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Manufacturing method for automatic LED lamp production system

The technology of a production system and manufacturing method is applied in the direction of semiconductor devices of light-emitting elements, lighting devices, light sources, etc., which can solve the problems of poor heat dissipation effect of LED lights, complicated manufacturing process, and short service life, and achieve excellent mechanical strength. Good heat dissipation efficiency and insulation effect

Inactive Publication Date: 2018-05-08
CHANGZHOU INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Using this structural method to make LED filaments requires fixing the LED chips on the sapphire bracket with a crystal bonder, and then welding them with gold wires with a wire bonding machine, resulting in complicated manufacturing processes, high product manufacturing costs, and low yield rates; In addition, the LED lamps obtained by the current LED lamp manufacturing method have poor heat dissipation effect and short service life

Method used

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  • Manufacturing method for automatic LED lamp production system

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Effect test

Embodiment 1

[0022] see figure 1 , the present invention provides the following technical solution: a manufacturing method of an automated LED lamp production system, comprising the following steps:

[0023] A. Fix the LED chip on the front and back of the circuit board;

[0024] B. Coating encapsulation material on the surface of the LED chip;

[0025] C. Weld the IC controller, chip resistors, and rectifier chips on the pads of the circuit board on the front and back of the circuit board, and then coat a layer of thermally conductive insulating material;

[0026] D. Finally, fix the circuit board in the LED lampshade.

[0027] In this embodiment, the packaging material in step B includes a filling film layer made of epoxy resin or polymer monomer; doped particles are doped in the filling film layer, and the doping particles are aluminum oxide, nitrogen A mixture of silicon dioxide and terbium trioxide.

[0028] In this embodiment, the thermally conductive insulating material layer co...

Embodiment 2

[0032] A method for manufacturing an automated LED lamp production system, comprising the following steps:

[0033] A. Fix the LED chip on the front and back of the circuit board;

[0034] B. Coating encapsulation material on the surface of the LED chip;

[0035] C. Weld the IC controller, chip resistors, and rectifier chips on the pads of the circuit board on the front and back of the circuit board, and then coat a layer of thermally conductive insulating material;

[0036] D. Finally, fix the circuit board in the LED lampshade.

[0037] In this embodiment, the packaging material in step B includes a filling film layer made of epoxy resin or polymer monomer; doped particles are doped in the filling film layer, and the doping particles are aluminum oxide, nitrogen A mixture of silicon dioxide and terbium trioxide.

[0038] In this embodiment, the thermally conductive insulating material layer components in step C include 30 parts by weight of silicon carbide, 15 parts of ca...

Embodiment 3

[0042] A method for manufacturing an automated LED lamp production system, comprising the following steps:

[0043] A. Fix the LED chip on the front and back of the circuit board;

[0044] B. Coating encapsulation material on the surface of the LED chip;

[0045] C. Weld the IC controller, chip resistors, and rectifier chips on the pads of the circuit board on the front and back of the circuit board, and then coat a layer of thermally conductive insulating material;

[0046] D. Finally, fix the circuit board in the LED lampshade.

[0047] In this embodiment, the packaging material in step B includes a filling film layer made of epoxy resin or polymer monomer; doped particles are doped in the filling film layer, and the doping particles are aluminum oxide, nitrogen A mixture of silicon dioxide and terbium trioxide.

[0048] In this embodiment, the thermally conductive insulating material layer components in step C include 20 parts by weight of silicon carbide, 10 parts of ca...

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Abstract

The invention discloses a manufacturing method for an automatic LED lamp production system. The method comprises the following steps that A, LED chips are fixed to the front sides and the back sides of circuit boards; B, the surfaces of the LED chips are coated with encapsulating materials; C, IC controllers, chip resistors and rectifying chips are welded to bonding pads of the circuit boards on the front sides and the back sides of the circuit boards and then are each coated with a layer of thermally-conductive and insulating material; and D, the circuit boards are fixed in LED lampshades. The LED lamp manufacturing method has the advantages that the operation is simple, the LED chips can be effectively protected, meanwhile, the heat dissipation efficiency can be improved, and the servicelife can be prolonged.

Description

technical field [0001] The invention relates to the technical field of LED lamp manufacturing, in particular to a manufacturing method of an automatic LED lamp production system. Background technique [0002] LED is a solid-state semiconductor device that can convert electrical energy into visible light, and it can directly convert electricity into light. The heart of LED is the wafer of a semiconductor, and one end of wafer is attached on a bracket, and one end is negative pole, and the other end connects the positive pole of power supply, and whole wafer is encapsulated by epoxy resin. [0003] Semiconductor wafer is made up of two parts, and a part is P-type semiconductor, and hole occupies an leading position in it, and the other end is N-type semiconductor, and here mainly is electron. But time these two kinds of semiconductors couple together, between them, just form a P-N junction. When electric current acts on this chip by wire time, electron will be pushed to P di...

Claims

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Application Information

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IPC IPC(8): F21K9/90F21Y115/10
CPCF21K9/90F21Y2115/10
Inventor 李晓芳李介阳汤铭谢光前
Owner CHANGZHOU INST OF TECH