Waterproof and heat-conductive sealing hot melt adhesive for chips and preparation method of waterproof and heat-conductive sealing hot melt adhesive

Abstract

The invention discloses a waterproof and heat-conductive sealing hot melt adhesive for chips and a preparation method of the waterproof and heat-conductive sealing hot melt adhesive. The waterproof and heat-conductive sealing hot melt adhesive comprises the following raw materials in parts by weight: 30-40 parts of a styrene butadiene isoprene block copolymer, 2-4 parts of monoglyceride stearate,50-70 parts of polyamide resin, 10-20 parts of phenol-ketone resin, 20-40 parts of an adhesion-promoting base adhesive, 5-7 parts of a coupling agent, 10-16 parts of a heat-conductive additive, 1-2 parts of an antioxidant, 5-10 parts of modified aromatic amine, 10-14 parts of flame retardant additives, 0.5-1.5 parts of a stabilizer, 0.4-0.8 parts of anti-aging additives and 3-5 parts of film forming additives. The waterproof and heat-conductive sealing hot melt adhesive provided by the invention has good adhesion, strong stability, excellent heat conductivity, good heat stability, excellent aging resistance, acid and alkali resistance and fire retardance, high curing speed, and good waterproofing and sealing performance, is applied in the field of adhesives for chip packaging, and has relatively high practical value and good application prospects.

Description

technical field [0001] The invention relates to the technical field of hot-melt adhesive materials, in particular to a waterproof and heat-conducting sealing hot-melt adhesive for chips and a preparation method thereof. Background technique [0002] With the rapid development of electronic science and technology, electronic components, devices, instruments and meters have been widely used in the electronic industry. Since the working environment of many electronic devices is complex and changeable, and sometimes even encounters extremely harsh natural conditions, in order to protect electronic components and integrated circuits from the working environment and improve the electrical performance and stability of electronic devices, it is often necessary to For potting protection. Potting is one of the important processes in the assembly of electronic devices. It is to fill the gaps of electronic devices with potting materials by mechanical or manual methods, and process them...

AI Technical Summary

Problems solved by technology

[0003] Ordinary chip potting adhesives have disadvantages such as low thermal conductivity, poor flame retardancy and poor bonding performance, which seriously affect the scope of application, although the performance of potting adhesives can be improved by adding a large amount of thermally conductive fillers, flame retardants and adhesives , but it will have an adverse effect on the mechanical properties and processing properties of the potting compound. At the same time, a large amount of heat will be generated when the chip is working, and the existing sealant cannot withstand higher ambient temperatures. Materials in high temperature and high humidity environments It is easy to be oxidized, has a short service life and needs frequent maintenance