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A processing method of bonding copper wire for packaging

A processing method and technology for copper wires, which are applied in the processing field of bonding copper wires for packaging, can solve the problems of insufficient conductivity of palladium plating on copper wires, insufficient conductivity of palladium, easy oxidation of copper wires, etc. Good electrical conductivity and the effect of eliminating residual stress

Active Publication Date: 2020-07-10
安徽晋源铜业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, copper wires are prone to oxidation, corrosion, high hardness, and poor weldability, which have also become difficulties and challenges for copper wire bonding technology.
[0003] China's authorized patent CN102130067B improves the oxidation resistance of copper wires by plating a layer of relatively cheap palladium on copper wires, but the conductivity of palladium is insufficient
Chinese patents CN103219312A and CN103219311A respectively disclose a double-coated bonding copper wire, that is, a palladium layer is plated on the surface of the copper wire, and a gold layer or a silver layer is plated on the surface of the palladium layer, which solves the problem of easy oxidation of the copper wire and insufficient conductivity of the palladium-plated copper wire. problem, but its preparation is complicated and the cost is high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The present invention provides a method for processing bonding copper wires for packaging, which includes the following steps:

[0022] S1. Add Cu99.09wt% and Li0.05wt% into a smelting furnace at 1210℃ under nitrogen protection by weight percentage, then add La 0.13wt%, Ce 0.1wt% for smelting, and then add Ag 0.45wt% , Sr 0.15wt%, Sn 0.03wt% smelting, and the oxygen-free copper rod is obtained by directional solidification;

[0023] S2. Cool the S1 oxygen-free copper rod at minus 45°C for 10 hours;

[0024] S3. Add the oxygen-free copper rod treated by S2 into the drawing machine, and after rough drawing at a speed of 350 m / min, under nitrogen protection and annealing temperature of 580 ° C, annealing for 1.5 hours to obtain thick copper wire;

[0025] S4. Add the S3 thick copper wire to the drawing machine, and draw three times at a speed of 140 m / min, and anneal for 1 hour under nitrogen protection and 500 ℃ annealing temperature for each fine drawing to obtain a key...

Embodiment 2

[0027] The present invention provides a method for processing bonding copper wires for packaging, which includes the following steps:

[0028] S1. Add Cu99.24wt% and Li0.03wt% to a smelting furnace at 1205℃ under nitrogen protection by weight percentage, then add La0.12wt%, Ce0.1wt% to smelt, and then add Ag0.4wt% , Sr0.1wt%, Sn0.01wt% smelting, and the oxygen-free copper rod is obtained by directional solidification;

[0029] S2. Cool the S1 oxygen-free copper rod at minus 40°C for 11 hours;

[0030] S3. Add the oxygen-free copper rod treated by S2 into the drawing machine, and after rough drawing at a speed of 300 m / min, under nitrogen protection and annealing temperature of 550 ° C, annealing for 1.7 hours to obtain thick copper wire;

[0031] S4. Add the S3 thick copper wire to the drawing machine, and draw three times at a speed of 80 m / min, and after each fine drawing, anneal for 1.2 hours under nitrogen protection and annealing temperature of 450 ° C to prepare a packa...

Embodiment 3

[0033] The present invention provides a method for processing bonding copper wires for packaging, which includes the following steps:

[0034] S1. Add Cu98.91wt% and Li0.05wt% into a smelting furnace at 1200°C under nitrogen protection by weight percentage, add La0.15wt% and Ce0.1wt% to continue smelting, and then add Ag0.56wt% , Sr0.2wt%, Sn0.03wt% continue to smelt, and obtain oxygen-free copper rod through directional solidification;

[0035] S2. Cool the S1 oxygen-free copper rod at -35°C for 11 hours;

[0036] S3. Add the oxygen-free copper rod treated by S2 into the drawing machine, and after rough drawing at a speed of 330 m / min, under nitrogen protection and annealing temperature of 540 ° C, annealing for 1.2 hours to obtain thick copper wire;

[0037] S4. Add the S3 copper wire into the drawing machine, and draw it for 3 times at a speed of 100m / min, and after each fine drawing, under nitrogen protection and annealing temperature of 450 ° C, annealing for 1.2 hours t...

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Abstract

The invention discloses a method for processing bonding copper wires for packaging, which comprises the following steps: adding Cu and Li to a smelting furnace under nitrogen protection according to the weight percentage for melting, adding La and Ce to continue melting, and then adding Ag, Li Sr and Sn are continuously smelted, and the oxygen-free copper rod is obtained through directional solidification; the oxygen-free copper rod is added to the drawing machine after cooling treatment, rough drawing, fine drawing and annealing treatment to obtain the bonding copper wire for packaging. The invention starts from the anti-oxidation, corrosion resistance and electrical conductivity of the copper wire, rationally designs the type and content of the alloy elements of the copper wire, and combines a suitable processing technology to obtain a bonding copper wire with excellent performance for packaging.

Description

technical field [0001] The invention relates to the technical field of integrated circuit packaging, in particular to a method for processing bonding copper wires for packaging. Background technique [0002] In semiconductor integrated circuit packaging, the chip and the lead frame are connected by wire bonding technology. At present, the wire used for wire bonding is mainly pure gold wire, because gold has anti-oxidative corrosion resistance and high conductivity, and can be very Easily bond to the desired location by thermocompression and ultrasonic welding techniques. However, in recent years, as the price of gold continues to rise and the price of electronic products continues to decrease, finding other more suitable metals to replace the gold wire has become an urgent problem to be solved. The cost of copper wire is low, and compared with gold wire, its electrical conductivity and thermal conductivity are better. People gradually use copper wire instead of gold wire to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L21/60C22F1/08C22C9/00C22C1/02
CPCH01L24/43H01L24/45H01L21/4889C22C1/02C22C9/00C22F1/08H01L2224/43H01L2224/45147H01L2224/43848
Inventor 潘加明
Owner 安徽晋源铜业有限公司
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