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Silicon-containing curable composition and its cured product

A curable composition and compound technology, which is applied in the field of cured products, can solve the problems of heat resistance, light resistance, crack resistance, coloring property, adhesiveness, poor adhesion of silver matrix or copper matrix, etc.

Active Publication Date: 2021-06-18
ADEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, although these proposed technologies have their own characteristics, they still cannot satisfy the heat resistance, light resistance, crack resistance, colorability, adhesiveness, etc. required for materials in the recent electronic information field.
Among them, poor adhesion to silver substrates, copper substrates, etc. has become a major problem

Method used

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  • Silicon-containing curable composition and its cured product
  • Silicon-containing curable composition and its cured product
  • Silicon-containing curable composition and its cured product

Examples

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Embodiment

[0201] Hereinafter, the present invention will be further described with examples and the like, but the present invention is not limited to these examples and the like. It should be noted that "parts" or "%" in the examples are based on mass basis.

[0202] Table 1

[0203]

[0204] *1: Organosilicon compounds having carbon-carbon double bonds reactive with SiH groups, silicon-containing polymers containing units represented by general formula (4)

[0205] *2: Organosilicon compounds having carbon-carbon double bonds reactive with SiH groups, linear siloxane compounds containing two or more carbon-carbon double bonds reactive with SiH groups in one molecule ( Weight average molecular weight 12,000)

[0206] *3: Organic compounds having carbon-carbon double bonds reactive with SiH groups

[0207] *4: Compounds of the above (B-α)

[0208] *5: A siloxane compound represented by the following [Chemical Formula 27] (synthesized by the method disclosed in JP-A-2013-079328)

manufacture example 1A-1

[0209] [Production Example 1] Synthesis of A-1

[0210]In a 2000ml four-necked flask with a cooling tube and a stirring device, 0.5mol of vinyltrimethoxysilane as (a) component, 0.5mol of methyltrimethoxysilane as (b) component, and 0.5mol of methyltrimethoxysilane as (c) 0.25 mol of dimethyldimethoxysilane as the component, 1.0 mol of phenyltrimethoxysilane as the component (d), and 650 g of toluene were added dropwise to 31.4 g of 0.5% sodium hydroxide aqueous solution over 30 minutes while stirring, and the The dehydration polymerization reaction was carried out at 60-65°C for 3 hours. After cooling to room temperature, 600 g of toluene and 1,500 g of ion-exchanged water were added to extract the oil layer, washed with water until it became neutral, and then the solvent was removed to obtain 232.6 g (white powder) of silicon-containing polymer A-1 as component (A). The weight average molecular weight (Mw) of the silicon-containing polymer A-1 was analyzed by GPC under the ...

manufacture example 2B-1

[0214] [Production Example 2] Synthesis of B-1

[0215] Add 100 parts of 1,3,5,7-tetramethylcyclotetrasiloxane, 100 parts of divinylbenzene, 60 parts of toluene and 0.0005 parts of platinum-carbonylvinylmethyl complex (Ossko catalyst) while stirring Side reflux for 5 hours. The solvent was distilled off from the reaction liquid under reduced pressure at 70° C. to obtain prepolymer B-1 as the (B) component.

[0216] As a result of GPC analysis under the above conditions, the weight average molecular weight of prepolymer B-1 was Mw = 140,000 (in terms of polystyrene), according to 1 In H-NMR, the content of the hydrosilyl group (Si—H group) was 5.3 mmol / g.

[0217] [chemical formula 27]

[0218] B-2

[0219]

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Abstract

A silicon-containing curable composition, characterized in that it contains the following components: (A) component: a compound having a carbon-carbon double bond reactive with an SiH group; (B) component: a silicon compound having a SiH group Oxygen compound; (C) component: the silane compound represented by following general formula (1); (D) component: filler. (where, R 1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, A represents an alkanediyl group having 1 to 10 carbon atoms, and k represents a number of 2 or 3. )

Description

technical field [0001] The present invention relates to a silicon-containing curable composition and a cured product obtained by curing the composition. The silicon-containing curable composition of the present invention and its cured product are useful for materials used in semiconductors, particularly packages and lead frames for LEDs and the like. Background technique [0002] Various studies have been conducted on silicon-containing compounds, and industrially, polysiloxane compounds represented by silicone resins have also been used for a long time. However, although silicone resins are excellent in heat resistance and flexibility, their use is limited due to pollution problems in electronic component manufacturing processes and the like because they contain many outgas components (volatile components). [0003] In addition, in recent years, in the field of electronic information, due to the development of technology, various materials to be used are also required to h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/05C08K3/013C08K5/548
CPCC08K3/00C08K5/548C08K3/013C08G77/20C08K5/5415C08L83/04
Inventor 齐藤宏一高田健作平塚一郎柏崎史
Owner ADEKA CORP