Method for preparing metal film on polyimide substrate
A polyimide, metal film technology, applied in metal material coating process, ion implantation plating, coating and other directions, can solve the problems of thick metal film curling deformation, reducing metal film resistivity, metal film curling deformation and other problems , to achieve the effect of reducing resistivity, reducing residual stress, and reducing surface defects
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0018] The specific steps for preparing a Cu film with a total thickness of 7.3 μm on a polyimide substrate are as follows:
[0019] (1) Put a polyimide film with a thickness of 50 μm in a vacuum chamber, and evacuate the vacuum chamber until the pressure in the vacuum chamber is 2.0×10 -4 Pa, and then use the ion source to carry out argon ion bombardment treatment on the polyimide film to improve the adhesion of the Cu film on the polyimide film; wherein, the argon gas flow rate is 15 sccm, the ion beam discharge voltage is 280V, and the ion beam The current is 1A;
[0020] (2) Deposit a Cu film on the polyimide film after argon ion bombardment treatment by DC magnetron sputtering method; wherein, the sputtering pressure is 0.5Pa, the argon flow rate is 40sccm, the sputtering power is 100W, and the polyimide film is Temperature 150°C, sputtering time 10min;
[0021] (3) Impact treatment of the deposited Cu film with YAG laser by lap joint method; wherein, the laser energy d...
PUM

Abstract
Description
Claims
Application Information

- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com