Silica gel gasket with high heat conductivity and method for preparing silica gel gasket

Abstract

The invention discloses a silica gel gasket with high heat conductivity and a method for preparing the silica gel gasket. The silica gel gasket with the high heat conductivity comprises, by weight, 5-10 parts of methyl vinyl silicone rubber, 5-15 parts of white carbon black, 30-50 parts of silicon carbide, 80-600 parts of boron nitride, 10-30 parts of hydroxyl silicone oil, 5-15 parts of chloroplatinic acid, 10-20 parts of modified graphite, 3-8 parts of benzoyl peroxide and 2-5 parts of bis-di-penta-vulcanizing auxiliaries. The method for preparing the silica gel gasket with the high heat conductivity includes steps of (1), uniformly alternately adding heat conduction fillers, reinforcement fillers, coupling agents and the like into the methyl vinyl silicone rubber and uniformly mixing the methyl vinyl silicone rubber, the heat conduction fillers, the reinforcement fillers, the coupling agents and the like with one another to obtain first mixtures, gradually adding a vulcanizing agent(the benzoyl peroxide) and vulcanizing auxiliaries into the first mixtures, and mixing the vulcanizing agent, the vulcanizing auxiliaries and the first mixtures with one another on a mixing mill forapproximately 2 h to uniformly disperse various component fillers in methyl vinyl silicone rubber matrixes; (2), allowing mixed silicone rubber materials to stand still for 24 h to promote excellent effects of the heat conduction fillers and the reinforcement fillers.

Description

technical field [0001] The invention relates to the technical field of thermally conductive silica gel, in particular to a high thermal conductivity silica gel gasket and a preparation method thereof. Background technique [0002] With the development of large-scale integrated circuits and microelectronics technology, the assembly density of components in the circuit is getting higher and higher, and the volume is shrinking. The heat dissipation of components has become a prominent problem. The reliability and performance of electronic components are very important. The degree depends on the heat dissipation material used, so the demand for materials that can not only play a sealing role but also have high thermal conductivity is increasing. Gaskets, etc., among which thermally conductive silica gel is the most popular thermally conductive material, but the current ordinary thermally conductive silica gel sheets generally use spherical alumina fillers to improve the therma...

AI Technical Summary

Problems solved by technology

[0003] Purpose of the invention: the technical problem of low thermal conductivity and poor comprehensive performance of the silica gel sheet material to be solved by the present invention, the present invention provides a high thermal conductivity silica gel gasket and its preparation method