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Preparation method of novel modified silicon resin high polymer piezoelectric material

A technology of piezoelectric materials and modified silicon, which is applied in the field of preparation of new modified silicon resin polymer piezoelectric materials, can solve the problems of poor quality of matrix interface, heavy burden, and affecting the comprehensive performance of piezoelectric materials, etc., to improve the comprehensive performance, increased interaction, less agglomeration effect

Inactive Publication Date: 2019-01-11
宁波高新区诠宝绶新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Most of the polymer piezoelectric materials prepared by the above patents and the prior art contain lead elements, which will bring a greater burden to replacement if used in large quantities; in addition, the nanoparticles contained therein are very easy to agglomerate, causing the matrix Poor interface quality affects the overall performance of piezoelectric materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A preparation method of a novel modified silicone resin polymer piezoelectric material, the preparation technical scheme is as follows:

[0020] According to the number of parts by mass, 50 parts of organosilicon-modified nano-barium titanate powder, 25 parts of methylphenyldiethoxysilane, 0.5 part of bistrimethylsilylamide lithium, 0.7 part of tri[ Bis(trimethylsilyl)amino]lanthanum, 0.03 parts of terbium triacetate hydrate, 0.06 parts of tris(2,2,6,6-tetramethyl-3,5-heptanedionate) yttrium, 85 parts of Add toluene and 25 parts of purified water into the reaction kettle, stir for 25 minutes; then add 1.5 parts of cation exchange resin, raise the temperature to 80°C, and react for 5 hours; complete the reaction, cool to room temperature, filter, then vacuumize, and reduce the temperature at 85°C Distill under pressure for 220min to completely remove water and toluene; then the obtained liquid and 0.3 parts of graphene sheets were ball milled and dispersed in a ball mill...

Embodiment 2

[0028] A preparation method of a novel modified silicone resin polymer piezoelectric material, the preparation technical scheme is as follows:

[0029] According to the number of parts by mass, 45 parts of organosilicon-modified nano-barium titanate powder, 20 parts of methylphenyldiethoxysilane, 0.1 part of bistrimethylsilylamide lithium, 0.1 part of tri[ Bis(trimethylsilyl)amino]lanthanum, 0.01 parts of terbium triacetate hydrate, 0.01 parts of tris(2,2,6,6-tetramethyl-3,5-heptanedionate) yttrium, 80 parts of Add toluene and 20 parts of purified water into the reaction kettle and stir for 20 minutes; then add 1.2 parts of cation exchange resin, raise the temperature to 70°C, and react for 3 hours; after the reaction is completed, cool to room temperature, filter, then vacuumize, and reduce the temperature at 80°C. Distill under pressure for 180min to completely remove water and toluene; then the obtained liquid and 0.1 part of graphene sheets were ball milled and dispersed i...

Embodiment 3

[0037] A preparation method of a novel modified silicone resin polymer piezoelectric material, the preparation technical scheme is as follows:

[0038] According to the number of parts by mass, 55 parts of organosilicon-modified nano barium titanate powder, 30 parts of methylphenyldiethoxysilane, 0.9 part of bistrimethylsilylamide lithium, 0.9 part of tri[ Bis(trimethylsilyl)amino]lanthanum, 0.1 part of terbium triacetate hydrate, 0.1 part of tris(2,2,6,6-tetramethyl-3,5-heptanedionate) yttrium, 90 parts of Add toluene and 30 parts of purified water into the reaction kettle, stir for 30 minutes; then add 1.8 parts of cation exchange resin, raise the temperature to 85°C, and react for 8 hours; complete the reaction, cool to room temperature, filter, then vacuumize, and reduce the temperature at 90°C Distill under pressure for 240min to completely remove water and toluene; then the obtained liquid and 0.5 part of graphene sheets were ball milled and dispersed in a ball mill for ...

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PUM

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Abstract

The invention relates to the field of preparation of novel materials and in particular relates to a preparation method of a novel modified silicon resin high polymer piezoelectric material. Accordingto the preparation method of the novel modified silicon resin high polymer piezoelectric material, disclosed by the invention, the prepared piezoelectric material is free of a lead element; a condensation effect between surface hydroxyl of organic silicon modified nanoparticles and hydrolysis hydroxyl of an organic silicon monomer is utilized to anchor the nanoparticles on a molecular chain section of an organic silicon polymer, so that a mutual effect between the nanoparticles and the polymer is increased; and the nanoparticles of the prepared piezoelectric material are not easy to agglomerate and the comprehensive performance of the piezoelectric material is improved.

Description

technical field [0001] The invention relates to the field of material preparation, in particular to a preparation method of a novel modified silicone resin polymer piezoelectric material. Background technique [0002] Traditional piezoelectric ceramic crystal materials such as PbTiO 3 、BaTiO 3 , Pb(ZrxTi1-x)O 3 With outstanding piezoelectric properties, it is widely used in underwater acoustic, ultrasonic, electroacoustic transducers and oscillators, filters and sensors based on piezoelectric equivalent circuits. In order to overcome the shortcomings of the above-mentioned inorganic piezoelectric materials, expand the piezoelectric In the application field of electrical materials, polymer piezoelectric composite materials have been studied. [0003] 201710138736.9 discloses a piezoelectric material suitable for high temperature environment and its preparation method, which is characterized by having LiGeSiO 5 The combined type, the highest Curie temperature is 500-600 ℃...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08L83/05C08K9/06C08K3/24C08K7/00C08K3/04C08K13/06
CPCC08K2201/011C08L83/04C08L2205/025C08K9/06C08K3/24C08K7/00C08K3/042C08K13/06
Inventor 王大可王金霞
Owner 宁波高新区诠宝绶新材料科技有限公司