Suspension polishing device with adjustable pressure

Abstract

The invention relates to a suspension polishing device with the adjustable pressure, and belongs to the field of ultra-precision polishing. The suspension polishing device comprises a magnetic-suspension micro-displacement mechanism, a polishing plate mechanism, a fixture maintenance platform mechanism and a motor transmission mechanism; a first electromagnet and a second electromagnet are mountedat the bottoms of a polishing plate and a polishing container, the polishing plate is fixed at the upper end of a polishing tray, and a second spindle is fixed at the lower end of the polishing tray;the fixture maintenance platform is fixed on the wall of the polishing container through a fixing piece, a rotating fixture is placed on the bottom platform in a hole in the fixture maintenance platform, a workpiece maintenance plate is clamped in the rotating fixture, a pressure sensor is arranged at the bottom of the workpiece maintenance platform, and a sliding block of a gear transmission part is connected with a groove of the fixture maintenance platform and meshed with the gear teeth of the rotating fixture; and a motor is mounted on a supporting frame, and a motor shaft penetrates through a rolling bearing and is connected with a gear tooth rotating part through a coupling, a flat key and a first spindle. The suspension polishing device effectively solves the problem of poor quality of the polishing surface due to the pressure instability and improves the polishing quality.

Description

technical field [0001] The invention relates to a pressure-adjustable float-off polishing device, in particular to a pressure-adjustable float-off polishing device for processing optical components and semiconductor optical surfaces, and belongs to the field of ultra-precision polishing. Background technique [0002] With the development of optical technology and microelectronics technology, the surface accuracy of required materials (single crystal silicon, single crystal germanium, silicon carbide, etc.) higher and higher requirements. In the field of ultra-large-scale integrated circuits, the surface of a single crystal silicon semiconductor substrate is required to achieve an ultra-smooth surface (meaning that the root mean square surface roughness is less than 1 surface) standard. Since monocrystalline silicon is a hard and brittle material, it is difficult to process by general processing methods, and cracks and brittle broken rings are easily generated during proce...

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a pressure-adjustable float-off polishing device, which can change the distance between the polishing disc and the workpiece by using the closed-loop control principle to regulate the magnetic force of the electromagnet, so as to keep the surface pressure of the workpiec

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