Thermoplastic PI (polyimide) hot melt adhesive film and preparation method thereof

A thermal and thermoplastic technology of polyimide, applied in the direction of adhesives, etc., can solve the problems of poor bonding performance of polyimide film, high price of monomer raw materials, high production cost, etc., and achieve easy operation and low water absorption , the effect of reducing regularity

Inactive Publication Date: 2018-06-01
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages of this polyimide are: (1) the price of monomer raw materials is high, and the production cost is high; Polyimide film has poor adhesion and low peel strength

Method used

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  • Thermoplastic PI (polyimide) hot melt adhesive film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] The ambient humidity was controlled at 40%. In a 500mL three-necked flask, nitrogen was introduced from one of the flasks, 90ml of DMF was added from the other, and then 2.788g of ODA and 4.056g of TPER were added. Mechanical stirring was carried out at 0°C with a rotation speed of 150r / min, after stirring for 15 minutes, 1.633gα-BPDA and 6.533g BPDA were added at one time, the solution became cloudy, after stirring for 1 hour, the solution became clear again, and 16mgα-BPDA and 65mg BPDA were added. Keep stirring in a low-temperature ice bath and nitrogen atmosphere, and stir for 6 h to obtain a PAA solution.

[0030] Select a dry and clean glass plate, place it on the flat plate of the applicator, apply the prepared PAA solution on the surface of the glass plate, scrape the liquid surface with a scraper, and then put it in a circulating oven to dry at 100°C, evaporate and remove the solvent for 10 minutes . After the solvent evaporates, put the glass plate into a va...

Embodiment 2

[0033] The preparation method of Example 2 is basically the same as that of Example 1, except that DMF is replaced by DMAc to obtain polyimide hot melt adhesive film J-2, and the copper clad laminate prepared therefrom is numbered C-2.

Embodiment 3

[0035] The ambient humidity was controlled at 40%. In a 500mL three-necked flask, nitrogen was introduced from one of the flasks, 90ml of DMF was added from the other, and then 2.788g of ODA and 4.056g of TPER were added. Mechanical stirring was carried out at 5°C with a rotation speed of 150r / min, after stirring for 15 minutes, add 4.083gα-BPDA and 4.083g BPDA at one time, the solution becomes cloudy, after stirring for 1 hour, the solution becomes clear again, and then add 40mgα-BPDA and 40mg BPDA. Keep stirring in a low-temperature ice bath and nitrogen atmosphere, and stir for 6 h to obtain a PAA solution.

[0036] Select a dry and clean glass plate, place it on the flat plate of the applicator, apply the prepared PAA solution on the surface of the glass plate, scrape the liquid surface with a scraper, then put it in a circulating oven to dry at 80°C, evaporate and remove the solvent for 10 minutes . After the solvent evaporates, put the glass plate into a vacuum oven, h...

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Abstract

The invention discloses a thermoplastic PI (polyimide) hot melt adhesive film and a preparation method thereof. The preparation method comprises following steps: ODA (4,4'-diaminodiphenyl ether), TPER(1,3-Bis(4-aminophenoxyl)benzene), alpha-BPDA (2,3,3',4'-biphenyl tetracarboxylic dianhydride) and BPDA (3,3',4,4'-biphenyltetracarboxylic dianhydride) are taken as raw materials, and a PAA (polyamide acid) solution is prepared from the raw materials through a low-temperature polymerization reaction in a non-protic organic solvent under protection of N2; a dry and clean glass board is smeared with the prepared PAA solution, and after solvent evaporation and thermal imidization, the thermoplastic PI hot melt adhesive film is obtained. The water absorption rate of the film is lower than 1%, thefilm has excellent high-temperature resistance and can be bonded with copper foil effectively without glue, peel strength is as high as 1.3 N / mm, and accordingly, the film can be applied to fields ofa high-temperature binder, a high-temperature resistant material and a multi-layer copper-clad plate.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a thermoplastic polyimide hot-melt adhesive film and a preparation method thereof. Background technique [0002] With the development of aviation, aerospace and electronic technology, the demand for heat-resistant, lightweight and high-strength structural materials in various industries is increasingly urgent. Polyimide (PI) films have been widely used for their excellent heat resistance, excellent mechanical properties and dielectric properties. In recent years, PI's research in the field of flexible copper clad laminates has been particularly in-depth. [0003] Flexible copper clad laminate is the basic material for the production of flexible printed circuit boards, and its production process has a great impact on the performance and appearance of electronic products. Traditional flexible copper-clad laminates consist of three layers (3L-FCCL): the coppe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J179/08C08G73/10
CPCC08G73/1007C08G73/1071C09J179/08
Inventor 邢天成曹贤武
Owner SOUTH CHINA UNIV OF TECH
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