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Laser Scanning Removal Method for Improving the Edge Quality and Performance of Metal Mesh

A metal grid and laser scanning technology, which is applied in metal processing equipment, laser welding equipment, welding equipment, etc., can solve the problem of the decrease of the light transmittance of the metal grid type transparent electrode, the uneven edge of the metal grid line, and the impact on the integrated optoelectronics. Performance and other issues, to achieve the effect of edge smoothing, thermal impact relief, and performance optimization

Active Publication Date: 2020-03-31
JIANGSU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is simple to operate and has good controllability. However, in this method, the laser beam is scanned line by line in the form of a single line (ie, line cycle scanning) to achieve localized removal of the metal layer. The metal layer obtained by this scanning method The edges of the grid lines are usually uneven, and some metal residues will be produced, and the metal residues will reduce the light transmittance of the metal grid-type transparent electrode, and ultimately affect its comprehensive optoelectronic performance

Method used

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  • Laser Scanning Removal Method for Improving the Edge Quality and Performance of Metal Mesh
  • Laser Scanning Removal Method for Improving the Edge Quality and Performance of Metal Mesh
  • Laser Scanning Removal Method for Improving the Edge Quality and Performance of Metal Mesh

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Experimental program
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Effect test

Embodiment 1

[0040] Quartz glass was selected as the substrate. First, the quartz glass substrate was cleaned, and the substrate was ultrasonically cleaned in deionized water, acetone, and absolute ethanol for 10 min, and then dried in a nitrogen stream. Then the cleaned quartz glass substrate is placed on the sample stage of a magnetron sputtering coater, and the Ag (Ag Target purity was 99.99%). Then place the Ag / glass on the sample stage of the laser, adjust the position of the sample stage so that the focus of the laser beam emitted by the laser is located at 1.0mm above the surface of the Ag / glass after being focused by the lens, and the laser beam is drawn according to the line cycle drawn by the EZCAD software. The square array and frame series square array are scanned and removed on the Ag / glass surface with a line overlap rate of 56%. The scanning and removal methods are as follows:

[0041] for figure 1 (a) The linear circular block array shown in (a) is removed by linear circu...

Embodiment 2

[0046] Quartz glass is used as the substrate. First, the quartz glass substrate is cleaned, and then the cleaned quartz glass substrate is placed on the sample stage of the magnetron sputtering coating apparatus, and the sputtering power of 30W, the sputtering pressure of 4Pa, and the atmosphere of argon are placed on the quartz glass substrate. 100 nm of Ag was sputtered on the glass surface (Ag target purity 99.99%). Then place the Ag / glass on the sample stage of the laser, adjust the position of the sample stage so that the focus of the laser beam emitted by the laser after being focused by the lens is located at 1.0mm above the surface of the Ag / glass, and the laser beams are drawn according to the EZCAD software. Arrays and frame-type series of square arrays are scanned and removed on the Ag / glass surface with a line overlap rate of 56%. The scanning and removal methods are as follows:

[0047] for figure 1 (a) The linear circular block array shown in (a) is removed by ...

Embodiment 3

[0052] Choose quartz glass as the substrate, firstly clean the quartz glass substrate, then place the quartz glass substrate on the sample stage of the magnetron sputtering coating apparatus, under 30W sputtering power, 4Pa sputtering pressure, argon gas 400nm Ag was sputtered on the quartz glass surface under the atmosphere (the purity of the Ag target is 99.99%). Then place the Ag / glass on the sample stage of the laser, adjust the position of the sample stage so that the focus of the laser beam emitted by the laser after being focused by the lens is located at 1.0mm above the surface of the Ag / glass, and the laser beams are drawn according to the EZCAD software. Arrays and line-type compound square arrays inside the outer frame are scanned and removed on the Ag / glass surface with a line overlap rate of 56%. The scanning and removal methods are as follows:

[0053] for figure 1 (a) The linear circular block array shown in (a) is removed by linear circular scanning;

[0054]...

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Abstract

The invention provides a laser scanning removing method for improving the edge quality and performance of a metal mesh. The method comprises the steps of firstly, drawing a frame type series square block array or an outer frame inner line type combined square block array, wherein each square block in the frame type series square block array is formed by nesting a plurality of different sizes of squares or rectangles, each square block in the outer frame inner line type combined square block array is composed of a plurality of parallel straight lines and a square or a rectangle surrounding theperiphery of the straight lines; secondly, removing an edge contour outer frame of each removed area to a preset depth, then shrinking outer frames and gradually removing the interiors of the outer frames for the frame type series square block array; forming an initial mesh shape through a line type scan-round removal method and then removing the uneven parts of the edges of meshes through outer frame scanning. Through the laser scanning removing method, the heat effect of are edge removal can be effectively relieved, the dimensional accuracy and resolution ratio of the metal mesh can be improved, the area edge removal quality can be improved, and the light transmittance of metal mesh type transparency electrodes can be improved.

Description

technical field [0001] The invention relates to the fields of laser processing technology and photoelectric functional materials, in particular to a laser scanning removal method for improving the edge quality and performance of metal grids. Background technique [0002] With the gradual depletion of coal, oil and other primary energy sources and the impact of their combustion on environmental degradation, human beings urgently need an environmentally friendly renewable energy source. As a clean, safe and renewable energy source, solar energy has attracted widespread attention. As an essential part of solar cells, transparent electrodes directly affect the performance of solar cells. Therefore, the research and development of high-performance transparent electrodes is of great significance to improve the performance of solar cells. At present, the common transparent electrode materials mainly include graphene, carbon nanotubes (CNTs), transparent conductive oxides (TCOs), ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/60B23K26/36B23K26/70
CPCB23K26/36B23K26/60B23K26/702
Inventor 李保家李皇黄立静任乃飞王轶伦王永瑛王天宇
Owner JIANGSU UNIV