Novel inorganic environment-friendly film-stripping liquid

An environmentally friendly technology for stripping liquid, applied in the field of new inorganic environmental protection type stripping liquid, can solve problems such as increasing production cost, and achieve the effect of reducing processing difficulty, low COD value and complexing ability

Inactive Publication Date: 2018-04-13
DONGGUAN GUANGHUA CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] With the continuous improvement of the society's environmental protection requirements, the inorganic type stripping solution is gradually selected by manufacturers; however, the inorganic type stripping solution is more aggressive to the tin protective layer than the organic type stripping

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Embodiment 1, a new type of inorganic environmentally friendly film stripping liquid, including the following materials by weight, specifically:

[0032] Sodium hydroxide 3%;

[0033] Benzotriazole 0.5%;

[0034] Sodium hypophosphite 2%;

[0035] balance of water.

[0036] For the new inorganic environmentally friendly film stripping solution of the first embodiment, in the process of using it for stripping and stripping the circuit board, the circuit board after the pattern plating process is first treated at a temperature of 50 ° C. Under the conditions of soaking or spraying through the new inorganic environmental protection type film stripping solution of the first embodiment, the circuit board is cleaned with water after stripping treatment, and then drying treatment is performed, and finally the circuit board after drying is The board uses an X-Ray detector to detect the degree of corrosion of the tin layer at the fixed position, and to detect the COD value and...

Embodiment 2

[0038] Embodiment 2, a new type of inorganic environmentally friendly film stripping liquid, including the following materials by weight, specifically:

[0039] Potassium hydroxide 4%;

[0040] Benzotriazole 1%;

[0041] Sodium borohydride 1%;

[0042] balance of water.

[0043] Wherein, the use method of the new inorganic environment-friendly film stripping liquid of the second embodiment is the same as the use method of the new inorganic environment-friendly film stripping liquid of the first embodiment.

[0044] Through the above-mentioned material ratio, the new inorganic environment-friendly film stripping solution of the second embodiment can quickly peel off the dry film of the resist layer on the circuit board after pattern electroplating, and the etching to copper and tin is extremely low. The COD value and complexing capacity of the waste liquid generated after the membrane liquid is removed and used is low, which can effectively reduce the difficulty of processin...

Embodiment 3

[0045] Embodiment 3, a new type of inorganic environment-friendly film stripping liquid, including the following materials by weight, specifically:

[0046] Sodium hydroxide 5%;

[0047] Tolutriazole (TTA) 0.5%;

[0048] Benzotriazole 0.5%;

[0049] Dimethylamineborane 1%;

[0050] balance of water.

[0051] Wherein, the use method of the new inorganic environment-friendly film stripping liquid of the third embodiment is the same as the use method of the new inorganic environment-friendly film stripping liquid of the first embodiment.

[0052] Through the above-mentioned material ratio, the new inorganic environmental protection type film stripping solution of the third embodiment can quickly peel off the dry film of the resist layer on the circuit board after pattern electroplating, and the etching to copper and tin is extremely low. The COD value and complexing capacity of the waste liquid generated after the membrane liquid is removed and used is low, which can effectiv...

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PUM

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Abstract

The invention discloses a novel inorganic environment-friendly film-stripping liquid, which comprises the following materials in percentages by weight: 1-10% of an inorganic alkali compound, 0.01-5% of an azole compound, 1-5% of a tin-protecting deoxidizer, 0.05-1% of a film-stripping accelerator and the balance of water. Through the ratios of the materials, the novel inorganic environment-friendly film-stripping liquid is capable of quickly stripping a dry film of an anti-corrosion layer on a circuit board subjected to pattern plating, the etching rate on copper and tin is extremely low, anda waste liquid generated after film stripping through the novel inorganic environment-friendly film-stripping liquid is low in COD value and complexing capability, so that the treatment difficulty ofthe waste liquid can be effectively reduced and the easy-to-treat and easy-to-discharge standards are achieved.

Description

technical field [0001] The invention relates to a liquid used for removing dry film in a printed circuit board manufacturing circuit, in particular to a novel inorganic environment-friendly film removing liquid used in the process of pattern plating process printed circuit board. Background technique [0002] In the manufacturing process of the patterned electroplating process printed circuit board, the circuit board needs to be coated with a dry film (resist layer) after pretreatment, and then the pattern of the resist layer is formed through the exposure and development process, and then the copper circuit is formed by electroplating tin method. A tin protective layer is formed, and the copper covered by the dry film will not be covered with tin. Then, the dry film is peeled off by the stripping liquid to expose the unnecessary copper, and the unnecessary copper is etched by the alkaline etching liquid. The tin protective layer is removed with tin stripping liquid to form ...

Claims

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Application Information

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IPC IPC(8): G03F7/42
CPCG03F7/425
Inventor 赵志斌欧胜肖红星孙宝林
Owner DONGGUAN GUANGHUA CHEM
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