Copper alloy wire and preparation method thereof

A technology of copper alloy wire and copper alloy, which is applied in the field of alloys, can solve problems such as broken wires, poor drawability, and substandard drawability. The effect of conductivity

Inactive Publication Date: 2019-01-04
SHANGHAI UNIV OF ENG SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] For the copper alloy wires prepared by the methods (1) to (3) above, when the wire diameter is less than 0.1 mm, the conductivity loss is relatively large, the drawability is not up to the standard, and the problem of wire breakage occurs. It is difficult to obtain qualified high-strength and high-conductivity poles. fine copper alloy wire
[0008] When the wire diameter of the existing Cu-Sn single alloy is less than 0.1mm, the electrical conductivity is also greatly lost, and the drawability is poor, so it is impossible to obtain a qualified high-strength and high-conductivity ultra-fine copper alloy wire

Method used

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Experimental program
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Effect test

Embodiment 1

[0048] The copper alloy wire rod contains the following elements in mass percentage: 0.2% Sn, 0.05% Ti, 0.05% B, the balance is Cu, and the mass ratio of Sn / (Ti+B)=2:1.

[0049] (1) Weigh the tin block, copper-titanium master alloy, copper-boron master alloy and copper base material according to the mass percentage of Sn, Ti, B and Cu elements in the copper alloy wire (the Cu content is 99.999%).

[0050] (2) Place the weighed copper base material in a graphite crucible with an inert atmosphere (vacuum or nitrogen, argon and other inert atmospheres) for induction heating and melting. After the copper base material is melted, add the weighed tin block, copper titanium master alloy and copper-boron master alloy to form molten copper alloy liquid;

[0051] Lay a carbon powder layer with a thickness of 15mm on the surface of the copper alloy liquid. The carbon powder layer can effectively avoid the introduction of impurity elements such as hydrogen and oxygen in the ambient air. U...

Embodiment 2

[0056] The copper alloy wire rod contains the following elements in mass percentage: 0.2% Sn, 0.05% Ti, 0.05% B, the balance is Cu, and the mass ratio of Sn / (Ti+B)=2:1.

[0057] The preparation method of this embodiment is the same as that of Example 1, except that:

[0058] Step (4) The copper alloy wire blank is subjected to large drawing, medium drawing and small drawing in sequence to obtain a copper alloy wire rod with a wire diameter of 0.15mm. The process is as follows: large drawing at a drawing speed of 10m / s until the wire diameter is about 3mm , under the drawing speed of 10m / s, the wire diameter is about 1mm; after the middle drawing, before the small drawing, in the argon atmosphere, heat to 300 ℃ for 4 hours for bright annealing, the elongation of the alloy wire after annealing is 28 %; Finally, a copper alloy wire with a wire diameter of 0.15mm is drawn at a speed of 19m / s.

[0059] The content of hydrogen in the copper alloy wire prepared in this embodiment is...

Embodiment 3

[0061] Copper alloy wire rod, containing the following elements in mass percentage: 0.15% Sn, 0.02% Mg, 0.01% Si, 0.01% Ti, the balance is Cu, the mass ratio of Sn / (Mg+Si+Ti)≈3~4:1 .

[0062] (1) Weigh the tin block, copper-magnesium master alloy, copper-silicon master alloy, copper-titanium master alloy and copper base material according to the mass percentage of Sn, Mg, Si, Ti and Cu elements in the copper alloy wire (Cu content rate is 99.999%) %).

[0063] (2) Place the weighed copper base material in a graphite crucible with an inert atmosphere (vacuum or nitrogen, argon and other inert atmospheres) for induction heating and melting. After the copper base material is melted, add the weighed tin block, copper magnesium Master alloy, copper-silicon master alloy and copper-titanium master alloy to form molten copper alloy liquid;

[0064] Lay a carbon powder layer with a thickness of 15mm on the surface of the copper alloy liquid. The carbon powder layer can effectively av...

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Abstract

The invention belongs to the technical field of alloy and particularly relates to a copper alloy wire and a preparation method thereof. The copper alloy wire takes copper as a matrix, and the added elements are tin or tin and at least one of titanium, magnesium, silicon or boron. The preparation method comprises the following steps: preparing a copper alloy rod from copper alloy liquid through a leading rod, performing necking processing, performing recrystallization and heat treatment, sequentially performing big pull, medium pull and small pull and preparing the copper alloy wire. The copperalloy wire is easy to thin, high in tensile strength and high in electrical conductivity, and can meet demanding application in the fields of a coaxial wire, a wire for automobile lightweight and a wire for a minitype loudspeaker coil; and the application prospect has high expectability and the cost is low.

Description

technical field [0001] The invention belongs to the technical field of alloys, and in particular relates to a copper alloy wire and a preparation method thereof. The copper alloy wire can be used for coaxial cables, wires for microcoils, and wires for lightweight automobiles. Background technique [0002] With the popularization and miniaturization of electrical equipment, electronic equipment, and smart devices represented by mobile phones, the demand for automobiles is increasing, and the demand for thin wires with a wire diameter below 0.1mm is also increasing. Loudspeaker coils and automotive stranded wires are some of the more common applications for such wires. [0003] In recent years, the types of ultra-fine copper alloy wires mainly include high strength and low conductivity: Cu-Fe series; high strength, medium and high conductivity: Cu-Cr series, Cu-Co-P series, Cu-Ni series, Cu-Sn series , Cu-Mg system; high strength and high conductivity: Cu-Ag system, Cu-Cr-Zr ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/02C22C1/03C22F1/08C22F1/02
CPCC22C1/03C22C9/02C22F1/02C22F1/08
Inventor 周细应吴德振朱玉坤邱小小郝艳刘银杰
Owner SHANGHAI UNIV OF ENG SCI
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