Lead bonding method based on rapid local electrodeposition

Abstract

The invention relates to a wire bonding method based on rapid local electrodeposition, and belongs to the technical field of lead connection. The method comprises the following steps of selecting a novel lead material to be bonded and modifying the novel lead material; placing the lead material on the surface of a bonding pad through a micro-nano operation platform, ensuring that the lead is in good contact with the surface of the bonding pad; and selecting the caliber of a local electrodeposition precise pipette and the type of an anode metal in the pipette to ensure good contact between an electroplating cathode end probe and the bonding pad; forming a metal coating which completely coats the lead material on the surface of the bonding pad through a local electrodeposition method; and cleaning the entire device after the bonding of the electrodeposition leads on the surface of the bonding pad. Compared with a traditional lead bonding process, the method disclosed by the invention hasthe advantage that reliable lead bonding of the novel lead material can be realized, heating connection is not needed in the whole bonding process, and the whole bonding process is free of thermal damage and mechanical damage. The method is simple in technological process and high in bonding speed, and is suitable for various bonding pad materials and wide in connection layer metal variety selection range.

Description

technical field [0001] The invention belongs to the technical field of lead wire connection, and relates to a method for wire bonding in electronic packaging technology, specifically, a method for realizing bonding of a new type of wire material by using an electrodeposition method, so as to realize the bonding of the new type of wire bonding material and welding Novel wire-bonding method for interconnecting disks in the solid state. Background technique [0002] With the continuous development and innovation of electronic packaging technology, IC integration density is getting higher and higher. The use of traditional metal wires in wire bonding technology has brought about high resistance and electromigration problems, which seriously affect the power density and reliability of electronic devices. Use new high-conductivity and high-reliability lead materials (such as carbon-based, carbon-surface-enhanced metal-based, carbon-composite metal-based lead materials, etc.) to re...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the unreliable problem of the existing wire bonding technology, and provide a wire bonding method based on rapid local electrodeposition for wire materials (such as carbon-based, carbon-surface-enhanced metal-based, carbon-composite metal-based lead material, etc.) to the pad for wire bonding

The invention can solve the problem that the interconnection between the lead material and the pad cannot be realized by using methods such as thermocompression bonding, ultrasonic bonding, and thermosonic bonding, and realizes rapid selectivity between the lead material and the pad through the local electrodeposition method Interconnection, the whole bonding process does not require heating connection, no thermal damage and mechanical damage, has the advantages of simple process flow, fast bonding speed, suitable for various pad materials, and a wide range of metal types for the connection layer.

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