Conductive adhesive for LED encapsulation and preparation method thereof
A technology of LED packaging and conductive adhesive, which is applied in the direction of circuits, adhesives, electrical components, etc., can solve the problem that the conductive adhesive does not adapt to the rapidly growing demand of the LED industry, and achieve the goals of accelerating curing speed, improving thermal conductivity, and optimizing electrical conductivity Effect
Inactive Publication Date: 2018-05-08
苏州亿沃自动化技术有限公司
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The invention discloses a conductive adhesive for LED encapsulation and a preparation method thereof. The conductive adhesive for LED encapsulation comprises 13-16.5 wt.% of resin system, 0.9-1.4 wt.%of dicyandiamide curing system, 0.1-0.35 wt.% of short chain dibasic acid, 65-72 wt.% of silver powder, 5-8 wt.% of low melting point alloy powder, 1-1.5 wt.% of graphene powder, and 4.5-10 wt. % ofother additives. According to the conductive adhesive for LED encapsulation, by adopting dicyandiamide, the highest peak of the curing of the resin system is shifted from a low temperature area to accelerate the curing speed of the resin system, the short chain dibasic acid can remove some organic insulating lubricants on the surface of the silver powder, and the phenomenon of silver powder agglomeration caused by fast removal of the insulating lubricants does not occur, so that conductive properties of the conductive adhesive are optimized, and graphene which is added can at least partially adhere to the surface of the alloy powder to build heat conduction paths of a plurality of heat conduction mediums to improve thermal conductivity of the LED conductive adhesive.
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Property | Measurement | Unit |
The average particle size | 6.0 ~ 8.0 | µm |
Resistivity | 1.25 ~ 10.0 | cm·Ω |
Thermal conductivity | 10.25 | W/k/m |
tensile | MPa | |
Particle size | Pa | |
strength | 10 |
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