Conductive adhesive for LED encapsulation and preparation method thereof

A technology of LED packaging and conductive adhesive, which is applied in the direction of circuits, adhesives, electrical components, etc., can solve the problem that the conductive adhesive does not adapt to the rapidly growing demand of the LED industry, and achieve the goals of accelerating curing speed, improving thermal conductivity, and optimizing electrical conductivity Effect

Inactive Publication Date: 2018-05-08
苏州亿沃自动化技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, the currently used conductive adhesives that require low-temperature

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0021] An embodiment of the present invention provides a conductive adhesive for LED packaging and a preparation method thereof, which have excellent electrical conductivity and extremely high shear strength. The conductive adhesive for LED packaging includes:

[0022] 13~16.5wt.% resin system, 0.9~1.4wt.% dicyandiamide curing system, 0.1~0.35wt.% short chain dibasic acid, 65~72wt.% silver powder, 5~8wt.% low melting point alloy powder, 1-1.5wt.% graphene powder, and 4.5-10wt.% other additives.

[0023] In one embodiment, the resin system includes one or a combination of bisphenol A type epoxy resin, phenolic epoxy resin, and bisphenol F type resin.

[0024] In one embodiment, the content of the resin system is preferably 16 wt.%.

[0025] In one embodiment, the content of the dicyandiamide curing system is preferably 1.3 wt.%.

[0026] In one embodiment, the short-chain dibasic acid includes one or a combination of succinic acid, glutaric acid, and adipic acid.

[0027] In...

Example Embodiment

[0034] Example 1

[0035] 65wt.% silver powder, 8wt.% tin-bismuth alloy powder, and 1wt.% graphene powder are mixed uniformly, ground and dried, and then calcined at 650-700 °C for 2 hours in a reducing atmosphere to obtain an alloy mixed with graphene powder powder;

[0036] Take 16.5wt.% bisphenol A epoxy resin, 1.4wt.% dicyandiamide, 0.35wt.% succinic acid, and 3.5wt.% defoamer, dispersant, and coupling agent, mix well, add slowly The alloy powder prepared above is stirred, and the bubbles are removed by vacuum to obtain a conductive adhesive for LED packaging.

[0037] After testing, the conductive adhesive of this embodiment can be stored at room temperature for 3 months, cured at 185 ° C for 55 minutes, and the resistivity after curing is 1.25*10 -4Ω cm, the thermal conductivity is 10.25W / (m·K), and the shear strength is 18.4MPa.

Example Embodiment

[0038] Example 2

[0039] 70wt.% silver powder, 5wt.% tin-bismuth alloy powder, and 1.5wt.% graphene powder were mixed uniformly, ground and dried, and then calcined at 650-700°C for 2 hours in a reducing atmosphere to obtain a graphene powder mixed with graphene powder. alloy powder;

[0040] Take 15wt.% phenolic epoxy resin, 0.9wt.% dicyandiamide, 0.1wt.% glutaric acid, and 7.5wt.% defoamer, dispersant, and coupling agent and mix them evenly, and slowly add the prepared The alloy powder is stirred, and the bubbles are removed by vacuum to obtain a conductive adhesive for LED packaging.

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PUM

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Abstract

The invention discloses a conductive adhesive for LED encapsulation and a preparation method thereof. The conductive adhesive for LED encapsulation comprises 13-16.5 wt.% of resin system, 0.9-1.4 wt.%of dicyandiamide curing system, 0.1-0.35 wt.% of short chain dibasic acid, 65-72 wt.% of silver powder, 5-8 wt.% of low melting point alloy powder, 1-1.5 wt.% of graphene powder, and 4.5-10 wt. % ofother additives. According to the conductive adhesive for LED encapsulation, by adopting dicyandiamide, the highest peak of the curing of the resin system is shifted from a low temperature area to accelerate the curing speed of the resin system, the short chain dibasic acid can remove some organic insulating lubricants on the surface of the silver powder, and the phenomenon of silver powder agglomeration caused by fast removal of the insulating lubricants does not occur, so that conductive properties of the conductive adhesive are optimized, and graphene which is added can at least partially adhere to the surface of the alloy powder to build heat conduction paths of a plurality of heat conduction mediums to improve thermal conductivity of the LED conductive adhesive.

Description

technical field [0001] The invention belongs to the technical field of LED lighting, and in particular relates to a conductive adhesive for LED packaging and a preparation method thereof. Background technique [0002] Traditional incandescent lamps consume a lot of energy and have a short lifespan. Today, when global resources are in short supply, their production has been gradually banned by governments of various countries. The replacement products are electronic energy-saving lamps. Although electronic energy-saving lamps improve energy-saving effects, they pollute the environment due to the use of many heavy metal elements, which is contrary to the general trend of environmental protection. With the rapid development of LED technology, LED lighting has gradually become the best choice for new green lighting. LED is far superior to traditional lighting products in terms of luminous principle, energy saving and environmental protection. [0003] With the rapid expansion ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/04C09J11/04C09J11/06H01L33/56C08G59/50
CPCC09J163/00C08G59/504C08K3/04C08K3/08C08K5/092C08K2003/0806C08K2201/003C09J11/04C09J11/06C09J163/04H01L33/56
Inventor 蔡赛胡进李琳
Owner 苏州亿沃自动化技术有限公司
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