Organic anti-oxidation method for bonding wires

A bonding wire and anti-oxidation technology, applied in the manufacturing of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of increased material hardness, unfavorable bonding, and increased production costs, and achieve excellent performance and preparation technology. Simple, low production cost effect

Inactive Publication Date: 2018-07-13
广东禾木科技有限公司
View PDF8 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, micron-sized copper bonding wires are more likely to be oxidized due to their large specific surface area, resulting in oxidation spots on the surface of the bonding wires
[0003] Oxidized bonding wires will greatly affect the conductivity and bonding of the package during EFO treatment, which is not allowed in the field of microelectronic packaging. The current general method is to coat a layer of precious metal on the metal surface For example, palladium plays a certain role in anti-oxidation, but the production cost is greatly increased, and the hardness of the material is significantly increased, which is not conducive to bonding
[0004] At present, due to the further increase in the integration of the entire microelectronics industry, and the gap left for package bonding in wire bonding is bec

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Organic anti-oxidation method for bonding wires
  • Organic anti-oxidation method for bonding wires

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0039] Example 1: An organic anti-oxidation method for bonding wires, comprising the following steps:

[0040] (1) The finished copper wire obtained by the wire drawing process is passed through a pickling tank of about 10% dilute sulfuric acid solution, and the entire passing process is guaranteed to be about 30s.

[0041] (2) The bonding wire after pickling is cleaned with deionized water and dried;

[0042] (3) Ensure that the temperature of the organic protection solution treatment tank is 25° C., the pH value is 8, the concentration of phenylimidazole is 1 g / L, and the small molecule organic acid is 3.5 mol / L, including 60% acetic acid and 40% propionic acid.

[0043] (4) Pass the above-mentioned bonding wire after drying into the organic protection solution treatment tank to ensure that the whole passing process is about 1s-3s;

[0044] (5) Air-dry the bonding wire after the coating treatment with hot air, and finally wrap the wire for storage.

[0045] Specifically, t...

Example Embodiment

[0045] Specifically, the anti-oxidation time in the air obtained in Example 1 can be maintained for about 8 months. Example 2: An organic anti-oxidation method for bonding wires, comprising the following steps:

[0046] (1) Pass the finished copper wire obtained by the wire drawing process into a pickling tank with about 10% dilute sulfuric acid solution, and the entire passing process is guaranteed to be about 30s.

[0047] (2) The bonding wire after pickling is cleaned with deionized water and dried;

[0048] (3) Ensure that the temperature of the organic protection solution treatment tank is 25° C., the pH value is 8, the concentration of benzimidazole is 1 g / L, and the small molecule organic acid is 3.5 mol / L, including 60% acetic acid and 40% propionic acid.

[0049] (4) Passing the above-mentioned dried bonding wire into the organic protection solution treatment tank to ensure that the whole passing process is about 1s-3s;

[0050] (5) Air-dry the bonding wire after th...

Example Embodiment

[0051] Specifically, the anti-oxidation time in the air obtained in Example 2 can be maintained for about 10 months. Example 3: An organic anti-oxidation method for bonding wires, comprising the following steps:

[0052] (1) The finished copper wire obtained by the wire drawing process is passed through a pickling tank of about 10% dilute sulfuric acid solution, and the entire passing process is guaranteed to be about 30s.

[0053] (2) The bonding wire after pickling is cleaned with deionized water and dried;

[0054] (3) Ensure that the temperature of the organic protection solution treatment tank is 25 ° C, the pH value is 8, the concentration of alkyl benzimidazole is 1 g / L, and the small molecule organic acid is 3.5 mol / L, wherein acetic acid 60%, propionic acid 40% %.

[0055] (4) Pass the above-mentioned bonding wire after drying into the organic protection solution treatment tank to ensure that the whole passing process is about 1s-3s;

[0056] (5) Air-dry the bonding ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Diameter sizeaaaaaaaaaa
Login to view more

Abstract

The invention discloses an organic anti-oxidation method for bonding wires. According to the method, organic anti-oxidation process treatment is added to a later period of a copper boding wire drawingprocess to solve the problem of high proneness to oxidation of micro-scale copper boding wires. Compared with the prior art, the organic anti-oxidation method has the advantages that anti-oxidation performance of the micro-scale copper boding wires can be improved greatly, so that oxidation points are not generated on the surfaces of the micro-scale copper boding wires, and high electric performance and packaging stability can be realized during microelectronic package and interconnection; the micro-scale copper boding wires obtained according to the method have excellent anti-oxidation performance, and production cost can be reduced to a great extent; the method has great promotion significance in anti-oxidation of the copper bonding wires and even in copper wire bonding and packaging markets.

Description

technical field [0001] The invention relates to the field of manufacturing bonding wires for microelectronic packaging and interconnection, in particular to an anti-oxidation method for treating micron copper bonding wires with organic matter during wire drawing. Background technique [0002] Bonding wire is one of the four key basic materials in the field of microelectronic packaging and interconnection. In the manufacturing process of bonding wire, it is necessary to gradually draw thick wires with a diameter of several thousand microns to meet the requirements of use. Micron filaments, and this process is realized by the wire drawing module installed on the wire drawing machine. However, micron-sized copper bonding wires are more likely to be oxidized due to their large specific surface area, resulting in oxidation spots on the surface of the bonding wires. [0003] Oxidized bonding wires will greatly affect the conductivity and bonding of the package during EFO treatmen...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/48H01L23/49
CPCH01L21/48H01L23/49
Inventor 崔成强张昱周章桥
Owner 广东禾木科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap