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Thin film deposition device for volatile and corrosive substance and catalytic reaction test device based on ultrahigh vacuum condition

A thin film deposition device and corrosive substance technology, applied in vacuum evaporation plating, chemical analysis by catalysis, ion implantation plating, etc., can solve the problems of inaccurate activity test, restricted structure-performance, background pollution, etc. Achieve the effect of avoiding pollution and negative impact, realizing pollution-free transfer, and avoiding background pollution

Active Publication Date: 2018-10-16
DALIAN INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The reason is that these volatile compounds have a very high vapor pressure at a lower temperature, which will cause the entire ultra-high vacuum chamber to be easily polluted by volatile substances. On the other hand, the corrosive gas that needs to be introduced, Has a strong corrosive effect on electronic and metal components
The combined action of the two leads to the destruction and difficulty of maintaining ultra-high vacuum, and also causes irreversible failures such as circuit short circuit and pollution in vacuum precision instruments.
This makes the preparation of volatile compounds and the precise analysis of the surface structure very difficult, and also restricts the progress of material characterization and synthesis preparation technology
[0004] On the other hand, many surface analysis techniques can give precise structural information on the surface, but they can only operate in the ultra-high vacuum range, while conventional chemical processes are at close to atmospheric pressure or higher pressure
This makes it impossible to test catalytic reactions in ultra-high vacuum systems
However, the existing commercial catalytic reaction chambers usually use radiation sources for integral heating, which will cause the background of the chamber to be heated together, resulting in serious uncontrollable background pollution.
These background contaminations are likely to alter the reactivity of clean test samples, thus causing inaccurate activity measurements
This also makes it difficult to directly correlate the obtained sample surface structure information with the activity of the catalytic reaction, which also restricts the exact correlation between the structure and performance of the catalyst sample.

Method used

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  • Thin film deposition device for volatile and corrosive substance and catalytic reaction test device based on ultrahigh vacuum condition
  • Thin film deposition device for volatile and corrosive substance and catalytic reaction test device based on ultrahigh vacuum condition
  • Thin film deposition device for volatile and corrosive substance and catalytic reaction test device based on ultrahigh vacuum condition

Examples

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Effect test

Embodiment 1

[0087] The thin film deposition device based on volatile and corrosive substances under ultra-high vacuum conditions can deposit low-melting point metal Zn oxide ZnO thin film samples, and then transfer them to the ultra-high vacuum system for structural analysis without affecting the ultra-high vacuum system.

[0088] The deposition device based on the volatile sample thin film under ultra-high vacuum condition is connected with the ultra-high vacuum system. Raise the Zn evaporation source to a suitable temperature (~200)°C for degassing. The clean substrate samples (such as Pt(111), Au(111), Cu(111), etc.) prepared in the ultra-high vacuum system can be directly transferred to the growth chamber of the device through the sample transfer rod, and the equipment and the ultra-high Gate valves for vacuum systems. Adjust the position of the substrate sample and the evaporation source through the three-dimensional operation table. Introduce high-purity O through a vacuum leak va...

Embodiment 2

[0090] Based on the thin film deposition device of volatile corrosive substances under ultra-high vacuum conditions, corrosive H 2 MoS in S atmosphere 2 The deposition of thin film samples is then introduced into the ultra-high vacuum system for structural analysis without affecting the ultra-high vacuum system.

[0091] The thin film deposition device for volatile and corrosive substances based on ultra-high vacuum conditions is connected with an ultra-high vacuum system. In the growth chamber, the ion source and Ar can be used to etch the gold single crystal in situ to obtain the Au single crystal substrate that meets the requirements. Raise the Mo source to a suitable temperature (~1800°C) for degassing. Adjust the position of the substrate sample and the evaporation source through the three-dimensional operation table. Inject high-purity H through a vacuum leak valve 2 S(99.999%) to 1×10 -6 mbar, deposited MoS 2 Film to proper coverage. then close H 2 S gas. The c...

Embodiment 3

[0094] In the present invention, based on the catalytic reaction test device under the ultra-high vacuum condition, the catalytic reaction test of the sample in the ultra-high vacuum system can be carried out under the condition of close to the atmospheric pressure, and the reacted sample is then introduced into the ultra-high vacuum system for structural analysis without the need for ultra-high vacuum. The vacuum system is affected. The catalytic reaction test device based on the ultra-high vacuum condition is connected with the ultra-high vacuum system. The clean substrate samples (such as FeO / Pt(111), FeO / Au(111)) prepared in the ultra-high vacuum system can be directly transferred to the reaction chamber through the sample transfer rod, and the connection between the device and the ultra-high vacuum system is closed. Gate valve. Open the gas inlet in the reaction chamber to introduce CO and O at an atmospheric pressure 2 The mixed gas, record the initial reaction gas pre...

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Abstract

The invention relates to a thin film deposition device for a volatile and corrosive substance and catalytic reaction test device based on the ultrahigh vacuum condition. The thin film deposition device for the volatile and corrosive substance based on the ultrahigh vacuum condition comprises a main sample transfer cavity, a growth cavity, a three-dimensional sample control console, an evaporationsource and the like which can be used for the deposition of thin films of the volatile and corrosive substance, wherein a cavity external assembly comprises a gas inlet system and a gas exhaust unit,and the gas inlet system can be used for introducing the chemical atmosphere required by deposition. The catalytic reaction test device based on the ultrahigh vacuum condition comprises a reaction cavity and a rapid sample feeding chamber, wherein the reaction cavity comprises a sample temperature control table, a sample heating source adopts a replaceable heating sheet so that background interference in the reaction can be reduced and accurate catalytic reaction activity tests at different temperatures can be realized; and a cavity external assembly comprises a gas inlet system, and the gas inlet system can be used for introducing chemical reaction gas. The thin film deposition device and catalytic reaction test device are suitable for preparation of the thin films of the various volatileand corrosive substances, and are connected with various ultrahigh vacuum analysis instruments so as to realize accurate test of the reaction activity of the catalyst.

Description

technical field [0001] The invention relates to a test device for thin film deposition and catalytic reaction of volatile corrosive substances under ultra-high vacuum conditions, and belongs to the technical field of thin film deposition and catalytic activity testing. Background technique [0002] Generally speaking, the growth and preparation process of thin films is usually grown by molecular beam epitaxy. It is necessary to evaporate the precursor of the target element to the gaseous state, and then deposit it on the surface of the sample by molecular beam sputtering in a certain chemical atmosphere. Then analyze the surface structure. Using sophisticated surface instruments operating under ultra-high vacuum conditions, such as photoelectron spectroscopy (XPS), low-energy electron diffraction (LEED), Auger electron spectroscopy (AES) and scanning tunneling microscopy (STM), the atomic structure of thin films can be obtained A clear and exact pointer can provide valuable...

Claims

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Application Information

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IPC IPC(8): C23C14/24C23C14/54G01N31/10
CPCC23C14/0021C23C14/24C23C14/54G01N31/10
Inventor 杨帆包信和刘云张毅黄武根
Owner DALIAN INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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