Resin composition and product thereof

By using materials such as maleimide, diaminodiphenyl ether type benzoxazine and high thermal decomposition temperature flame retardant in the resin composition, the resin composition of the copper clad laminate is optimized, and the heat resistance problem in the existing technology is solved. And the problem of insufficient dielectric loss is achieved, the effect of high copper foil tension and low dielectric loss is achieved, and the performance requirements of high-frequency circuit boards are met.

Active Publication Date: 2018-12-25
ELITE ELECTRONIC MATERIAL (KUNSHAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, the prior art discloses a benzoxazine / bismaleimide / epoxy resin / flame retardant system, although this system solves the problems of heat resistance, heat and humidity resistance and flame retardancy to a certain extent, but , the system still needs to further improve heat resistance, and there are still problems of high dielectric loss and poor tensile force on copper foil, which is difficult to meet market demand

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0088] Synthesis Example 1: Synthesis Example of Amine Modified Bismaleimide Prepolymer (BMI-A)

[0089] 5 grams of 4'4'-diaminodiphenyl sulfone, 65 grams of DMAc and 0.13 grams of triphenylphosphine catalyst were added to a three-necked flask and stirred until clear; then 60 grams of diphenylmethane bismaleimide was added, After stirring evenly, the solution was heated up to 90-100°C, and reacted at this temperature for 8 hours to stop the reaction, and quickly removed and cooled to room temperature to obtain a reddish-brown transparent liquid, which was amine-modified BMI-A.

Embodiment 1-19 and comparative example 1-17

[0091] 1. Use the resin compositions shown in Table 1 and Table 2 to prepare prepregs

[0092] Respectively, the resin compositions in Examples 1-19 and Comparative Examples 1-17 shown in Table 1 and Table 2 were mixed uniformly in the stirring tank respectively, and then respectively placed in the impregnation tank, and then the glass fiber cloth (the specification was 2116 or 7628 E-glass fiber fabric (E-glass fiber fabric, purchased from Asahi Company) was passed through the above-mentioned impregnation tank, so that the resin composition was attached to the glass fiber fabric, and heated and baked at 150° C. into a semi-cured state.

[0093] 2. Prepare copper-containing substrates and copper-free substrates as follows:

[0094] (1) Copper-containing substrate and copper-free substrate (five layers)

[0095] Prepare two high-temperature extended copper foils (HTE) with a thickness of 18 microns (0.5ounces) and the prepregs prepared above (each embodiment and comparative ex...

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PUM

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Abstract

The invention provides a resin composition and a product thereof. The resin composition comprises, by weight, 40-80 parts of maleimide monomer and / or resin, 10-30 parts of diaminodiphenyl ether type benzoxazine monomer and / or resin and 10-40 parts of flame retardant, wherein the flame retardant comprises one or more of a flame retardant with the thermal decomposition temperature being larger than380 DEG C, a hypophosphorous acid metal salt flame retardant and decabromodiphenyl ethane; the metal in the hypophosphorous acid metal salt flame retardant is selected from elements from the thirteenth group. By the arrangement, the resin composition has the advantages that the copper foil tensile force and glass-transition temperature of a substrate produced by the resin composition are evidentlyimproved while copper substrate dielectric loss is lowered, and the requirements of high-frequency and high-heat-resistance circuit boards are satisfied sufficiently.

Description

technical field [0001] The invention relates to the technical field of composite materials, in particular to a resin composition and its products. Background technique [0002] In recent years, with the diversification of electronic products and the continuous innovation of electronic science and technology, electronic products have become lighter and thinner, and electronic information transmission has increased in speed, and printed electronic circuits have developed in the direction of high multi-layer and high wiring density. This puts forward higher and higher requirements for the basic material for making circuit boards - copper clad laminates, which need to meet the thermal shock in the process of impedance design and processing in the process of printed circuit design. [0003] At present, the mainstream copper clad laminates on the market are mainly made of resin compositions with epoxy resin as the main resin, dicyandiamide or phenolic resin as the main curing agen...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): C08L79/08C08L61/34C08L63/04C08L63/00C08K5/5397C08K3/36C08K5/5313C08K5/03B32B17/02B32B27/12B32B27/28B32B27/36B32B15/18B32B17/10
CPCB32B5/02B32B15/18B32B17/10B32B27/12B32B27/281B32B27/36C08L79/08B32B2262/101B32B2457/08C08L2205/03C08L2205/035C08L2205/025C08L2201/08C08L2203/20C08L2201/02C08J5/249C08J5/244C08L61/34C08L63/04C08K5/5397C08K3/36C08L63/00C08K5/5313C08K5/03C08J2379/08C08L39/04C08K5/0066C08L2203/16C08K5/357C08K5/3437
OwnerELITE ELECTRONIC MATERIAL (KUNSHAN) CO LTD