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A kind of transparent colorless polyimide film for amoled, preparation method and amoled device

A polyimide film and polyimide technology, applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve the problems of reducing the thermal expansion coefficient of the film, poor comprehensive performance of the film, and complicated preparation methods, etc. Achieve the effect of optimizing the reaction mechanism, high heat resistance and low thermal expansion characteristics

Active Publication Date: 2021-05-25
苏州柔彩半导体柔性材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Document 3 discloses a preparation method of a polyimide film and a polyimide film, and ester-containing groups are introduced into the main chain structure of the polyimide film resin to enhance the secondary valence bond between the main chain structures of the resin , which reduces the thermal expansion coefficient of the film, but the preparation method is more complicated, and the overall performance of the film is relatively poor

Method used

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  • A kind of transparent colorless polyimide film for amoled, preparation method and amoled device
  • A kind of transparent colorless polyimide film for amoled, preparation method and amoled device
  • A kind of transparent colorless polyimide film for amoled, preparation method and amoled device

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Experimental program
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Effect test

Embodiment 1

[0026] (1) Pass high-purity nitrogen gas into the 5L reactor, and the nitrogen flow rate must be controlled at not less than the heat flux of the volume above the liquid level of the reactor. At the same time, 2556 g of N,N-dimethylacetamide (DMAC) was added, and then the temperature of the reaction kettle was adjusted to 25°C. Gradually add 311.07g of 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, start the stirrer, the rotor speed is 100~300rpm, add 50.4g of glacial acetic acid to the above reaction kettle As a catalyst, high-purity nitrogen is continuously fed into the reactor.

[0027] (2) Keep stirring for 30-60 minutes after the reaction kettle is sealed until the powdery solid dissolves.

[0028] (3) Gradually add 148.91g of bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic dianhydride to the above mixed solution, and first stir at -10°C for 2 hours, Then it was warmed up to 25° C. and stirred continuously for 12 hours.

[0029] (4) After the stirring is completed...

Embodiment 2

[0036] (1) Pass high-purity nitrogen gas into the 5L reactor, and the nitrogen flow rate must be controlled at not less than the heat flux of the volume above the liquid level of the reactor. At the same time, 2299 g of N,N-dimethylacetamide (DMAC) was added, and then the temperature of the reaction kettle was adjusted to 25°C. Gradually add 192.14g of 2,2'-bis(trifluoromethyl)diaminobiphenyl, start the stirrer, the rotor speed is 100~300rpm, add 50.4g of glacial acetic acid as a catalyst to the above reaction kettle, Continuously feed high-purity nitrogen.

[0037](2) Keep stirring for 10 minutes after the reaction kettle is sealed until the powdery solid dissolves.

[0038] (3) Add 222.51 g of 4,4'-(hexafluoroisopropylidene) phthalic anhydride to the above mixed solution, stir at -10°C for 2 hours, then return to 25°C and Stirring was continued for 12 hours.

[0039] (4) After the stirring is completed, a polyimide prepolymer (PAA) slurry with a solid concentration of 15 ...

Embodiment 3

[0045] Except that the 4,4'-(hexafluoroisopropylidene) phthalic anhydride of 222.51g of Example 2 is replaced by 1,2,3,4-cyclobutanetetracarboxylic dianhydride of 117.66 g, to implement Example 3 was carried out in the same manner as Example 2, and the imidization of the obtained polyimide film was not less than 99%. Its polyimide structure is shown in formula III:

[0046]

[0047] Formula III.

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Abstract

The invention relates to a transparent colorless polyimide (Transparent Polyimide; TPI) material for AMOLED and a preparation method thereof. The transparent colorless polyimide material is a film prepared from a polyimide prepolymer, wherein the transparent colorless polyimide prepolymer is polymerized by amines and acid anhydrides under glacial acetic acid, and the The above-mentioned polyimide prepolymer is casted, and then thermally imidized to obtain a transparent colorless polyimide film. The invention prepares a polyimide film with high heat resistance and high mechanical strength, its glass transition temperature is not lower than 300°C, its coefficient of thermal expansion (CTE) is <30 ppm / °C (100-200°C), and its mechanical strength is extremely high. The tensile strength is not lower than 150MPa, and the Young's modulus is not lower than 4 GPa, which can be used as a flexible AMOLED touch substrate.

Description

technical field [0001] The invention relates to a polyimide film, a film preparation method and an AMOLED device, in particular to a preparation method for improving the polymerization degree of transparent colorless polyimide for AMOLED. Background technique [0002] Polyimide is one of the organic polymer materials with the best comprehensive performance. The rapid development of modern light-emitting devices AMOLED requires polyimide to have high thermal stability, good mechanical properties, and high optical properties. Improving the comprehensive performance of these three aspects plays an important role in light-emitting devices (such as OLED, AMOLED, etc.). At present, the transmittance of many polyimide films is less than 50% at 500nm, and 100% absorbed at 400nm. The overall transmittance in the visible light region is low, and the film appears dark yellow or brown. On the other hand, due to the poor reactivity of the monomer, the degree of polymerization of the mo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08J5/18C08G73/12C08G73/10H01L27/32H01L51/00H10K99/00
CPCC08G73/1021C08G73/1028C08G73/1067C08G73/1078C08G73/124C08J5/18C08J2379/08H10K59/12H10K77/111Y02E10/549
Inventor 游丰兆赵冬兵曾吉永
Owner 苏州柔彩半导体柔性材料科技有限公司
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