High-thermal conductivity epoxy resin-based boron nitride nano-tube composite insulating material prepared by electric field regulation

An insulating material and epoxy resin technology, which is applied in the field of preparation of high thermal conductivity epoxy resin-based boron nitride nanotube composite insulating materials, can solve problems such as low thermal conductivity of pure epoxy resin, and achieve long-lasting safe operation, Stable electrical insulation performance and good universality

Inactive Publication Date: 2018-10-23
深圳市圳田科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of pure epoxy resin is very low, only about 0.184W / (m K)

Method used

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  • High-thermal conductivity epoxy resin-based boron nitride nano-tube composite insulating material prepared by electric field regulation
  • High-thermal conductivity epoxy resin-based boron nitride nano-tube composite insulating material prepared by electric field regulation
  • High-thermal conductivity epoxy resin-based boron nitride nano-tube composite insulating material prepared by electric field regulation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Example 1: Preparation of high thermal conductivity epoxy resin-based boron nitride nanotube composite insulating material under electric field regulation

[0027]

[0028] The specific preparation method is as follows:

[0029] 1) After drying and vacuuming bisphenol F epoxy resin, curing agent methyl hexahydrophthalic anhydride, accelerator benzyldimethylamine, filler and silane coupling agent, let it stand still, and put the mold into an oven to preheat at 80°C;

[0030] 2) Mix the epoxy resin and the curing agent methyl hexahydrophthalic anhydride, then add the silane coupling agent, stir thoroughly, vacuumize and defoam and let stand;

[0031] 3) The filler boron nitride nanotubes are added to the mixture in step 2), and after being fully stirred, vacuum pumping and degassing are carried out;

[0032] 4) ultrasonically vibrate the mixture of step 3);

[0033] 5) After adding accelerator benzyldimethylamine to the mixture in step 4), fully stir and vacuumize an...

Embodiment 2

[0035] Example 2: Preparation of high thermal conductivity epoxy resin-based boron nitride nanotube composite insulating material under electric field regulation

[0036]

[0037] Embodiment 2 preparation method is the same as embodiment 1.

Embodiment 3

[0038] Example 3: Preparation of high thermal conductivity epoxy resin-based boron nitride nanotube composite insulating material under electric field regulation

[0039]

[0040] The preparation method is the same as in Example 1.

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Abstract

The invention discloses a high-thermal conductivity epoxy resin-based boron nitride nano-tube composite insulating material prepared by electric field regulation. An electric field is applied in the curing process of the material, and the oriented and orderly arrangement of a thermal conduction filler in the composite material is realized by electric field regulation. The material has an excellentthermal conductivity, can meet heat dissipation requirements of power components, has a stable electrical insulating performance, and can ensure the lasting and safe running of electrical and electronic equipment. A preparation method of the material has the advantages of simple processing process and good universality, and allows the high-thermal conductivity epoxy resin-based boron nitride nano-tube composite insulating material to be easily prepared.

Description

technical field [0001] The invention relates to a high thermal conductivity insulating material, in particular to a method for preparing a high thermal conductivity epoxy resin-based boron nitride nanotube composite insulating material under the control of an electric field. During the curing process of the material, an electric field is applied to carry out directional and effective configuration of the filler , forming an effective heat conduction network chain, thereby improving the thermal conductivity of the composite material. Background technique [0002] Epoxy resins are widely used in electrical equipment insulation and microelectronic equipment packaging due to their corrosion resistance, excellent adhesion, excellent dielectric properties, and processability. However, the thermal conductivity of pure epoxy resin is very low, only about 0.184W / (m·K). Therefore, in order to improve the heat dissipation capability of high power density electrical and electronic equi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K7/24C08K5/54C08G59/42C08G59/68
CPCC08K7/24C08G59/4215C08G59/686C08K5/54C08K2201/011C08L63/00
Inventor 田付强
Owner 深圳市圳田科技有限公司
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