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A thermoplastic polyimide composition with low modulus and high bonding ability and its application and preparation method

A polyimide, polyimide layer technology, applied in chemical instruments and methods, adhesive types, conjugated diene adhesives, etc., can solve the problem of heat resistance, resistance to double-sided flexible copper clad laminate Solderability influence, glass transition temperature reduction, dimensional stability deterioration, etc., to achieve the effect of improving bonding ability, good compatibility and good compatibility

Active Publication Date: 2020-07-28
ZHEJIANG FORST NEW MATERIAL RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the lower glass transition temperature, the heat resistance and soldering resistance of double-sided flexible copper-clad laminates are inevitably affected, especially in double-sided flexible copper-clad laminates with thin PI layers, the impact is more obvious
At the same time, the lower glass transition temperature may also lead to poor dimensional stability

Method used

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  • A thermoplastic polyimide composition with low modulus and high bonding ability and its application and preparation method
  • A thermoplastic polyimide composition with low modulus and high bonding ability and its application and preparation method
  • A thermoplastic polyimide composition with low modulus and high bonding ability and its application and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] Under a nitrogen atmosphere, add 45.00 g of 2,2-bis[4-(4-aminophenoxy)phenyl]propane into 500 g of NMP solvent, stir until completely dissolved; then add 45.64 g of bis Phenol A type diether dianhydride and 6.45g of 3,3',4,4'-BPDA, then stirred for about 4h; then added 19.42g of nano-core-shell polymer, and then continued to stir for 20h to prepare thermoplastic polyimide The precursor solution of the amine composition has a solid content of 18.9 wt % and a viscosity of 6500 mPa·s. The added nano-core-shell polymer has a particle size of 100nm, the core is polybutadiene rubber, and the shell is a polymer obtained by copolymerization of styrene and styrene covalently linked to aliphatic amine end groups on the benzene ring, core and shell The weight ratio of m (core): m (shell) = 80:20.

Embodiment 2

[0062] Under nitrogen atmosphere, add 52.49g of 2,2-bis[4-(4-aminophenoxy)phenyl]propane into 500g of NMP solvent, stir until completely dissolved; then add 25.29g of bis Phenol A type diether dianhydride and 29.30g of 4,4'-terephthalic dioxydiphthalic anhydride, then stirred for about 4h; then added 21.41g of nano-core-shell polymer, and then continued to stir for 20h to prepare The precursor solution of the thermoplastic polyimide composition has a solid content of 20.4wt% and a viscosity of 5570mPa·s. The added nano-core-shell polymer has a particle size of 100nm, the core is polybutadiene rubber, and the shell is a polymer obtained by copolymerization of styrene and styrene covalently linked to aliphatic amine end groups on the benzene ring, core and shell The weight ratio of m (core): m (shell) = 60:40.

Embodiment 3

[0064] Under nitrogen atmosphere, add 40.54g of 2,2-bis[4-(4-aminophenoxy)phenyl]propane and 13.18g of 3,4'-ODA into 500g of NMP solvent, stir until completely dissolved ; Add 83.10g of bisphenol A type diether dianhydride in three batches, then stir for about 4h; add 54.73g of nano-core-shell polymer, and then continue to stir for 20h to prepare the thermoplastic polyimide composition. Body solution, its solid content is 27.7wt%, viscosity is 8400mPa·s. Added nano-core-shell polymer, the particle size is 200nm, the core is styrene-butadiene rubber, the shell is a polymer obtained by copolymerization of styrene and styrene covalently connected to the terminal group of aliphatic amine on the benzene ring, the weight of the core and the shell layer The ratio is m (core): m (shell) = 80:20.

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Abstract

The invention discloses a thermoplasticity polyimide compound with a low modulus and a high cementitiousness. The thermoplasticity polyimide compound is prepared from thermoplasticity polyimide and anano nucleocapsid polymer, the nano nucleocapsid polymer is of a hard shell / soft core structure, the particle size is 100-200 nm, the weight ratio of the core and a shell layer is m(core):m(shell) being equal to (80-60):(20-40), and the weight percentage in the compound is 1%-40%. Due to adding of the nano nucleocapsid polymer, the modulus of the thermoplasticity polyimide compound when the temperature is close to a glass transition temperature is decreased, the cementitiousness is improved, and the temperature needed by cementing is decreased. The invention discloses a double-faced flexible copper-clad plate prepared from the thermoplasticity polyimide compound at the same time. The double-faced flexible copper-clad plate is prepared from two layers of copper foils, two layers of thermoset polyimide and one layer of thermoplsaticity polyimide compound. Due to existence of the nano nucleocapsid polymer, the cementing strength is improved, the thermocompression bonding temperature is decreased, and the production cost is saved.

Description

technical field [0001] The invention relates to the technical field of thermoplastic polyimide (TPI) adhesives, in particular to a thermoplastic polyimide composition with low modulus and high bonding capacity and its application in double-sided flexible copper-clad laminates. The thermoplastic polyimide composition of the present invention and the corresponding double-sided flexible copper-clad laminate are suitable for flexible printed circuit boards for high-frequency transmission, adhesives for semiconductor elements, interlayer insulating films and bonding layers, and various In flexible circuit board products. Background technique [0002] Thermoplastic polyimide (TPI) adhesive is a kind of high-performance engineering material polyimide; it is widely used because of its inherent heat resistance, thermal oxidation resistance, chemical stability and excellent mechanical properties. Generally, its glass transition temperature (Tg) is below 300°C, so when it is heated ab...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C08L79/08C09J179/08C09J109/00C09J125/08C09J109/06B32B15/01B32B15/20B32B7/12B32B7/08B32B33/00
CPCB32B7/08B32B7/12B32B15/01B32B15/20B32B33/00B32B37/06B32B37/10B32B37/12B32B2037/1269C08L2201/08C08L2205/03C08L2207/53C09J179/08C08L9/00C08L25/08C08L9/06C08L83/04
Inventor 周慧翁建东童荣柏李奇琳周光大林建华
Owner ZHEJIANG FORST NEW MATERIAL RES INST CO LTD
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