Cantilever type end face coupler

Abstract

The invention discloses a cantilever type end face coupler. The cantilever type end face coupler comprises a silicon substrate, a buried oxide layer, a silicon waveguide and a silicon nitride waveguide; a groove having the first pre-set height is etched on the silicon substrate; the buried oxide layer is formed on the upper surface of the silicon substrate; the buried oxide layer comprises a flatplate layer and a ridge type layer; the flat plate layer is formed on the upper surface of the silicon substrate; the ridge type layer is formed on the upper surface of the flat plate layer, and horizontally extends out of the flat plate layer; the silicon waveguide is formed in the buried oxide layer, and positioned over the ridge type layer; and the silicon nitride waveguide is formed in the buried oxide layer, and positioned over the silicon waveguide. The cantilever type end face coupler in the invention has the benefits that: the ridge type buried oxide layer is adopted; the end face coupler matched with the light-field speckle of a single-mode optical fibre is realized; the flat plate layer is used as the support structure of the cantilever type end face coupler; the mechanical stability is ensured; the flat plate layer serves as the index-matching fluid; the dependence of the cantilever type end face coupler on the index-matching fluid is reduced; the silicon nitride waveguide is used as the intermediate transition layer; and thus, the light field of the single-mode optical fibre can enter the silicon waveguide with the relatively high coupling efficiency.

Description

technical field [0001] The invention relates to the technical field of optical devices, in particular to a cantilever type end face coupler. Background technique [0002] Silicon photonics technology uses silicon as the optical medium, and uses CMOS (Complementary Metal Oxide Semiconductor, English full name Complementary Metal Oxide Semiconductor) technology to develop and integrate optical devices. It is expected to realize low-cost, high-speed optical communication and has broad market application prospects. How to efficiently realize the interconnection between the optical signal on the optical chip and the external optical signal has become one of the key technologies in silicon photonics technology. The mode spot size of the silicon-based single-mode waveguide is 0.4-0.5um, while the mode spot size of the single-mode fiber is 9-10um. There is a large mode spot size mismatch and effective refractive index mismatch between the two. If the optical signal is directly inpu...

AI Technical Summary

Problems solved by technology

In response to this problem, a variety of end face couplers have been proposed in the world to achieve larger mold spot sizes, mainly including cantilever beam structures, coated polymer structures, three-dimensional wedge structures, etc., but these couplers are complicated to process. The preparation process of its corresponding structure is not compatible with the CMOS process, which is not conducive to large-scale promotion and application

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