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Preparation method and application of organic metal polymer

An organometallic and polymer technology, applied in the direction of hydrocarbon copolymer adhesives, adhesive types, conductive adhesives, etc., can solve the problem of easy layering of conductive metals and resins, difficult dispersion of conductive fillers, and conductive Low performance and other problems, to achieve the effect of easy operation, good dispersion and good conductivity

Active Publication Date: 2018-07-06
DONGGUAN HUARTONG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Metal-based conductive adhesives have good conductivity, but the disadvantages are high cost, easy delamination of conductive metal and resin, and short pot life; carbon-based conductive adhesives are low in cost and have an absolute price advantage, but there are difficulties in dispersing conductive fillers. , Low conductivity and other disadvantages

Method used

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  • Preparation method and application of organic metal polymer
  • Preparation method and application of organic metal polymer
  • Preparation method and application of organic metal polymer

Examples

Experimental program
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Effect test

Embodiment 1

[0031] A method for preparing an organometallic polymer, comprising the steps of:

[0032] a. Mix 1mmol polystyrene and 50mL toluene, vacuumize, and stir at 90°C for 30min. After the solution is clarified, add 1mL triethylamine and 1mL 2-bromo-2-methylpropionyl bromide, and continue stirring After 30 minutes, the solution turns black, continue to react for 10 hours, cool to room temperature to obtain reaction solution C, add methanol to the reaction solution C, precipitate, filter, wash, and dry to obtain bromine-containing polystyrene at the end group;

[0033] b. Dissolve anhydrous methanol solution with 4-dimethylaminopyridine and Na 2 NH 4 [Fe(CN) 5 dmap] mixed and vacuumed, at N 2 Warm up to 40°C under protection, react for 10 hours, cool to room temperature to obtain reaction solution D, and then use dichloromethane and n-hexane mixed solvent to precipitate the reaction solution D, filter and dry to obtain the blue iron complex, in which 4 -Dimethylaminopyridine and ...

Embodiment 2

[0046] The difference between Example 2 and Example 1 is that the preparation method of the organometallic polymer comprises the following steps:

[0047] a. Mix 5mmol polystyrene and 250mL toluene, vacuumize, and stir at 90°C for 60min. After the solution is clarified, add 10mL triethylamine and 25mL 2-bromo-2-methylpropionyl bromide, and continue stirring After 60 minutes, the solution turns black, continue to react for 24 hours, cool to room temperature to obtain reaction solution C, add methanol to the reaction solution C, precipitate, filter, wash, and dry to obtain bromine-containing polystyrene at the end group;

[0048] b. Dissolve anhydrous methanol solution with 4-dimethylaminopyridine and Na 2 NH 4 [Fe(CN) 5 dmap] mixed and vacuumed, at N 2 Warm up to 40°C under protection, react for 24 hours, cool to room temperature to obtain reaction solution D, and then use dichloromethane and n-hexane mixed solvent to precipitate the reaction solution D, filter and dry to ob...

Embodiment 3

[0051] The difference between embodiment 3 and embodiment 1 is: a kind of preparation method of organometallic polymer, comprises the following steps:

[0052] a. Mix 3mmol polystyrene and 150mL toluene, vacuumize, and stir at 90°C for 30-60min. After the solution is clarified, add 5mL triethylamine and 15mL 2-bromo-2-methylpropionyl bromide, Continue to stir for 45 minutes, after the solution turns black, continue to react for 15 hours, cool to room temperature to obtain reaction solution C, add methanol to the reaction solution C, precipitate, filter, wash, and dry to obtain polyphenylene containing bromine at the end group. vinyl;

[0053] b. Dissolve anhydrous methanol solution with 4-dimethylaminopyridine and Na 2 NH 4 [Fe(CN) 5 dmap] mixed and vacuumed, at N 2 Warm up to 40°C under protection, react for 15 hours, cool to room temperature to obtain reaction solution D, and then use dichloromethane and n-hexane mixed solvent to precipitate the reaction solution D, filt...

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Abstract

The invention belongs to the technical field of epoxy resin adhesives, and particularly relates to a preparation method and application of an organic metal polymer. The preparation method of the organic metal polymer provided by the invention is simple to operate; the prepared organic metal polymer is high in yield and pure in purity; an epoxy resin thermosetting conductive adhesive prepared fromthe organic metal polymer is prepared from the following raw materials: an epoxy resin, a flexibilizer, a curing agent and the organic metal polymer; the adhesive is easy to disperse, good in storagestability and favorable in conductivity.

Description

technical field [0001] The invention belongs to the technical field of epoxy resin glue, and in particular relates to a preparation method and application of an organometallic polymer. Background technique [0002] With the rapid development of the semiconductor integrated circuit packaging industry, it has occupied the main position of the domestic integrated circuit industry, how to choose electronic packaging materials is more important. According to the data, at present most integrated circuits and various electronic devices need various bonding materials. Among them, conductive adhesive refers to a special adhesive with certain conductive properties, which is mainly obtained by adding curing agent, conductive filler and other additives into the organic polymer matrix and cured, and has similar conductive properties to metals. [0003] According to the different types of conductive particles in the conductive adhesive, it can be divided into metal-based and carbon-based...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F12/08C08F8/42C09J9/02C09J163/00C09J125/04
CPCC08F8/42C09J9/02C09J163/00C08F12/08C08L25/04
Inventor 钟群东吴启华钟群璋朱志通
Owner DONGGUAN HUARTONG ELECTRONICS