Conductive adhesive for LED encapsulation and preparation method thereof
A technology of LED packaging and conductive adhesive, which is applied in the direction of circuits, adhesives, electrical components, etc., can solve the problem that the conductive adhesive does not adapt to the rapidly growing demand of the LED industry, and achieve the goals of accelerating curing speed, improving thermal conductivity, and optimizing electrical conductivity Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
preparation example Construction
[0021] An embodiment of the present invention provides a conductive adhesive for LED packaging and a preparation method thereof, which has excellent electrical conductivity and extremely high shear strength. The conductive adhesive for LED packaging includes:
[0022] 13-16.5wt.% resin system, 0.9-1.4wt.% dicyandiamide curing system, 0.1-0.35wt.% short-chain dibasic acid, 65-72wt.% silver powder, 5-8wt.% low melting point alloy powder, 1-1.5wt.% graphene powder, and 4.5-10wt.% other additives.
[0023] In one embodiment, the resin system includes one or a combination of bisphenol A type epoxy resin, novolak epoxy resin, and bisphenol F type resin.
[0024] In one embodiment, the content of the resin system is preferably 16wt.%.
[0025] In one embodiment, the content of the dicyandiamide curing system is preferably 1.3wt.%.
[0026] In one embodiment, the short-chain dibasic acid includes one or a combination of succinic acid, glutaric acid, and adipic acid.
[0027] In one...
Embodiment 1
[0035] Take 65wt.% silver powder, 8wt.% tin-bismuth alloy powder, and 1wt.% graphene powder, mix them uniformly, grind and dry them, and then calcinate at 650-700°C for 2 hours in a reducing atmosphere to obtain an alloy mixed with graphene powder powder;
[0036] Take 16.5wt.% bisphenol A epoxy resin, 1.4wt.% dicyandiamide, 0.35wt.% succinic acid, and 3.5wt.% defoamer, dispersant, and coupling agent, mix well, add slowly The alloy powder prepared above was stirred, and vacuum defoamed to obtain the conductive adhesive for LED packaging.
[0037] After testing, the conductive adhesive of this example can be stored at room temperature for 3 months, cured at 185°C for 55 minutes, and the resistivity after curing is 1.25*10 -4Ω cm, the thermal conductivity is 10.25W / (m·K), and the shear strength is 18.4MPa.
Embodiment 2
[0039] Take 70wt.% silver powder, 5wt.% tin-bismuth alloy powder, and 1.5wt.% graphene powder, mix them uniformly, grind and dry them, and then calcinate them at 650-700°C for 2 hours in a reducing atmosphere to obtain graphene powder mixed with alloy powder;
[0040] Get 15wt.% novolac epoxy resin, 0.9wt.% dicyandiamide, 0.1wt.% glutaric acid, and 7.5wt.% defoamer, dispersant, and coupling agent and mix evenly, slowly add the above prepared The alloy powder is stirred and vacuum defoamed to obtain the conductive adhesive for LED packaging.
PUM
Property | Measurement | Unit |
---|---|---|
The average particle size | aaaaa | aaaaa |
Resistivity | aaaaa | aaaaa |
Thermal conductivity | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information

- Generate Ideas
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com