A kind of polishing liquid and its preparation method and application

Abstract

The invention discloses a polishing solution, a preparation method and application thereof. The polishing solution comprises the following components by mass percentage: 1-20% of an inorganic alkalinecompound, 0.1-1% of an additive, and the balance deionized water. The additive is composed of the following components: 0.01-0.5% of isooctanol polyoxyethylene ether phosphate, 0.5-5% of alkyl polyglucoside, and the balance deionized water. The preparation method includes: 1) weighing the components according to the mass ratio in the additive, and then mixing the components to obtain the additive; and 2) weighing the raw materials according to the mass ratio in the polishing solution, firstly adding the inorganic alkaline compound into the deionized water, then performing mixing the additiveprepared by step (1), thus obtaining the polishing solution. The polishing solution can be applied in a post-polishing process of a diamond wire sawn polycrystalline silicon wafer. The polishing solution provided by the invention can achieve little thickness reduction of polycrystalline silicon after treatment, and also can indirectly enhance the photoelectric conversion rate.

Description

technical field [0001] The invention belongs to the field of solar cells, and in particular relates to polishing treatment after diamond wire cutting polysilicon wafers, in particular to a polishing liquid and its preparation method and application. Background technique [0002] Reducing costs and improving efficiency is the tireless pursuit of photovoltaic practitioners. On the silicon wafer side, diamond wire slicing technology has shown great advantages. With the large-scale application of diamond wire slicing technology, the manufacturing cost of monocrystalline silicon wafers has been greatly reduced, and the multi-crystalline market has been squeezed, which has reduced the cost of multi-crystalline silicon wafers. The pressure increased further. However, when polysilicon wafers are cut by diamond wire, after polishing, the surface reflectivity is higher and there are obvious appearance defects such as line marks, which seriously reduces cell efficiency and hinders the...

AI Technical Summary

Problems solved by technology

However, when polysilicon wafers are cut by diamond wire, after polishing, the surface reflectivity is higher and there are obvious appearance defects such as line marks, which seriously reduces the efficiency of cells and hinders the large-scale promotion of diamond wire cut polysilicon wafers.

[0003] Conventional silicon wafer surface polishing or texturing mainly adopts NaOH / isopropanol (IPA) system. Although it has a certain effect, isopropanol is harmful to the human body and will cause environmental pollution, and the polishing effect is not ideal ( For example, the polishing speed is fast, and the reflectivity of the polysilicon after polishing is still high), therefore, those skilled in the art need to seek a kind of polishing liquid that can be environmentally friendly and can achieve a better polishing effect.

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