Method for recycling copper and nickel in electroplating sludge
A recycling method, electroplating sludge technology, applied in the direction of improving process efficiency, etc., can solve problems such as difficult wastewater treatment, and achieve the effect of high degree of automation, strong adaptability and mature technology
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0010] Example 1, a method for recovering copper and nickel in electroplating sludge. The step 1 to separate copper is as follows: adjust the leachate (hereinafter referred to as mother liquor) to pH=5-5.5 with sodium carbonate solution, and filter the precipitate to be mainly alkali Formula copper carbonate and copper hydroxide.
Embodiment 2
[0012] A method for recovering copper and nickel in electroplating sludge, the step 2 of iron-nickel co-precipitation and iron is as follows: the mother liquor is adjusted to pH=8-9 with sodium carbonate solution, and the precipitate is nickel carbonate, iron hydroxide, hydrogen Ferrous oxide, add sulfuric acid and hydrogen peroxide to completely dissolve the precipitate and adjust with lye) pH=5 to filter out the precipitate, which is ferric hydroxide.
Embodiment 3
[0014] A method for recovering copper and nickel in electroplating sludge. Step 3 of the purification and separation of nickel products is specifically: taking the above filtered mother liquor and adjusting pH=2 with sulfuric acid and passing hydrogen sulfide into it to convert the copper in the mixed solution into sulfide Copper is separated, and the mother liquor at this time is nickel sulfate mother liquor, and nickel sulfate heptahydrate can be produced by the method of concentrated crystallization.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com