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Preparation method for environment-friendly-type corrosion-resistant chemical copper plating solution

An electroless copper plating and anti-corrosion technology, which is applied in the field of preparation of environment-friendly anti-corrosion chemical copper plating solution, can solve the problems of corrosion and high toxicity of plated parts, and achieve the effect of increasing the copper plating area and increasing the bonding force

Inactive Publication Date: 2018-06-22
唐林元
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The technical problem mainly solved by the present invention is that formaldehyde is mostly used as reducing agent in current electroless copper plating solution, which is highly toxic. The electroless copper plating solution using formaldehyde as reducing agent must be highly alkaline to have an effective reaction, which is likely to cause the body of the plating Corrosion defect, provide a kind of preparation method of environment-friendly anti-corrosion electroless copper plating liquid

Method used

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  • Preparation method for environment-friendly-type corrosion-resistant chemical copper plating solution

Examples

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example 1

[0027] Put 200mL of cotton pulp black liquid with 25% solid mass content into a reactor with a gas valve, seal the reactor, and introduce carbon dioxide gas into the reactor through the gas valve at a ventilation rate of 40mL / min. The ventilation continues 10min, close the vent valve, heat up to 200℃, keep the temperature for 7h to obtain the reaction material; mix the above-mentioned reaction material and quicklime at a mass ratio of 10:1, heat up to 80℃, digest for 4min to obtain decaustic slurry, The decaustic slurry was filtered and separated to collect the filter residue. The filter residue was placed in an oven set at 100℃ and dried for 4 hours to obtain hydrothermal coke; 200mL of potassium permanganate solution with a mass concentration of 7g / mL was prepared, and the mass fraction was 85 % Concentrated sulfuric acid solution was added to the potassium permanganate solution, the pH of the potassium permanganate solution was adjusted to 2 to obtain an acid potassium perman...

example 2

[0029] Put 225mL of cotton pulp black liquid with 25% solid mass content into a reactor with a gas valve, seal the reactor, and introduce carbon dioxide gas into the reactor through the gas valve at a ventilation rate of 45 mL / min, and the ventilation continues 13min, close the vent valve, heat up to 210℃, heat preservation and react for 7.5h to obtain the reaction material; mix the above reaction material and quicklime at a mass ratio of 10:1, heat up to 85℃, digest for 4.5min to obtain a decaustic slurry , The decaustic slurry is filtered and separated to collect the filter residue, and the filter residue is placed in an oven set at 105°C and dried for 7 hours to obtain hydrothermal coke; prepare 225mL potassium permanganate solution with a mass concentration of 8g / mL, and combine the mass fraction Add 85% concentrated sulfuric acid solution to the potassium permanganate solution, adjust the pH of the potassium permanganate solution to 2.5 to obtain an acidic potassium permang...

example 3

[0031] Put 250mL of cotton pulp black liquid with 25% solid mass content into a reactor with a gas valve, seal the reactor, and introduce carbon dioxide gas into the reactor through the gas valve at a ventilation rate of 50 mL / min, and the ventilation continues 15min, close the vent valve, heat up to 220℃, keep the temperature for 8h to obtain the reaction material; mix the above-mentioned reaction material and quicklime at a mass ratio of 10:1, heat up to 90℃, digest for 5min to obtain a decaustic slurry. The decaustic slurry is filtered and separated to collect the filter residue. The filter residue is placed in an oven set at 110°C and dried for 10 hours to obtain hydrothermal coke; prepare 250 mL of potassium permanganate solution with a mass concentration of 10 g / mL, and the mass fraction is 85 % Concentrated sulfuric acid solution was added to the potassium permanganate solution, the pH of the potassium permanganate solution was adjusted to 3 to obtain the acid potassium p...

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Abstract

The invention relates to the technical field of preparation of chemical copper plating solutions, in particular to a preparation method for an environment-friendly-type corrosion-resistant chemical copper plating solution. According to the preparation method, polyurethane foam serves as a raw material, the roughened polyurethane foam is immersed into an oxalic acid solution and a sensitizing solution sequentially to be soaked, and thus a sensitized polyurethane base material is obtained; then, the sensitized polyurethane base material is soaked in an ammonium hypophosphite solution, and thus an activated polyurethane glue solution is obtained; and substances such as the activated polyurethane glue solution, copper sulfate, hydrothermal coke and sodium tartrate are dispersed into deionizedwater, and thus the environment-friendly-type corrosion-resistant chemical copper plating solution is obtained. The hydrothermal coke is oxidized and reacts with the water to generate reducing gas sothat metal plating can grow from organic plating advantageously, and the copper plating area of a metal matrix is increased; a used reducing agent mainly includes the hydrothermal coke, and therefore,the chemical copper plating solution is safe and environmentally friendly; and metal nickel has good corrosion-resistant performance, the organic plating can fill pores of a copper-plated layer, accordingly, protection of the plating to the metal matrix is more perfect, and the application prospects are wide.

Description

Technical field [0001] The invention relates to the technical field of preparation of a chemical copper plating solution, in particular to a preparation method of an environment-friendly anti-corrosion chemical copper plating solution. Background technique [0002] Electroless copper plating is a process in circuit board manufacturing. The process of metal copper deposition by reducing the metal copper ions on the surface of the substrate by the appropriate reducing agent in the solution under the autocatalytic action of the substrate surface, also known as electroless copper plating or autocatalytic copper plating, the electroless copper plating process is essentially a process of redox reaction , Belongs to the chemical deposition process with electron transfer and no external power source. [0003] Electroless copper plating has high stability, wide application range of working temperature and solution concentration, dense copper layer, and excellent bonding force. These are th...

Claims

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Application Information

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IPC IPC(8): C23C18/40
CPCC23C18/40
Inventor 唐林元何伟仁张建初
Owner 唐林元