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Modified epoxy resin and preparation and application thereof

A technology of epoxy resin modification, applied in the direction of epoxy resin glue, adhesive type, adhesive additive, etc., can solve the problems of photoinitiator being sensitive to oxygen, poor adhesion, etc., and achieve control of curing crosslinking time , fast curing, to ensure the effect of curing effect

Inactive Publication Date: 2019-01-04
GUANGZHOU BAIYUN CHEM IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, in the free radical photocuring system, there are problems such as photoinitiator sensitivity to oxygen, photocuring shrinkage, and poor adhesion.

Method used

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  • Modified epoxy resin and preparation and application thereof
  • Modified epoxy resin and preparation and application thereof
  • Modified epoxy resin and preparation and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Embodiment 1, the synthesis of mercapto polycinnamoyl ethyl methacrylate

[0047] The present embodiment provides a kind of polycinnamoyl ethyl methacrylate and its synthetic method, and the synthetic method comprises the following steps:

[0048] (1) Take 1 part of azobisisobutyronitrile initiator, 600 parts of hydroxyethyl methacrylate, 10 parts of benzyl dithiobenzoate, and 100 parts of methanol, and react at 80°C for 1 hour under nitrogen protection , to obtain poly(hydroxyethyl methacrylate) containing disulfide at the end of the polymer;

[0049](2) 100 parts of poly(hydroxyethyl methacrylate) containing disulfide at the end obtained in step (1), 300 parts of pyridine and 120 parts of cinnamoyl chloride were reacted at 25°C for 24 hours to obtain disulfide at the end Polyester cinnamoyl chloride ethyl methacrylate;

[0050] (3) Under the protection of nitrogen, mix 100 parts of the product obtained in step (2) (poly-cinnamoyl chloride ethyl methacrylate with a ...

example 2

[0053] Example 2, the synthesis of chemically modified epoxy resin

[0054] This embodiment provides a kind of chemically modified epoxy resin and its synthetic method, and this synthetic method comprises the following steps:

[0055] Get 100 parts of epoxy resin (select bisphenol A type epoxy resin, molecular weight 4000) and join in the reactor, add 30 parts of mercaptopoly-cinnamoyl chloride ethyl methacrylates (synthesized in embodiment 1) and 3 parts under nitrogen protection The tetrahydrofuran solution dissolved with LiOH was stirred at room temperature for 2 hours and then vacuum-dried to obtain a chemically modified epoxy resin, which was designated as chemically modified epoxy resin A. The mass of the LiOH is 0.1-1% of the total mass of the epoxy resin and the mercapto polyethyl cinnamoyl chloride methacrylate.

[0056] The chemically modified epoxy resin A obtained in this example has a viscosity between 4000 and 10000 cps.

example 3

[0057] Example 3, the synthesis of chemically modified epoxy resin (B)

[0058] This embodiment provides a kind of chemically modified epoxy resin and its synthetic method, and this synthetic method comprises the following steps:

[0059] Get 100 parts of epoxy resin (select bisphenol F type epoxy resin, molecular weight 6000) and join in the reactor, add 45 parts of mercaptopoly-cinnamoyl chloride ethyl methacrylates (synthesized in embodiment 1) and 7 parts under nitrogen protection dissolved in AlCl 3 THF solution, stirred at room temperature for 2.5 hours and then vacuum-dried to obtain a chemically modified epoxy resin, denoted as chemically modified epoxy resin B. AlCl 3 The mass is 0.1% to 1% of the total mass of epoxy resin and mercapto polyethyl cinnamoyl chloride methacrylate.

[0060] The chemically modified epoxy resin B obtained in this example has a viscosity between 8000-14000 cps.

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Abstract

The invention relates to a modified epoxy resin and preparation and application thereof. The structural general formula of the modified epoxy resin is shown in the description. The modified epoxy resin preparation method achieves the chemically modified epoxy resin, which is prepared from the suitable size epoxy resin modified by mercapto polymethacrylic acid cinnamoyl chloride ethyl ester or a mercapto polyacrylic acid cinnamoyl chloride ethyl ester with proper polymerization degree. When the curing adhensive is prepared from the modified epoxy resin, the cross-linking and curing under cross-linking adhensive system which is obtained does not need to depend on components such as photoinitiator and the like, but self-cured under room temperature and purple light; In addition, the time forcross-linking and curing can be well controlled through the adjustment to the size of mercaptopolymethacrylic acid cinnamoyl chloride ethyl ester or the mercapto polyacrylic acid cinnamoyl chloride ethyl ester, and truly realize the curing during a very short time. The modified epoxy resin can not only guarantee the curing effect but have good bonding strength as well.

Description

technical field [0001] The invention belongs to the field of polymer materials, in particular to a modified epoxy resin and its preparation and application. Background technique [0002] Epoxy resin has excellent thermal stability, formability, adhesion and corrosion resistance, and is very superior in terms of mechanics, heat, electricity and chemical resistance. It is precisely because of these functions and properties that epoxy resin can be used as coatings, adhesives and processing molding materials, and has been widely used in the fields of electronic appliances, optical machinery, civil engineering, engineering technology, and stationery. It is no exaggeration to say that the application fields of epoxy resin directly or indirectly cover almost all industrial fields. Due to the increasing market demand for epoxy resin year by year, the annual output of epoxy resin in my country is close to 2.6 million tons. Although the output is growing rapidly, the variety is sing...

Claims

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Application Information

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IPC IPC(8): C08G59/16C09J163/00C09J11/04C09J11/06C09J11/08
CPCC08G59/1483C08K2003/2227C08K2003/385C09J11/04C09J11/06C09J11/08C09J163/00C08L85/02C08K13/02C08K3/38C08K3/22C08K5/521
Inventor 宋骏梁锦宁陈建军黄恒超
Owner GUANGZHOU BAIYUN CHEM IND
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