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A kind of photosensitive resin composition and its application

A photosensitive resin and photosensitive resin layer technology, applied in the field of photocuring, can solve the problems of photosensitizer precipitation and unsatisfactory solubility, and achieve the effects of stable photosensitivity, fast and efficient pattern formation, and excellent printability.

Active Publication Date: 2021-04-20
CHANGZHOU TRONLY NEW ELECTRONICS MATERIALS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Chinese patent CN102844709A discloses the application of a kind of N, N, N', N'-tetraaryl benzidine derivatives in photosensitive resin, but it is found that its solubility in a specific solvent is not ideal during application, and the photosensitive resin After the composition is coated on the support film and dried, a small amount of photosensitizer will be precipitated

Method used

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  • A kind of photosensitive resin composition and its application
  • A kind of photosensitive resin composition and its application
  • A kind of photosensitive resin composition and its application

Examples

Experimental program
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Effect test

preparation example Construction

[0040] The synthetic method of the benzidine derivative shown in general formula (I), comprises the following steps:

[0041] (1) raw material a and raw material b are reacted to obtain intermediate a;

[0042] (2) Intermediate a and raw material c are reacted in an organic solvent containing a catalyst to obtain intermediate b;

[0043] (3) raw material d and raw material e obtain intermediate c through catalyst catalytic reaction under the protection of nitrogen;

[0044] (4) Intermediate b and intermediate c are catalyzed by a catalyst to obtain a product under the protection of nitrogen;

[0045] The reaction equation is as follows:

[0046]

[0047] In the case of knowing the above reaction scheme, the specific reaction conditions in steps (1)-(4) can be easily determined by those skilled in the art.

[0048] The reaction of step (1) can be carried out under catalyst-free and solvent-free conditions. The reaction temperature varies slightly depending on the type of...

specific Embodiment approach

[0061] The present invention will be described in further detail below in conjunction with specific examples, but they should not be construed as limiting the protection scope of the present invention.

[0062] Component D is the preparation of the benzidine derivative shown in general formula (I)

Embodiment 1

[0064] (1) Preparation of intermediate a1

[0065]

[0066] Add 140.5 g of p-methylbenzyl chloride and 199.2 g of triethyl phosphite into a 500 ml four-necked flask, stir and raise the temperature to 80-90° C., and react for 3 hours. Control in GC until p-methylbenzyl chloride is less than 1%, and the reaction ends. Distill at 90°C atmospheric pressure to remove the reaction by-product ethyl chloride, continue to distill under reduced pressure to remove unreacted triethyl phosphite, after no fraction is removed, cool down to 30°C, release 212g of the material in the kettle, namely the intermediate a1, 98% purity.

[0067] The structure of intermediate a1 was confirmed by LCMS.

[0068] Mass spectrometry was used to obtain 243 and 244 molecular fragment peaks with the help of the software attached to the instrument, and the molecular weight of the product was 242, which was consistent with T+1 and T+2.

[0069] (2) Preparation of intermediate b1

[0070]

[0071] Add ...

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Abstract

The invention discloses a photosensitive resin composition, comprising (A) binder polymer, (B) photopolymerizable monomer, (C) photoinitiator, and (D) benzidine represented by general formula (I) derivative. The photosensitive resin composition exhibits high sensitivity, high resolution and high adhesion under light with a wavelength of 365-405nm, high solubility in solvents, good compatibility and excellent application performance.

Description

technical field [0001] The invention belongs to the field of photocuring technology, and specifically relates to a photosensitive resin composition, especially a photosensitive resin composition suitable for exposure by light with a wavelength of 365-405nm and its application in printed circuit boards, color TV sets, liquid crystal displays, etc. Applications in components, etc. Background technique [0002] The rapid development of UV curing technology has the advantages of fast curing speed, less pollution, and low cost. It is widely used in holographic recording, laser direct plate making, photocuring, and laser stereolithography. In recent years, the application of LED as a new light source in the field of light curing is attracting more and more attention. It has shown great application potential in terms of light output, work efficiency, cost, and environmental protection. Matching products have become the focus of research by those skilled in the art. [0003] 365-4...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/033G03F7/028H05K3/28C07C209/10C07C211/54
CPCC07C209/10G03F7/028G03F7/033H05K3/287C07C211/54
Inventor 钱晓春翁云峰衡京胡春青于培培
Owner CHANGZHOU TRONLY NEW ELECTRONICS MATERIALS