Resin diamond wire and preparation method thereof

A technology of resin diamond wire and resin, which is applied in the direction of manufacturing tools, stone processing equipment, fine working devices, etc., can solve the problems of restricting the performance of resin diamond wire, decrease of diamond holding force, poor effective cutting performance, etc., to achieve excellent holding force, The effect of improving wettability and improving cutting force

Active Publication Date: 2018-06-05
ZHEJIANG SHUNLIAN INTELLIGENT EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the resin diamond wire is mainly obtained by consolidating phenolic resin and diamond abrasives on the busbar, which usually has the following problems: the bonding force between the resin and the diamond is poor, and due to the heat in the grinding process, the resin holds the dia

Method used

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  • Resin diamond wire and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046]The diamond powder with a D50 of 9.1 μm was subjected to plasma treatment under an oxygen atmosphere, the gas flow rate was 150L / h, the voltage was 30KV, the single treatment volume of the diamond powder was 5000ct, and the treatment time was 30min to obtain a modified diamond abrasive. A slurry was obtained by mixing 36% of polyimide resin, 25% of modified diamond abrasive, 15% of aluminum oxide and 24% of DMF. After the high-carbon steel wire busbar is coated with slurry through the mold, it is dried in a 300°C oven at a speed of 90m / min and wound up, and then post-treated at 220°C for 5h to obtain a resin diamond wire (denoted as S- 1). The morphology and structure of the resulting resin diamond wire can be found in figure 1 , figure 1 It is the topography diagram of the resin diamond wire S-1 obtained in this example.

[0047] Set up the control sample: prepare according to the above preparation process, the difference is that the diamond powder is not subjected t...

Embodiment 2

[0054] The diamond powder with a D50 of 9.1 μm was subjected to plasma treatment under an oxygen atmosphere, the gas flow rate was 150 L / h, the voltage was 20 KV, the single treatment volume of the diamond powder was 5000 ct, and the treatment time was 30 minutes to obtain a modified diamond abrasive. Mix 25% polyimide resin, 30% modified diamond abrasive, 20% copper powder and 25% DMF to obtain a slurry. After the high-carbon steel wire busbar is coated with slurry through the mold, it is dried in a 300°C oven at a speed of 90m / min and wound up, and then post-treated at 220°C for 5h to obtain a resin diamond wire (denoted as S- 2).

[0055] According to the cutting test method of Example 1, the obtained resin diamond wire S-2 was subjected to a cutting test, and the test results showed that the diamond shedding rate was 19%, and the diamond wear rate was 22%. It can be seen that the bond between the modified diamond abrasive and the resin is strong, the grip is firm, the dia...

Embodiment 3

[0057] The diamond powder with a D50 of 9.1 μm was subjected to plasma treatment in an oxygen atmosphere, the gas flow rate was 50 L / h, the voltage was 30 KV, the single treatment volume of the diamond powder was 5000 ct, and the treatment time was 30 minutes to obtain a modified diamond abrasive. 25% of polyimide resin, 30% of modified diamond abrasive, 20% of silicon carbide and 25% of DMF were mixed to obtain a slurry. After the high-carbon steel wire busbar is coated with slurry through the mold, it is dried in an oven at 250°C at a speed of 90m / min and wound up, and then post-treated at 200°C for 6 hours to obtain a resin diamond wire (denoted as S- 3).

[0058] According to the cutting test method of Example 1, the obtained resin diamond wire S-3 was subjected to a cutting test, and the test results showed that the diamond shedding rate was 18%, and the diamond wear rate was 22%. It can be seen that the bond between the modified diamond abrasive and the resin is strong,...

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Abstract

The invention provides a resin diamond wire and a preparation method thereof. The resin diamond wire comprises a bus bar and a resin coating that coats the surface of the bus bar; raw materials forming the resin coating comprise a resin, a modified diamond abrasive and a filler; and the modified diamond abrasive is plasma-treated diamond powder. The resin diamond wire greatly improves the bondingforce between the resin and the diamond, the resin holds the diamond more firmly and does not fall off easily, the number of diamonds which are effectively involved in cutting is more, the diamond loss is lower, and thus the cutting force of the resin diamond wire is improved. In addition, no low molecular volatile is produced during the processing of the resin diamond wire, and the method is veryenvironmentally friendly.

Description

technical field [0001] The invention relates to the technical field of diamond wire cutting, in particular to a resin diamond wire and a preparation method thereof. Background technique [0002] In the early days, in order to solve the processing problem of large-size silicon wafers, people usually used wire saw processing technology to cut silicon rods into pieces. The early wire saw processing technology used bare metal wires and free abrasives. During the processing, the abrasives were added as a third party between the metal wire and the workpiece to produce cutting action. This technique has been successfully used in the processing of silicon and silicon carbide. In order to further shorten the processing time, and to process other hard substances and ceramics that are difficult to process, people fix diamond abrasives on metal wires in a certain way, thus producing a fixed diamond wire saw. [0003] Diamond wire, also known as diamond wire, refers to the use of elect...

Claims

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Application Information

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IPC IPC(8): B28D5/04
CPCB28D5/042B28D5/045
Inventor 万容兵刘伟杨长剑卢建彪周品文
Owner ZHEJIANG SHUNLIAN INTELLIGENT EQUIP CO LTD
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