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Method for synergistic recycling of waste circuit boards and waste catalysts from automobile exhaust

A technology for waste circuit boards and waste catalysts, applied in the field of industrial waste treatment and recycling, can solve the problems of low recovery rate, consumption of reagents, etc., and achieve the effect of clean treatment process, high degree of recycling, easy operation and realization

Active Publication Date: 2020-10-16
SHANGHAI JIAOTONG UNIV
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Problems solved by technology

Hydrometallurgy technology usually converts precious metals into water-soluble ions through the oxidation and complexation of chemical reagents in acidic or alkaline solutions, and then realizes the formation of metal elements through chemical precipitation, ion exchange, extraction, adsorption, etc. In the process of separation and extraction, these technologies have the problems of low recovery rate, consumption of a large amount of reagents and environmental protection treatment of waste liquid in the application process

Method used

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  • Method for synergistic recycling of waste circuit boards and waste catalysts from automobile exhaust

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Experimental program
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Effect test

Embodiment 1

[0032]Firstly, copper-enriched bodies are obtained by crushing, magnetic separation and high-voltage electrostatic separation of waste circuit boards. Then crush the waste catalyst of automobile exhaust gas to obtain waste catalyst powder. The two powders of the copper-enriched body and the spent catalyst are mixed to obtain a mixed powder. Based on the mixed powder, the reagents according to a certain formula include: 20% calcium oxide, 30% silicon dioxide, 10% borax, 8% sodium carbonate, 10% copper oxide and 5% coke powder. Then, the mixed powder was placed in a muffle furnace, the heating rate of the heating section was 10°C / min, the temperature was raised to 1300°C, and the temperature was kept for 0.5h. After the heat preservation was completed, the sample was taken out. Then the mixed powder sample shows obvious delamination phenomenon, the upper layer is a glass layer, and the lower layer is a copper layer, and the copper layer and the glass layer are separated. Take ...

Embodiment 2

[0034] Firstly, copper-enriched bodies are obtained by crushing, magnetic separation and high-voltage electrostatic separation of waste circuit boards. Then crush the waste catalyst of automobile exhaust gas to obtain waste catalyst powder. The two powders of the copper-enriched body and the spent catalyst are mixed to obtain a mixed powder. Based on the mixed powder, the reagents according to a certain formula include: 20% calcium oxide, 30% silicon dioxide, 10% borax, 8% sodium carbonate, 30% copper oxide and 5% coke powder. Then, the mixed powder was placed in a muffle furnace, the heating rate of the heating section was 10°C / min, the temperature was raised to 1300°C, and the temperature was kept for 2 hours. After the heat preservation was completed, the sample was taken out. Then the mixed powder sample shows obvious delamination phenomenon, the upper layer is a glass layer, and the lower layer is a copper layer, and the copper layer and the glass layer are separated. T...

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Abstract

The invention discloses a method for collaborative resource between a waste circuit board and an automobile tail gas waste catalyst. The method comprises the following steps: firstly, obtaining a copper-rich collective through performing crushing, magnetic separation and high voltage electrostatic separation on the waste circuit board; crushing the automobile tail gas waste catalyst to obtain waste catalyst powder; mixing the copper-rich collective and the waste catalyst powder to obtain mixed powder; adding a reagent in a certain amount of mixed powder in proportion, placing in a high-temperature muffle furnace for reaction and cooling to a room temperature after the completion of the reaction to obtain a product of which an upper layer is a glass layer, and a lower layer is a copper layer; separating the copper layer from the glass layer, taking out, crushing, then placing the glass layer in the muffle furnace for heat treatment; after the completion of the treatment, pouring microcrystalline glass liquid into a mold while the microcrystalline glass liquid is still hot, reducing the temperature and forming; after a room temperature is lowered, preparing out fluorescent microcrystalline glass. In the process, the recovery rate of precious metals exceeds 98 percent, the precious metals are enriched for 20 times or more, and the obtained fluorescent microcrystalline glass can betaken as an LED fluorescent lamp and other materials. To sum up, the method has the characteristics of being efficient, environmentally friendly and high in resource degree and is suitable for large-scale industrial application.

Description

technical field [0001] The invention relates to a method for synergistic recycling of waste circuit boards and waste automobile exhaust catalysts, which is an environmentally friendly and efficient method for comprehensively recycling circuit boards and waste automobile exhaust catalysts. The invention belongs to the field of industrial waste treatment and recycling in the technical field of environmental protection. Background technique [0002] With the continuous improvement of the economy and living standards, the problems of environmental and resource shortages have become increasingly prominent. In the process of realizing the sustainable development of our country, the recycling of waste resources has become an important issue. The "National Medium and Long-Term Science and Technology Development Plan (2006-2020)" proposed "strengthening the research on common technologies for the development of circular economy"; General Secretary Xi also pointed out that "garbage i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22B1/00C22B7/00C22B11/06C22B15/00C03C10/00C03C6/02
CPCC03C10/0063C22B1/005C22B7/001C22B7/006C22B11/046C22B11/048C22B11/06C22B15/0004C22B15/0028C22B15/0058Y02P10/20
Inventor 许振明张灵恩宋庆明
Owner SHANGHAI JIAOTONG UNIV
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