Infrared cut film and production method thereof
An infrared cut-off film and product technology, applied in the optical field, can solve problems such as complex structure, single product structure, poor long-term use stability, etc., achieve long product life, solve function failure, reduce processing difficulty and production cost.
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[0030] The invention provides a preparation method of an infrared cut-off film, comprising the following steps:
[0031] S1: Use the magnetron sputtering method to coat the infrared cut-off film on the substrate, and control the vacuum degree of the magnetron sputtering body to - 6 mbar; and when the types of coating materials are greater than or equal to two, the isolation coefficient of two adjacent different process atmospheres is >20. Wherein, the infrared cut-off film includes a functional layer, a dielectric layer and a protective layer; wherein, the functional layer is selected from a transparent conductive oxide film material, and is preferably zinc aluminum oxide and / or indium tin oxide; the substrate is selected from a glass substrate.
[0032] S2: Tempering the coated base material to finally obtain an infrared cut-off film.
[0033] The following will be described in conjunction with specific embodiments.
Embodiment 1
[0035] This embodiment provides a method for preparing an infrared cut-off film with zinc-aluminum oxide as a functional layer, comprising the following steps:
[0036] S101: Use the magnetron sputtering method to sequentially plate a silicon nitride layer, a nickel-chromium layer, a zinc-aluminum oxide layer, a nickel-chromium layer, a silicon nitride layer and a titanium oxide layer on the substrate, and control the bulk vacuum of the magnetron sputtering degree-6mbar; and when the types of coating materials are greater than or equal to two, the isolation coefficient of two adjacent different process atmospheres is >20; glass substrate, silicon nitride layer, nickel-chromium layer, zinc-aluminum oxide layer, nickel-chromium layer, nitrogen The thickness ratio of silicon oxide layer and titanium oxide layer is 6mm: (60-70) nm: (4-5) nm: (370-400) nm: (4-5) nm: (150-180) nm: (28~35)nm.
[0037] Among them, when the silicon nitride layer is plated, the working atmosphere of th...
Embodiment 2
[0043] This embodiment provides a method for preparing an infrared cut-off film with indium tin oxide as a functional layer, comprising the following steps:
[0044] S101: Use the magnetron sputtering method to sequentially plate a silicon nitride layer, a nickel-chromium layer, a zinc-aluminum oxide layer, a nickel-chromium layer, a silicon nitride layer and a titanium oxide layer on the substrate, and control the bulk vacuum of the magnetron sputtering degree-6 mbar; and when the type of coating material is greater than or equal to two, the isolation coefficient of two adjacent different process atmospheres is >20; glass substrate, silicon nitride layer, silicon oxide layer, indium tin oxide layer, silicon oxide layer and nitrogen The thickness ratio of the SiO layer is 6 mm: (40-60) nm: (30-50) nm: (130-150) nm: (30-50) nm: (40-60) nm.
[0045] Among them, when the silicon nitride layer is plated, the working atmosphere of the sputtering cathode is 4~5×10 -3 mbar, the proc...
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