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Epoxy resin composition for sealing semiconductor device and semiconductor device sealed by using same

A technology of epoxy resin and composition, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electric solid-state devices, etc., which can solve the problem of reduced interface bonding strength, cracks in semiconductor devices, and difficulties in ensuring the bonding strength of PPF lead frames, etc. problem, to achieve the effect of good crack resistance and good bond strength

Active Publication Date: 2021-01-29
SAMSUNG SDI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the decrease in interfacial adhesive strength causes delamination of encapsulation materials, thereby causing cracks in semiconductor devices
Although an amine coupling agent is added to the epoxy resin composition to improve the adhesive strength at the interface between the semiconductor device and the encapsulation material in the related technical field, it is difficult for this epoxy resin composition to ensure relative to the PPF lead frame sufficient adhesive strength

Method used

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  • Epoxy resin composition for sealing semiconductor device and semiconductor device sealed by using same
  • Epoxy resin composition for sealing semiconductor device and semiconductor device sealed by using same
  • Epoxy resin composition for sealing semiconductor device and semiconductor device sealed by using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 to 5 and comparative example 1 to 2

[0176] The components weighed as shown in Table 1 were uniformly mixed at 25°C to 30°C for 30 minutes using a Henschel mixer (KSM-22, KEUM SUNG MACHINERY CO.LTD.), and were heated at 110°C (max. ) for 30 minutes, followed by cooling to 10° C. to 15° C. and pulverizing, thereby preparing an epoxy resin composition for encapsulating a semiconductor device.

[0177] [Table 1]

[0178]

[0179] [Unit: wt%]

[0180] The following properties of the epoxy resin compositions prepared in Examples 1 to 5 and Comparative Examples 1 and 2 were evaluated and the measurement results are shown in Table 2.

[0181] property evaluation

[0182] (1) Fluidity (inches): According to EMMI-1-66, using a transfer molding machine, in the test mold at 70kgf / cm 2 The flow length of each epoxy resin composition was measured at 175°C under a load of . Higher numbers indicate better liquidity.

[0183] (2) Glass transition temperature (°C): Using a thermomechanical analyzer (TMA), the glass transi...

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Abstract

The present invention relates to an epoxy resin composition for sealing a semiconductor device and a semiconductor device sealed by using the same, the epoxy resin composition comprising an epoxy resin, a curing agent, an inorganic filler, and a triazine compound represented by chemical formula 8.

Description

technical field [0001] The present invention relates to an epoxy resin composition for packaging a semiconductor device and a semiconductor device packaged using the same. More particularly, the present invention relates to an epoxy resin composition for encapsulating a semiconductor device and a semiconductor device encapsulated using the same, the epoxy resin composition having good crack resistance and for lead frames formed of various materials (leadframe, lead frame) good adhesive strength. Background technique [0002] Recently, lead (Pb) contained in discarded electrical / electronic products has been found to have adverse effects on the human body, and the elution amount of lead (Pb) per liter of groundwater is regulated to 0.05 to 0.3 mg in many countries. In particular, the use of lead is actively being legislated in Europe, and under the Restriction of Hazardous Substances (RoHS), the use of inorganic elements such as lead, mercury, cadmium, and hexavalent chromium...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08K5/3492C08L63/00H01L23/29H01L23/495C08K5/00C08K3/013
CPCC08K3/00C08K5/00C08K5/3492C08L63/00H01L23/29H01L23/495
Inventor 赵芝允裴庆徹尹祉儿李英俊
Owner SAMSUNG SDI CO LTD