Organosilicone pressure sensitive adhesive and preparation method thereof, composite film structure, vibrating diaphragm and sound generating device

A silicone-based, silicone-rubber technology, applied in the direction of films/sheets without carriers, adhesives, film/sheet-like adhesives, etc. Problems such as poor sound quality and listening stability of the device

Pending Publication Date: 2018-11-09
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the acrylic pressure-sensitive adhesive contains polar groups such as ester groups, the high temperature resistance of the damping adhesive layer is poor. When the input voltage increases, the rigidity and damping performance of the damping adhesive layer decrease, resulting in Polarization occurs during vibration, which leads to poor sound quality and listening stability of the sound generator

Method used

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  • Organosilicone pressure sensitive adhesive and preparation method thereof, composite film structure, vibrating diaphragm and sound generating device
  • Organosilicone pressure sensitive adhesive and preparation method thereof, composite film structure, vibrating diaphragm and sound generating device
  • Organosilicone pressure sensitive adhesive and preparation method thereof, composite film structure, vibrating diaphragm and sound generating device

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preparation example Construction

[0085] The present invention also provides a preparation method of silicone pressure-sensitive adhesive, comprising the following steps:

[0086] Mixing 20-80 parts of silicone resin, 5-55 parts of silicone rubber, and 30-90 parts of organic solvent in parts by weight to obtain a mixture;

[0087] providing 0.1 to 5 parts of the catalyst, adding the catalyst to the mixture, and heat-treating the mixture added with the catalyst to obtain a colloid; and

[0088] Dry the colloid to obtain a silicone pressure-sensitive adhesive.

[0089] In an embodiment of the present invention, the silicone rubber is methylhydroxy silicone rubber, vinyl silicone rubber, or phenyl silicone rubber.

[0090] The organic solvent is at least one of benzene, toluene, ethyl acetate, xylene, N-methylpyrrolidone and butanone. Silicone resin and silicone rubber can be dissolved in this organic solvent for uniform mixing.

[0091] The catalyst is an organic complex of platinum or an organic tin compound...

Embodiment 1

[0150] In parts by weight, 5 parts of methylhydroxy silicone rubber, 20 parts of silicone resin, and 30 parts of benzene are provided, and the methylhydroxy silicone rubber and the silicone resin are dissolved in benzene to obtain a mixture. Among them, the mass ratio of methyl hydroxy silicone rubber to silicone resin is 1:4, the quantity ratio of M chain link and Q chain link in silicone resin is 1:0.7, R 1 is a methyl group, and the range of m is 15.

[0151] Provide 0.1 part of isopropanol complex of chloroplatinic acid, add the isopropanol complex of chloroplatinic acid into the mixture, and heat-treat the mixture added with the isopropanol complex of chloroplatinic acid to obtain a colloid. The temperature of the heat treatment is 80° C., and the time is 70 minutes. The isopropanol complex of chloroplatinic acid is used as a catalyst to promote the condensation reaction between the methylhydroxy silicone rubber and the silicone resin.

[0152] After the colloid is coole...

Embodiment 2

[0156] In parts by weight, 15 parts of methylhydroxy silicone rubber, 30 parts of silicone resin, and 54 parts of toluene were provided, and the methylhydroxy silicone rubber and the silicone resin were dissolved in toluene to obtain a mixture. Among them, the mass ratio of methyl hydroxy silicone rubber to silicone resin is 1:2, the quantity ratio of M chain link and Q chain link in silicone resin is 1:0.75, R 1 is a hydrogen group, and the range of m is 17.

[0157] Provide 0.5 parts of dibutyltin dilaurate, add dibutyltin dilaurate to the mixture, and heat-treat the mixture with dibutyltin dilaurate to obtain a colloid. Wherein, the temperature of the heat treatment is 90° C., and the time is 50 minutes. Dibutyltin dilaurate is used as a catalyst to promote the condensation reaction between the methylhydroxy silicone rubber and the silicone resin.

[0158] After the colloid is cooled, provide 0.5 parts of benzoyl peroxide, add benzoyl peroxide to the colloid, and stir even...

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Abstract

The invention provides an organosilicone pressure sensitive adhesive and a preparation method thereof, a composite film structure using the organosilicone pressure sensitive adhesive, a vibrating diaphragm using the composite film structure and a sound generating device using the vibrating diaphragm. The organosilicone pressure sensitive adhesive is prepared from 20~80 parts of organosilicone resin, 0.1~5 parts of catalyst, 30~90 parts of organic solvent, and 5~55 parts of organosilicone rubber. The vibrating diaphragm using the organosilicone pressure sensitive adhesive provided by the invention has better high temperature resistance, so that the vibrating diaphragm does not have a polarization phenomenon in vibration, thus allowing the sound generating device prepared from the vibratingdiaphragm to have better sound quality and sound stability.

Description

technical field [0001] The present invention relates to the technical field of sounding devices, in particular to an organosilicon pressure-sensitive adhesive, a method for preparing the organosilicon pressure-sensitive adhesive, a composite film structure using the organosilicon pressure-sensitive adhesive, and a vibrator using the composite film structure. Membrane, and sounding device using the diaphragm. Background technique [0002] The diaphragm is the core component of the sound generating device. Acrylic pressure-sensitive adhesive has better damping performance. In order to make the diaphragm have better damping performance, acrylic pressure-sensitive adhesive is usually used to make the damping adhesive layer of the diaphragm. However, since the acrylic pressure-sensitive adhesive contains polar groups such as ester groups, the high temperature resistance of the damping adhesive layer is poor. When the input voltage increases, the rigidity and damping performance ...

Claims

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Application Information

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IPC IPC(8): C09J183/04C09J7/10C09J7/30H04R9/02
CPCC08L2205/025C09J7/10C09J7/30C09J183/04H04R9/02C08L83/04
Inventor 王婷李春刘春发
Owner GOERTEK INC
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