Acid and alkali resistant UV visbreaking composition, UV visbreaking film and preparation method thereof

A technology of acid and alkali resistance and composition, applied in the field of protective film, can solve the problem of insufficient tolerance in acid and alkali environment, and achieve the effect of high degree of crosslinking and curing, excellent adhesion, and simple operation process
CN108300352AInactive Publication Date: 2018-07-20SUZHOU CHENGBANG DALI MATERIAL TECH

Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
SUZHOU CHENGBANG DALI MATERIAL TECH
Publication Date
2018-07-20
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

The invention relates to the technical field of protective films, in particular to an acid and alkali resistant UV visbreaking composition, a UV visbreaking film and a preparation method thereof. Theacid and alkali resistant UV visbreaking composition is prepared from the following raw materials in percentages by weight: 25% to 45% of a polyacrylate pressure sensitive adhesive, 1% to 20% of a multifunctional oligomer and / or a multifunctional monomer, 0.1% to 1.5% of a photoinitiator, 0.1% to 2% of a curing agent and 30% to 60% of a solvent. The UV visbreaking film comprises a base material layer, a UV visbreaking layer and a release film layer which are laminated in sequence, wherein the UV visbreaking layer is obtained by coating the UV visbreaking composition on the surface of the basematerial layer and baking. The UV visbreaking composition is high in adhesive force and high in release force before UV irradiation and low adhesive force and low in UV release force after UV irradiation, and has excellent acid and alkali resistance.
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Description

technical field

[0001] The invention relates to the technical field of protective films, in particular to an acid and alkali-resistant UV viscosity-reducing composition, a UV viscosity-reducing film and a preparation method thereof. Background technique

[0002] In the production process of electronic products, such as positioning and cutting in the manufacturing process of chip electronic components, SMT components, MLCC chip capacitors and chip inductors, surface processing of semiconductor wafers, manufacturing and processing engineering of electronic and optoelectronic industry components, wafer grinding and cutting , Various silicon wafers, packaging substrates, ceramics, glass, crystal fine electronic parts carrying processing and processing and cutting of tiny parts of various materials all require auxiliary materials that can protect the product without affecting the quality of the product. Mucoreduction is one of the auxiliary materials.

[0003] At present, most o...

Claims

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