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A kind of preparation method of molybdenum-tantalum alloy sputtering target for flat panel display

A flat-panel display and sputtering target technology, which is applied in sputtering coating, metal material coating process, vacuum evaporation coating, etc., can solve the problem of large deformation of the target body, low product qualification rate, and powder purity. Limitation and other issues, to achieve the effect of less cost investment, excellent comprehensive performance, and guaranteed purity

Active Publication Date: 2019-10-15
LUOYANG SIFON ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The invention is prepared by hot isostatic pressing method, which can obtain fine and uniform grain size and improve the strength and toughness, but the target body has a large amount of deformation during the processing process, the product qualification rate is low, and the cost is high , and the invention does not limit the purity of the powder, and does not perform vacuum treatment on the powder, etc., the produced target contains more impurities and has a lower purity

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A method for preparing a molybdenum-tantalum alloy sputtering target for a flat panel display, comprising the steps of:

[0034] 1) Powder selection: screen molybdenum powder and tantalum powder with a purity greater than or equal to 99.95%, put the molybdenum powder and tantalum powder into a vacuum furnace for vacuum pre-burning treatment, the vacuum degree is less than or equal to 0.01MPa, and the temperature is 1100℃, the time is 1h;

[0035] 2) Powder mixing: After sieving the molybdenum powder and tantalum powder obtained in step 1) through 250 mesh, the Fischer particle size of the molybdenum powder is 3.0-3.5 μm, and the Fischer particle size of the tantalum powder is 3.0-3.5 μm. The final molybdenum powder and tantalum powder are mixed according to the weight ratio molybdenum powder: tantalum powder is 80:20, put into the ball mill, and fill into argon, the time of ball mill mixing is 12h, select molybdenum ball to carry out ball mill in the described ball mill, ...

Embodiment 2

[0043] A method for preparing a molybdenum-tantalum alloy sputtering target for a flat panel display, comprising the steps of:

[0044] 1) Powder selection: screen molybdenum powder and tantalum powder with a purity greater than or equal to 99.95%, put the molybdenum powder and tantalum powder into a vacuum furnace for vacuum pre-burning treatment, the vacuum degree is less than or equal to 0.01MPa, and the temperature is 1150℃, the time is 1.5h;

[0045] 2) Powder mixing: After sieving the molybdenum powder and tantalum powder obtained in step 1) through 250 mesh, the Fischer particle size of the molybdenum powder is 3.0-3.5 μm, and the Fischer particle size of the tantalum powder is 3.0-3.5 μm. The final molybdenum powder and tantalum powder are mixed according to the weight ratio molybdenum powder: tantalum powder is 82:18, put into the ball mill, and fill into argon, the time of ball mill mixing is 15h, select molybdenum ball to carry out ball mill in the described ball mi...

Embodiment 3

[0053] A method for preparing a molybdenum-tantalum alloy sputtering target for a flat panel display, comprising the steps of:

[0054] 1) Powder selection: screen molybdenum powder and tantalum powder with a purity greater than or equal to 99.95%, put the molybdenum powder and tantalum powder into a vacuum furnace for vacuum pre-burning treatment, the vacuum degree is less than or equal to 0.01MPa, and the temperature is 1150℃, the time is 2h;

[0055] 2) Powder mixing: After sieving the molybdenum powder and tantalum powder obtained in step 1) through 250 mesh, the Fischer particle size of the molybdenum powder is 2.0-2.5 μm, and the Fischer particle size of the tantalum powder is 4.0-4.5 μm. The final molybdenum powder and tantalum powder are mixed according to the weight ratio molybdenum powder: tantalum powder is 84:16, put into the ball mill, and fill into argon, the time of ball mill mixing is 20h, select molybdenum ball to carry out ball mill in the described ball mill...

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Abstract

The invention discloses a preparing method of a molybdenum tantalum alloy sputtering target material for a plane displayer, and belongs to the technical field of sputtering target materials for planedisplayers. The method comprises following steps of 1, powder selecting; 2, powder mixing; 3, pressing forming; 4, sintering; 5, vacuum heat treatment; 6, rolling; 7, machining and 8 binding packaging. In the preparing process, pollutions are avoided, little resource waste is caused, the cost input is little, and the cost is reduced; in the molybdenum tantalum alloy preparing process, hydrogen absorption embrittlement is prevented, the target material machining performance is improved, the high-density molybdenum tantalum alloy sputtering target material is prepared, the purity of a molybdenumtantalum alloy is ensured, and the high-density molybdenum tantalum alloy target material with the uniform and refined grains can be prepared finally.

Description

technical field [0001] The invention relates to the technical field of sputtering targets for flat-panel displays, in particular to a method for preparing molybdenum-tantalum alloy sputtering targets for flat-panel displays. Background technique [0002] With the rapid development of the electronics and information industries, the demand for sputtering targets is increasing. Various types of sputtered thin film materials have been widely used in semiconductor integrated circuits, recording media, flat display and photovoltaic cells. Because molybdenum has a high melting point, high electrical conductivity, low specific impedance, good corrosion resistance and good environmental performance, molybdenum sputtering targets are widely used in electronic components and electronic products, such as the widely used TFT -LCD (Thin Film Transitor-Liquid Crystal Displays, thin film semiconductor tube-liquid crystal display), plasma display, thin film solar cells, sensors, semiconduct...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/34C22C1/04C22C27/04
Inventor 孙虎民张雪凤高建杰吕阳阳
Owner LUOYANG SIFON ELECTRONICS