High-strength and high softening temperature low beryllium-copper alloy and preparation method thereof

Abstract

The invention relates to a high-strength and high softening temperature low beryllium-copper alloy and a preparation method thereof. The low beryllium-copper alloy is prepared from the components of,by mass, 0.2-0.5% of Be, 1.0-1.8% of Ni, 0.15-0.4% of Co, 0.5-0.8% of Ag, 0.05-0.1% of Zr, 0.02-0.05% of Mg, less than or equal to 0.1% of unavoidable impurities and the balance of Cu. The tensile strength of the prepared beryllium-copper alloy can reach 850-1000 MPa, the specific conductivity is 50-60% IACS (international annealed copper standard), the softening temperature can reach 600 DEG C orabove, and meanwhile, the alloy has the comprehensive performance of excellent high elastic stability, the low elastic aftereffect, non magnetism, abrasive resistance, corrosion resistance, plasticity and the like, and can be applied to the industries such as rail traffic, aviation, automobile, electric power, electronic engineering, and precise instrument and apparatus.

Description

technical field [0001] The invention relates to the field of alloy materials, in particular to a low beryllium copper alloy with high strength and high softening temperature and a preparation method thereof. Background technique [0002] my country's annual demand for beryllium-containing copper alloy materials is about 4000t and is increasing year by year. However, due to technical limitations, more than 80% still rely on imports. Beryllium is expensive and a highly toxic substance. The content of beryllium in low-beryllium copper alloys is 0.2% to 0.7%. It has good electrical conductivity and certain strength and is widely used, and its beryllium content is higher than that of high-strength beryllium-containing copper alloys such as TBe2. Low cost advantage and good for environmental protection. With TBe0.3-1.5, TBe0.4-1.8 and other low-beryllium copper alloys added to the national standard, low-beryllium copper alloys have received more and more attention. At present, t...

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Problems solved by technology

[0005] Among the currently disclosed low-beryllium copper alloy related patents, such as CN1616691A discloses a low-beryllium copper alloy with high hardness and good wear resistance, but its Mn, Fe, Al total content exceeds 15%, and its electrical conductivity is low. For mold and other materials

CN101981211B discloses a beryllium copper forging block material. Through plastic processing and heat treatment, the uniformity of material performance is improved, and the strength can reach more than 1100 MPa, and the performance deviation in the center, surface and directions is small, but the control range of its Be content is relatively small. Large, the upper limit is 2.0%, and the electrical conductivity is not mentioned. This type of forged block is more suitable for bearings, boxes, molds and other structural materials that have no or lower requirements for electrical conductivity.

CN102383078B discloses a high-strength and high-conductivity low-beryllium copper alloy, adding a certain amount of Nb to form strengthening particles, and its tensile strength is 1200-1400MPa. CN102719699B discloses a high-elastic low-beryllium copper alloy with a tensile strength of 800-1010MPa, the electrical conductivity of these two alloy materials is 45-60%IACS, and their strength and electrical conductivity basically meet the requirements in the field of high-strength and high-conductivity materials, but the thermal stability, especially the high-temperature softening resistance, has not been obtained. Evaluation

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