Method for preparing barium titanate/polyvinylidene fluoride composite material

Abstract

The invention discloses a method for preparing a barium titanate/polyvinylidene fluoride composite material. The method comprises the following steps: 15 g BT particles and 350 ml of a hydrogen peroxide solution are added into a three-mouth flask and dispersed for 20 minutes by ultrasonic wave, a reaction system is heated to 106 DEG C, a reaction is carried out for 6 hours under mechanical stirring, a suspension is cooled and then filtered and washed, finally, the product is dried in an oven at the temperature of 80 DEG C, and then is ground by a grinder to obtain the white powder, a proper amount of BT powder and a DMF solution are added into the three-mouth flask , after ultrasonic dispersion for about 30 minutes, the powder is put into a water bath at the temperature of 70 DEG C, an appropriate amount of PVDF powder is added to a reaction system, is continuously reacted for 2h and then cooled to room temperature, the obtained white viscous liquid is spread on the glass plate, the glass plate is moved to an vacuum oven to remove bubbles, the glass plate is put into a blast oven to dry, and a white composite film is obtained. The dielectric constant and loss factor of the composite material are low, the breakdown strength is high, and the frequency stability and temperature stability are better.

Description

technical field [0001] The invention relates to the technical field of composite material preparation, in particular to a preparation method of barium titanate / polyvinylidene fluoride composite material. Background technique [0002] With the rapid development of the electronic industry, its components are required to have a smaller size. Current capacitors are soldered directly on the surface of the circuit board, so the capacitor occupies a large area in the integrated circuit. The high dielectric constant material can make the prepared capacitor have a smaller volume, thereby reducing the size occupied by the capacitor on the integrated circuit board, which is beneficial to the miniaturization of the integrated circuit, so it has important application value. [0003] In recent years, polymer-based high dielectric constant composite materials have attracted the attention of researchers. It is expected that by blending inorganic particles with high dielectric constant with...

AI Technical Summary

Problems solved by technology

However, this material also has its limitations. First, the dielectric constant of this material usually has poor temperature stability.

Secondly, the loss factor of the PVDF material itself is large, which will cause it to bring a lot of heat during the application process, thus affecting the performance of its composite material

[0004] Although many researchers have attempted to affect the dielectric constant, dissipation factor, thermal stability and many other properties of composite materials by adding different filler particles to various polymer matrices, few scholars have paid attention to the impact of the interface of composite materials on The influence of its dielectric properties, in fact, the interface properties can change the performance of composite materials to a large extent