Solder paste scaling powder

A flux and solder paste technology, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of high corrosion, affecting the long-term stability of the pad, high rosin residue, etc., to achieve low corrosion, The effect of less residue and stable properties of components

Active Publication Date: 2018-04-20
广东省先进陶瓷材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Rosin can not only act as a protective film, but also act as an active agent to remove the oxide layer, but the residue of rosin is high and corrosive, which affects the long-term stability of the pad

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] An embodiment of the solder paste flux described in the present invention, the solder paste flux described in this embodiment comprises the following components in percentage by weight: film forming agent 30%, active agent 5%, solvent 59%, thickener 3% agent, 1% corrosion inhibitor, 1% antioxidant and 1% pH regulator;

[0035] Among them, R 1 is methyl, R 2 is ether group, R 3 is a dimethyl sulfoxide group; m is 1, n is 1; the molecular weight of the acrylic resin is 306.

[0036] The film forming agent is a mixture of acrylic resin, hydrogenated rosin and polymerized rosin; the weight percentage of the acrylic resin in the solder paste flux is 20%; the active agent is succinic acid, sebacic acid and maleic acid The thickener is hydrogenated castor oil wax; the corrosion inhibitor is oleic acid imidazoline, the antioxidant is hydroquinone; the pH regulator is triethanolamine; the solvent is diethylene glycol dibutyl ether and tetraethylene glycol Alcohol dimethyl et...

Embodiment 2

[0039] An embodiment of the solder paste flux described in the present invention, the solder paste flux described in this embodiment comprises the following components in percentage by weight: 50% film-forming agent, 15% active agent, 5% thickener, Corrosion inhibitor 2%, antioxidant 2%, pH regulator 2% and solvent 24%;

[0040] Among them, R 1 is n-decyl ether group, R 2 is n-decyl ether group; R 3 is n-decyl ether group; m is 290, n is 290; the molecular weight of the acrylic resin is 299280.

[0041] The film-forming agent is a mixture of acrylic resin, ice white rosin and modified rosin; the weight percentage of the acrylic resin in the solder paste flux is 30%; the active agent is malonic acid, phenylimidazole and horseradish The mixture of acid; the thickener is polyamide wax; the corrosion inhibitor is benzotriazole; the antioxidant is 2,6-di-tert-butyl p-cresol; the pH regulator is diethanolamine; the solvent is diethyl A mixture of glycol monobutyl ether and dieth...

Embodiment 3

[0044] An embodiment of the solder paste flux described in the present invention, the solder paste flux described in this embodiment comprises the following components in weight percentage: 40% film forming agent, 10% active agent, 5% thickener, Corrosion inhibitor 2%, antioxidant 2%, pH regulator 1%, solvent 40%;

[0045] Among them, R 1 is phenyl, R 2 is n-hexyl, R 3 is hydroxyethyl; m is 300, n is 300; the molecular weight of the acrylic resin is 122400.

[0046] The film forming agent is a mixture of acrylic resin, disproportionated rosin and acrylic rosin; the weight percentage of the acrylic resin in the solder paste flux is 30%; the active agent is azelaic acid, phenylimidazole and diethanolamine The mixture; the thickener is polyamide wax; the corrosion inhibitor is hydroxyglyceride; the antioxidant is resorcinol; the pH regulator is ethanolamine; the solvent is a mixture of diethylene glycol monohexyl ether and tetrahydroconol.

[0047] A solder paste containing t...

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Abstract

The invention discloses solder paste scaling powder. The solder paste scaling powder comprises a film forming agent. The film forming agent comprises acrylic resin. The acrylic resin comprises a repetition structure unit in a formula (I). The acrylic resin is adopted in the solder paste scaling powder for replacing rosin, corrosivity is weak, few residues exist, and tin powder is wrapped by the acrylic resin so that the tin powder can be prevented from being oxidized. Solder paste in which the solder paste scaling powder is added is provided with a wide process window, components in the solderpaste are stable in property, and the stability of the solder paste is good; and heat stability of the acrylic resin is good, and the reflow soldering temperature section is wide.

Description

technical field [0001] The invention relates to a flux, in particular to a solder paste flux for surface mount (SMT) lead-free zero-halogen soldering Background technique [0002] The fluxes used in existing solder pastes mainly include rosin, activators, solvents, antioxidants, and thickeners. At present, rosin can protect solder powder from being oxidized during reflow soldering, prevent tin beads from being produced, and improve soldering performance. Rosin can not only act as a protective film, but also act as an active agent to remove the oxide layer, but the residue of rosin is high, and it is highly corrosive, which affects the long-term stability of the pad. In order to reduce the amount of rosin used, it is mainly to choose resin to replace or partially replace rosin, which can not only play the role of protective layer, but also reduce residue. Contents of the invention [0003] The object of the present invention is to provide a solder paste flux by overcoming ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K35/26
CPCB23K35/025B23K35/262B23K35/3613B23K35/362
Inventor 邱基华
Owner 广东省先进陶瓷材料科技有限公司
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