inorganic environment-friendly film-stripping liquid
An environmentally friendly technology for stripping liquid, applied in the field of new inorganic environmental protection type stripping liquid, can solve problems such as increasing production cost, and achieve the effect of reducing processing difficulty, low COD value and complexing ability
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Embodiment 1
[0031] Embodiment 1, a new type of inorganic environmentally friendly film stripping liquid, including the following materials by weight, specifically:
[0033] Benzotriazole 0.5%;
[0034] Sodium hypophosphite 2%;
[0035] balance of water.
[0036] For the new inorganic environmentally friendly film stripping solution of the first embodiment, in the process of using it for stripping and stripping the circuit board, the circuit board after the pattern plating process is first treated at a temperature of 50 ° C. Under the conditions of soaking or spraying through the new inorganic environmental protection type film stripping solution of the first embodiment, the circuit board is cleaned with water after stripping treatment, and then drying treatment is performed, and finally the circuit board after drying is The board uses an X-Ray detector to detect the degree of corrosion of the tin layer at the fixed position, and to detect the COD value and...
Embodiment 2
[0038] Embodiment 2, a new type of inorganic environmentally friendly film stripping liquid, including the following materials by weight, specifically:
[0039] Potassium hydroxide 4%;
[0040] Benzotriazole 1%;
[0041] Sodium borohydride 1%;
[0042] balance of water.
[0043] Wherein, the use method of the new inorganic environment-friendly film stripping liquid of the second embodiment is the same as the use method of the new inorganic environment-friendly film stripping liquid of the first embodiment.
[0044] Through the above-mentioned material ratio, the new inorganic environment-friendly film stripping solution of the second embodiment can quickly peel off the dry film of the resist layer on the circuit board after pattern electroplating, and the etching to copper and tin is extremely low. The COD value and complexing capacity of the waste liquid generated after the membrane liquid is removed and used is low, which can effectively reduce the difficulty of processin...
Embodiment 3
[0045] Embodiment 3, a new type of inorganic environment-friendly film stripping liquid, including the following materials by weight, specifically:
[0046] Sodium hydroxide 5%;
[0047] Tolutriazole (TTA) 0.5%;
[0048] Benzotriazole 0.5%;
[0049] Dimethylamineborane 1%;
[0050] balance of water.
[0051] Wherein, the use method of the new inorganic environment-friendly film stripping liquid of the third embodiment is the same as the use method of the new inorganic environment-friendly film stripping liquid of the first embodiment.
[0052] Through the above-mentioned material ratio, the new inorganic environmental protection type film stripping solution of the third embodiment can quickly peel off the dry film of the resist layer on the circuit board after pattern electroplating, and the etching to copper and tin is extremely low. The COD value and complexing capacity of the waste liquid generated after the membrane liquid is removed and used is low, which can effectiv...
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